conga-HPC/cRX1: COM-HPC Client（AMD Ryzen AI Embedded X100）データシート

AMD RYZEN AI EMBEDDED X100 Series conga-HPC/cRX1 AMD Zen5 CPU Cores AMD Radeon RDNA 3.5 Graphics AMD XDNA 2 NPU TDP Range from 45W to 120W Onboard PCIe Switch (option) Form Factor COM-HPC Client Size C | Client Connector Pinout CPUs AMD Ryzen AI Embedded X100 Series Processors DRAM Up to 128GB 256-bit LPDDR5x-8533 Mass Storage NVMe SSD up to 512 GB capacity (assembly option) Graphics Integrated AMD Radeon RDNA 3.5 Graphics with up to 40x CUs (Compute Units) AI Acceleration Integrated XDNA 2 NPU with up to 50 TOPs Display Up to 3x DDI | 1x eDP | Up to 4x independent displays Ethernet 2x 2.5 GbE via Intel® i226 Ethernet controller series I/O Interfaces Up to 4x USB 3.2 Gen2 | Up to 8x USB 2.0 | 2x SATA 6Gb/s (assembly option) | Up to 24x PCIe Gen4 (assembly option) | 2x I²C Bus | 2x UART | 12x GPIO | 1x SMBus | 1x GPSPI Audio HDA interface congatec Board Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics controller I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Linux Hypervisor conga-zones (formerly known as RTS Hypervisor) Temperature Commercial Temp.: Operating 0°C to 60°C Commercial Temp.: Storage -20°C to 80°C Industrial Temp.: Operating -40°C to +85°C Industrial Temp.: Storage -40°C to 85°C Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond. Size 120 x 160 mm www.congatec.com

conga-HPC/cRX1 | Block Diagram LPDDR5x congatec AMD Ryzen AI Embedded X100 Series Board Controller NVMe SSD (opt.) PCIe PCIe- switch SATA USB Hub (opt.) (opt.) COM-HPC Client Type Connectors Assembly option – only available on request PCIe 0 - 3 PCIe 4 PCIe 5 PCIe 6 opt PCIe 7 opt PCIe 8-11 PCIe 12-15 PCIe 16 - 19 PCIe 20-23 NBASE-T 0 i226 NBASE-T 1 i226 SATA 0 opt. SATA opt.1 USB2.0 0, 3-7 USB 3.2 0 USB2.0 1-2 USB 3.2 1 USB 3.2 2 USB 3.2 3 DDI 0 DDI 1 DDI 2 eDP HDA GP-SPI SM Bus FAN Control GPIO 0-11 I2C USB PD I2C UART0 UART1

conga-HPC/cRX1 | Order Information Article PN Description COM-HPC Size C module based on AMD Ryzen AI Embedded X199 processor with 16 Zen5 conga-HPC/cRX1-X199-128G 053700 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 40 CUs | 128GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Commercial grade temperature range from 0°C to +60°C. COM-HPC Size C module based on AMD Ryzen AI Embedded X188 processor with 12 Zen5 conga-HPC/cRX1-X188-64G 053701 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 64GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Commercial grade temperature range from 0°C to +60°C. COM-HPC Size C module based on AMD Ryzen AI Embedded X168 processor with 8 Zen5 conga-HPC/cRX1-X168-32G 053702 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 32GB LPDDR5x onboard memory | 32MB L3 Cache | Scalable TDP from 45W up to 120W | Commercial grade temperature range from 0°C to +60°C. COM-HPC Size C module based on AMD Ryzen AI Embedded X199i processor with 16 Zen5 conga-HPC/cRX1-X199i-128G 053710 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 40 CUs | 128GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Industrial grade temperature range from -40°C to +85°C. COM-HPC Size C module based on AMD Ryzen AI Embedded X188i processor with 12 Zen5 conga-HPC/cRX1-X188i-64G 053711 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 64GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Industrial grade temperature range from -40°C to +85°C. COM-HPC Size C module based on AMD Ryzen AI Embedded X168i processor with 8 Zen5 conga-HPC/cRX1-X168i-32G 053712 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 32GB LPDDR5x onboard memory | 32MB L3 Cache | Scalable TDP from 45W up to 120W | Industrial grade temperature range from -40°C to +85°C. conga-HPC/cRX1-CSA-HP-B 053750 Standard active cooling solution for COM-HPC module conga-HPC/cRX1 with integrated heat pipes, overall height 40mm and integrated 12V fan. Standoffs are with 2.7mm borehole. conga-HPC/cRX1-CSA-HP-T 053751 Standard active cooling solution for COM-HPC module conga-HPC/cRX1 with integrated heat pipes, overall height 40mm and integrated 12V fan. Standoffs are M2.5mm threaded. conga-HPC/cRX1-HSP-HP-B 053754 Standard heatspreader for COM-HPC module conga-HPC/cRX1 with integrated heat pipes and 13mm height. Standoffs are with 2.7mm borehole. conga-HPC/cRX1-HSP-HP-T 053755 Standard heatspreader for COM-HPC module conga-HPC/cRX1 with integrated heat pipes and 13mm height. Standoffs are M2.5mm threaded. conga-HPC/EVAL-Client 065600 Evaluation Carrier Board for COM-HPC Client type Modules. conga-HPC/uATX-Client 065620 COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C. © 2026 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Preliminary Revision 0.3 – July 08th, 2026 www.congatec.com