conga-TC300: COM Express Type 6 Compact（インテル Core Series 3）データシート

Intel® Core Processors Series 3 conga-TC300 Intel® performance hybrid architecture supporting up to 6 CPU cores Latest Xe3 GPU architecture with XMX systolic arrays Variants with Integrated NPU 5.0 with up to 18 TOPS for dedicated, low power AI inferencing Options with PCIe switch for additional PCIe lanes Form factor COM Express® Compact | Type 6 connector pinout CPUs Intel® Core Processors (Series 3) Wildcat Lake DRAM SO-DIMM socket for DDR5 memory modules up to 64 GB | up to 6400 MT/s Mass Storage UFS 3.1 (optional) Graphics Intel Xe 3 Graphics | Up to 18 TOPS Intel® XMX Matrix Engines AI Acceleration Integrated NPU 5.0 with up to 18 TOPS (only on selected product variants) Display Up to 2x DDI (shared with USB4) | LVDS or eDP Ethernet 2.5 GbE via Intel® i226 Ethernet controller series | Supporting TSN – Time Sensitive Networking (only on selected product variants) I/O Interfaces 4x PCIe Gen4 | additional 4x PCIe Gen3 (optional via PCIe switch) | up to 2x USB4 (dedicated BIOS required) | 4x USB 3.2 (incl. USB 2.0) + 4x USB 2.0 | 2x SATA | 2x UART | GPIOs | GP SPI | LPC or eSPI (optional) | SM Bus | I2C or I3C (optional) Audio HDA | Soundwire (optional) congatec Board controller Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 11 | Linux | Ubuntu Hypervisor conga-zones Temperature Range Operating 0°C to 60°C Storage -20°C to 80°C Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond. Size 95 x 95 mm www.congatec.com

conga-TC300 |Block Diagram Assembly option UFS 3.1 Single Channel up to DDR5 6400 MT/s Intel® Core UFS COM Express SO-DIMM (Series 3) 2x 220 pos Connector Type 6 “Wildcat Lake” eDP eDP to LVDS DDI MUX Bridge MUX eDP / LVDS TCP 0 DDI 1 / shared with USB4 Port 1 *) TCP 1 DDI 2 / shared with USB4 Port 2 *) USB 2.0 x8 USB 2.0 Port 0-7 USB 3.2_1 USB 3.2 Port 0 USB 3.2 Hub USB 3.2 Port 2 USB 3.2 Port 3 USB 3.2_2 USB 3.2 Port 1 PCIe PCIe Port 0 PCIe PCIe Port 1 PCIe PCIe Port 2 PCIe PCIe Port 3 PCIe PCIe to MUX SATA 0 SATA MUX SATA 1 SATA 2 Assembly option SATA 3 PCIe Port 4 PCIe 3.0 PCIe Port 5 switch PCIe Port 6 PCIe Port 7 PCIe I226 Ethernet 2.5 GbE/TSN HDA/SNDW LV HDA or SNDW (optional) I3C Bus (optional) I2C SM Bus SM Bus GP SPI MGMNT GPIO congatec LID#/SLEEP# FAN Control Board UART0 Controller UART1 6th Gen. Flash Assembly option eSPI to LPC eSPI ECE1200 LPC or eSPI (Assembly option) FSPI SPI TPM 2.0 Flash NOTES *) Support of USB4 requires a separate BIOS = Assembly option Only available on request www.congatec.com

conga-TC300 | Modules Order Information Article PN Description COM Express Type 6 Compact module based on Intel® Core 7 350 processor with 2 P-cores and 4 LPE-cores | Integrated NPU | 6MB Intel® Smart Cache (L3) | Intel® Graphics with 32 conga-TC300/7-350 052301 Execution Units | Single channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 64 GB memory capacity | Commercial grade temperature range from 0°C to 60°C | Intel code name Wildcat Lake COM Express Type 6 Compact module based on Intel® Core 5 320 processor with 2 P-cores and 4 LPE-cores | Integrated NPU | 6MB Intel® Smart Cache (L3) | Intel® Graphics with 32 conga-TC300/5-320 052302 Execution Units | Single channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 64 GB memory capacity | Commercial grade temperature range from 0°C to 60°C | Intel code name Wildcat Lake COM Express Type 6 Compact module based on Intel® Core 3 305 processor with 2 P-cores and 4 LPE-cores | 6MB Intel® Smart Cache (L3) | Intel® Graphics with 16 Execution Units | Single conga-TC300/3-305 052303 channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 64 GB memory capacity | Commercial grade temperature range from 0°C to 60°C | Intel code name Wildcat Lake www.congatec.com

conga-TC300 | A ccessories Order Information Article PN Description conga-TC300/CSP-B 052350 Standard passive cooling solution for COM Express module conga-TC300. All standoffs are with 2.7mm bore hole. conga-TC300/CSP-T 052351 Standard passive cooling solution for COM Express module conga-TC300. All standoffs are M2.5mm threaded. conga-TC300/HSP-B 052352 Standard heatspreader for COM Express module conga-TC300. All standoffs are with 2.7mm bore hole. conga-TC300/HSP-T 052353 Standard heatspreader for COM Express module conga-TC300. All standoffs are M2.5mm threaded. conga-TEVAL/COMe 3.1 065820 Evaluation carrier board for COM Express Type 6 revision 3.1 modules. © 2026 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is carefully All rights reserved. checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet in mass production and subject to change. Revision 0.7 – 2026-April-16 www.congatec.com