1/3ページ
ダウンロード(408Kb)
インテル Core プロセッサー(Series 2)(コードネーム: Bartlett Lake)搭載 COM-HPC Client Size C モジュール
【conga-HPC/cBLS】は、インテル Core プロセッサー(Series 2) (コードネーム: Bartlett Lake)を搭載した COM-HPC Client Size C(120x160 mm)モジュールです。パフォーマンス ハイブリッドアーキテクチャーをベースとしたプロセッサーは3種類から選択でき、最大16個の高効率コア(E-core)と最大8個のパフォーマンスコア(P-core)を備え、最大で32スレッドに対応します。4つの SO-DIMM ソケットにより最大 128GB のDDR5 RAM(最高 4,000 MT/s 、ECCはオプション)を実装することがでます。16レーンのPCIe Gen 5 と最大 12レーンの PCIe Gen 4 を含む、最大42の PCIe レーンを提供し、最大32の実行ユニットを備えた内蔵グラフィックスにより、AI エッジアプリケーションで優れた AI推論パフォーマンスを実現します。ctrlX OS や Ubuntu、RT-Linux などライセンスの付随するオペレーティング システムをプリインストールし、アプリケーションレディの aReady.COM製品としても提供することができます。ターゲット アプリケーションは、メディカル イメージングや試験&計測、テレコミュニケーションおよびネットワーク、小売業、エネルギー分野、銀行業務、交通をモニターする監視カメラや、光学検査などの自動化アプリケーションなどです。
このカタログについて
ドキュメント名 | COM-HPC Client Size C: conga-HPC/cBLS データシート |
---|---|
ドキュメント種別 | 製品カタログ |
ファイルサイズ | 408Kb |
登録カテゴリ | |
取り扱い企業 | コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧) |
この企業の関連カタログ

このカタログの内容
Page1
Folie 1
conga-HPC/cBLS
Intel® hybrid design combines Performance-cores with
Efficient–cores
Up to Intel® UHD Graphics 770 driven by Xe Architecture
PCI Express Gen 4 and 5 | USB 3.2 Gen 2x2
AI Acceleration based on Intel® Deep Learning Boost
(VNNI)
Form factor COM-HPC Client Size C | Client Connector Pinout
CPUs Intel® Core™ processor (Series 2) – formerly codenamed: Bartlett Lake S
Processor Socket FCLGA 1700
Chipset R680E | Q670E
DRAM 4 SO-DIMM sockets for DDR5 memory modules up to 32 GByte each | max. 128 GByte RAM system capacity |
up to 4.000 MT/s | ECC Support on selected product variants
Graphics Up to Intel® UHD Graphics 770 driven by Xe Architecture | up to 32 EU
Display 3x DDI | eDP
Ethernet 2x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series
I/O Interfaces 1x16 PCIe Gen 5 (PEG port) | 3x4 PCIe Gen 4 | up to 3x4 PCIe Gen 3 | 1x2 PCIe Gen3 | 4x USB 3.2 Gen2x2 (including 4x
USB 2.0) + 4x USB2.0 | 2x SATA | 2x UART | 12x GPIO
Audio High-Definition Audio
congatec Board controller Multi-Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
redirection
Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS
default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update
Security Trusted Platform Module (TPM 2.0)
Power Management ACPI 5.0a with battery support
Operating Systems Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 10 | Microsoft® Windows 10
IoT Enterprise | Linux | Yocto
Hypervisor RTS Real-Time Hypervisor
Temperature Range Operation: 0°C to 60°C Storage.: -20°C to 80°C
Humidity Operation: 10% to 85% r. H. non cond. Storage. 5% to 85% r. H. non cond.
Size 120 x 160 mm
www.congatec.com
Page2
Folie 2
conga-HPC/cBLS
SSOO-D-DIMIMMM * SSOO Dual Channel
-D-DIMIMMM *
DDR5
congatec
Intel® PCH-S 600 Series Chipset Intel® Core™ Board
Series 2 Controller
Bartlett Lake S
COM-HPC Client Type Connectors
conga-HPC/cBLS
* Note:
The two bottom-side SO-DIMM connectors
require implementation of 10 mm COM-HPC®
carrier connector height stack option.
Ensure that carrier components do not collide
with the module's bottom-side SO-DIMM
connectors, including during assembly.
www.congatec.com
PCIe 0-3
PCIe 4-7
PCIe 8-11
PCIe 12-15
PCIe 16-31
PCIe 32-35
PCIe 36-37
PCIe 40-43 Only available on
selected product variants
SATA 0
SATA 1
2.5 GbE i226/TSN
2.5 GbE i226/TSN
USB2 0-7
USB3.2 0-3
Bottom-Side SO-DIMM
Connectors * DDI 0
DDI 1
DDI 2
eDP
HDA
TPM 2.0 SPI Flash
eSPI
Boot SPI
SM Bus
G SPI
UART 0
UART 1
GPIO 0-11
I2C 0-1
Lid# Sleep#
FAN Contr
Page3
Folie 3
conga-HPC/cBLS
Article PN Description
COM-HPC Client module based on Intel® Core™ 7-251E LGA 1700 processor with 8
P-cores 2.1GHz up to 5.6GHz Turbo and 16 E-cores 1.6GHz up to 4.4 GHz Turbo |
conga-HPC/cBLS-7-251E 049820 36MB Intel® Smart Cache | Intel® UHD Graphics 770 with 32EUs | Dual channel DDR5
memory interface | Chipset R680E | Intel® code name: Bartlett Lake S
COM-HPC Client module based on Intel® Core™ 5-211E LGA 1700 processor with 6 P-
cores 2.7GHz up to 4.9GHz Turbo and 4 E-cores 2.0GHz up to 3.7GHz Turbo | 20MB
conga-HPC/cBLS-5-211E 049821 Intel® Smart Cache | Intel® UHD Graphics 770 with 24EUs | Dual channel DDR5
memory interface | Chipset R680E | Intel® code name: Bartlett Lake S
COM-HPC Client module based on Intel® Core™ 3-201E LGA 1700 processor with 4
P-cores 3.6GHz up to 4.8GHz Turbo | 12MB Intel® Smart Cache | Intel® UHD Graphics
conga-HPC/cBLS-3-201E 049822 730 with 24EUs | Dual channel DDR5 memory interface | Chipset Q670E | Intel® code
name: Bartlett Lake S
Standard active cooling solution for COM-HPC module conga-HPC/cRLS with
conga-HPC/cRLS-CSA-HP-B 049650 integrated heat pipes, 30mm overall height and two integrated 12V fans. All
standoffs are with 2.7mm bore hole.
Standard active cooling solution for COM-HPC module conga-HPC/cRLS with
conga-HPC/cRLS-CSA-HP-T 049651 integrated heat pipes, 30mm height and two integrated 12V fans. All standoffs are
M2.5mm threaded.
Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat
conga-HPC/cRLS-HSP-HP-B 049652 pipes, 13mm height. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat
conga-HPC/cRLS-HSP-HP-T 049653 pipes, 13mm height. All standoffs are M2.5mm threaded.
conga-HPC/cRLS-HPA 049654 Standard heatpipe adapter for COM-HPC module conga-HPC/cRLS.
conga-HPC/EVAL-Client 065600 Evaluation Carrier Board for COM-HPC Client type Modules.
COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC
conga-HPC/uATX-Client 065620 modules with Size A,B and C.
DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM,
DDR5-SODIMM-4800 (8GB) 068901 commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM,
DDR5-SODIMM-4800 (16GB) 068902 commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM,
DDR5-SODIMM-4800 (32GB) 068903 commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM with ECC,
DDR5-SODIMM-4800 ECC (16GB) 068912 commercial temp 0°C to +60°C
DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM with ECC,
DDR5-SODIMM-4800 ECC (32GB) 068913 commercial temp 0°C to +60°C
© 2025 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is
All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and
other trademarks featured or referred are the property of their respective trademark holders. These trademark
holders are not affiliated with congatec GmbH. Product not yet released for Mass Production.
Preliminary Revision 0.1 – January 7th, 2005
www.congatec.com