conga-TCRP1：COM Express Type 6 Compact（AMD Ryzen AI Embedded P100）データシート

conga-TCRP1 AMD Zen5/5c CPU Cores AMD Radeon™ RDNA™ 3.5 Graphics AMD XDNA™ 2 NPU TDP Range from 15W to 54W Onboard NVMe™ SSD (option) Form Factor COM Express® Compact | Type 6 connector pinout CPUs AMD Ryzen™ AI Embedded P100 Series Processors DRAM 2 SODIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) | up to 5600 MT/s | ECC supported Mass Storage NVMe™ SSD up to 512 GB capacity (option instead of SATA ports) Graphics Integrated AMD Radeon™ RDNA™ 3.5 Graphics with up to 4x CUs (Compute Units) AI Acceleration Integrated XDNA 2™ NPU with up to 50 TOPs Display Up to 3x DDI | LVDS or eDP | 4x independent displays Ethernet 2.5 GbE via Intel® i226 Ethernet controller series I/O Interfaces 4x USB 3.2 Gen2 | 4x USB 2.0 | 2x SATA 6Gb/s (if NVMe™ SSD option is not used) | 8x PCIe Gen4 | PEG x4 Gen4 | additional PEG x2 Gen4 (8C, 10C and 12C Variants only) | 1x I²C Bus | 1x GPSPI | 2x UART | 8x GPIO | 1x SMBus | 1x LPC Audio HD-Audio over DDI ports | HDA interface congatec Board Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information controller Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Linux Hypervisor conga-zones (formerly known as RTS Hypervisor) Temperature Commercial Temp.: Operating 0°C to 60°C Commercial Temp.: Storage -20°C to 80°C Industrial Temp.: Operating -40°C to +85°C Industrial Temp.: Storage -40°C to 85°C Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond. Size 95 x 95 mm www.congatec.com

conga-TCRP1 | Block Diagram Dual Channel DDR5 5600 MT/s COM Express 2x 220 pos 2x SO-DIMM Connector Type 6 USB3.2 P0 USB3.2 P1 USB HUB 10Gb USB3.2 P2 USB3.2 P3 4x USB2.0 PCIe 0-3 Gen 4 Up to 4x1 or 2x2 or 1x4 PCIe 4-7 Gen 4 Up to 4x1 or 2x1 or 1x4 AMD Ryzen AI PEG 0-3 Gen 4 Embedded P100 1x4 Series (8C, 10C and 12C Variants only) PEG 4-5 Gen 4 1x2 SATA SATA 0-1 Controller NVMe opt. SATA 2-3 (Opt.) GbE i226 SDP DDI1 DDI2 DDI3 eDP MUX eDP to LVDS MUX LVDS / eDP Bridge HDA SPI Flash TPM eSPI to LPC LPC GPIO congatec GP_SPI Board SMBus Controller I2C Gen5 UART 0-1 Flash MGMT / FAN Assembly option – only available on request

conga-TCRP1 | Order Information (1/2) Article PN Description conga-TCRP1/P185 051800 COM Express Compact module based on AMD Ryzen™ AI Embedded P185 processor with 12 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 16 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C conga-TCRP1/P174 051801 COM Express Compact module based on AMD Ryzen™ AI Embedded P174 processor with 10 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C conga-TCRP1/P164 051802 COM Express Compact module based on AMD Ryzen™ AI Embedded P164 processor with 8 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C conga-TCRP1/P132 051803 COM Express Compact module based on AMD Ryzen™ AI Embedded P132 processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C conga-TCRP1/P121 051804 COM Express Compact module based on AMD Ryzen™ AI Embedded P121 processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C conga-TCRP1/P185i 051810 COM Express Compact module based on AMD Ryzen™ AI Embedded P185i processor with 12 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 16 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C conga-TCRP1/P174i 051811 COM Express Compact module based on AMD Ryzen™ AI Embedded P174i processor with 10 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C conga-TCRP1/P164i 051812 COM Express Compact module based on AMD Ryzen™ AI Embedded P164i processor with 8 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C conga-TCRP1/P132i 051813 COM Express Compact module based on AMD Ryzen™ AI Embedded P132i processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C conga-TCRP1/P121i 051814 COM Express Compact module based on AMD Ryzen™ AI Embedded P121i processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C conga-TCRP1/CSA-HP-B 051850 Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. conga-TCRP1/CSA-HP-T 051851 Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded. conga-TCRP1/CSP-HP-B 051852 Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole. conga-TCRP1/CSP-HP-T 051853 Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded. conga-TCRP1/HSP-HP-B 051854 Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole. conga-TCRP1/HSP-HP-T 051855 Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded. conga-TEVAL/COMe 3.0 065821 Evaluation carrier board for COM Express Type 6 revision 3.0 modules. www.congatec.com

conga-TCRP1 | Order Information (2/2) Article PN Description DDR5-SODIMM-5600 (8GB) 068930 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (16GB) 068931 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (32GB) 068932 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (48GB) 068933 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (16GB) 068941 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (32GB) 068942 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (48GB) 068943 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (8GB) / i-temp 068935 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (16GB) / i-temp 068936 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (32GB) / i-temp 068937 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (48GB) / i-temp 068938 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 ECC (16GB) / i-temp 068946 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, industrial temp -40°C to +85°C DDR5-SODIMM-5600 ECC (32GB) / i-temp 068947 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, industrial temp -40°C to +85°C DDR5-SODIMM-5600 ECC (48GB) / i-temp 068948 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, industrial temp -40°C to +85°C © 2026 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Preliminary Revision 0.3 – February 19th, 2026 www.congatec.com