1/4ページ
ダウンロード(349.8Kb)
conga-TCRP1:COM Express Type 6 Compact(AMD Ryzen AI Embedded P100)データシート
製品カタログ
AMD Ryzen AI Embedded P100 搭載 COM Express Type 6 Compact モジュール
【conga-TCRP1】は、AMD Ryzen AI Embedded P100シリーズを搭載した COM Express Type 6 Compactモジュールです。コンピューティングコアは、パフォーマンス重視のZen5と、エネルギー効率の高いZen5cを組み合わせており、消費電力を極めて低く抑えつつ、ハイパフォーマンスを実現します。最大4台の4KディスプレイをサポートするRadeon RDNA 3.5 GPUに加え、XDNA2 NPUが最大50 TOPSのAIパフォーマンスを提供します。これにより、クラウド接続やディスクリートのアクセラレーターを必要とせずに、大規模言語モデル(LLM)のリアルタイム処理をローカルで実行することができます。コンフィグレーション可能なTDPは、最小でわずか15Wのため、パッシブ冷却方式の完全密閉型設計の開発を可能にし、-40~+85℃の産業用温度範囲をサポートしているため、SWaP-C要件(サイズ、重量、消費電力、コスト)の厳しいアプリケーションや、堅牢なハンドヘルドデバイス、衛生的な医療用PC、そして過酷な環境で使用されるミッションクリティカルなデバイスに最適です。
このカタログについて
| ドキュメント名 | conga-TCRP1:COM Express Type 6 Compact(AMD Ryzen AI Embedded P100)データシート |
|---|---|
| ドキュメント種別 | 製品カタログ |
| ファイルサイズ | 349.8Kb |
| 登録カテゴリ | |
| 取り扱い企業 | コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧) |
この企業の関連カタログ
このカタログの内容
Page1
Folie 1
conga-TCRP1
AMD Zen5/5c CPU Cores
AMD Radeon™ RDNA™ 3.5 Graphics
AMD XDNA™ 2 NPU
TDP Range from 15W to 54W
Onboard NVMe™ SSD (option)
Form Factor COM Express® Compact | Type 6 connector pinout
CPU Processor Cores / Max TDP NPU Graphics Tj
Threads Frequency
AMD Ryzen™ AI Embedded P132 6 / 12 4.5 GHz 28W (15-54W) 50 TOPs 4 CUs 0°C to +105°C
AMD Ryzen™ AI Embedded P121 4 / 8 4.4 GHz 28W (15-54W) 30 TOPs 2 CUs 0°C to +105°C
AMD Ryzen™ AI Embedded P132i 6 / 12 4.5 GHz 28W (15-54W) 50 TOPs 4 CUs -40°C to +105°C
AMD Ryzen™ AI Embedded P121i 4 / 8 4.4 GHz 28W (15-54W) 30 TOPs 2 CUs -40°C to +105°C
DRAM 2 SODIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |
up to 5600 MT/s | ECC supported
Mass Storage NVMe™ SSD up to 512 GB capacity (option instead of SATA ports)
Graphics Integrated AMD Radeon™ RDNA™ 3.5 Graphics with up to 4x CUs (Compute Units)
AI Acceleration Integrated XDNA 2™ NPU with up to 50 TOPs
Display Up to 3x DDI | LVDS or eDP | 4x independent displays
Ethernet 2.5 GbE via Intel® i226 Ethernet controller series
I/O Interfaces 4x USB 3.2 Gen2 | 4x USB 2.0 | 2x SATA 6Gb/s (if NVMe™ SSD option is not used) | 8x PCIe Gen4 |
PEG x4 Gen4 | 1x I²C Bus | 1x GPSPI | 2x UART | 8x GPIO | 1x SMBus | 1x LPC
Audio HD-Audio over DDI ports | HDA interface
congatec Board Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information
controller Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
Hardware Health Monitoring | POST Code redirection
Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Defaults
| LCD Control | Display Auto Detection | Backlight Control | Flash Update
Security Trusted Platform Module (TPM 2.0)
Power Management ACPI 6.0 with battery support
Operating Systems Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Linux
Hypervisor RTS Real-Time Hypervisor
Temperature Commercial Temp.: Operating 0°C to 60°C Commercial Temp.: Storage -20°C to 80°C
Industrial Temp.: Operating -40°C to +85°C Industrial Temp.: Storage -40°C to 85°C
Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond.
Size 95 x 95 mm
www.congatec.com
Page2
Folie 2
conga-TCRP1 | Block Diagram
Dual Channel
DDR5 5600 MT/s COM Express
2x SO-DIMM 2x 220 pos
Connector Type 6
USB3.2 P0
USB3.2 P1
USB HUB 10Gb USB3.2 P2
USB3.2 P3
4x USB2.0
PCIe 0-3 Gen 4
Up to 4x1 or 2x2 or 1x4
PCIe 4-7 Gen 4
Up to 4x1 or 2x1 or 1x4
AMD Ryzen AI
PEG 0-3 Gen 4
Embedded P100
1x4
Series
SATA
Controller SATA 0-1
NVMe opt. SATA 2-3 (Opt.)
i226 GbE
SDP
DDI1
DDI2
DDI3
eDP
MUX eDP to LVDS MUX LVDS / eDP
Bridge
HDA
SPI
Flash TPM
eSPI to LPC LPC
GPIO
congatec GP_SPI
Board SMBus
Controller I2C
Flash Gen5 UART 0-1
MGMT / FAN
Assembly option – only
available on request
Page3
Folie 3
conga-TCRP1 | Order Information (1/2)
Article PN Description
conga-TCRP1/P132 051803 COM Express Compact module based on AMD Ryzen™ AI Embedded P132 processor with 6
Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel
SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C
to +60°C
conga-TCRP1/P121 051804 COM Express Compact module based on AMD Ryzen™ AI Embedded P121 processor with 4
Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel
SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C
to +60°C
conga-TCRP1/P132i 051813 COM Express Compact module based on AMD Ryzen™ AI Embedded P132i processor with 6
Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel
SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C
to +85°C
conga-TCRP1/P121i 051814 COM Express Compact module based on AMD Ryzen™ AI Embedded P121i processor with 4
Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel
SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C
to +85°C
conga-TCRP1/CSA-HP-B 051850 Standard active cooling solution for high performance COM Express module conga-TCRP1 with
integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.
conga-TCRP1/CSA-HP-T 051851 Standard active cooling solution for high performance COM Express module conga-TCRP1 with
integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.
conga-TCRP1/CSP-HP-B 051852 Standard passive cooling solution for high performance COM Express module conga-TCRP1
with integrated heat pipes. All standoffs are with 2.7mm bore hole.
conga-TCRP1/CSP-HP-T 051853 Standard passive cooling solution for high performance COM Express module conga-TCRP1
with integrated heat pipes. All standoffs are M2.5mm threaded.
conga-TCRP1/HSP-HP-B 051854 Standard heatspreader for high performance COM Express module conga-TCRP1 with
integrated heat pipes. All standoffs are with 2.7mm bore hole.
conga-TCRP1/HSP-HP-T 051855 Standard heatspreader for high performance COM Express module conga-TCRP1 with
integrated heat pipes. All standoffs are M2.5mm threaded.
conga-TEVAL/COMe 3.0 065821 Evaluation carrier board for COM Express Type 6 revision 3.0 modules.
www.congatec.com
Page4
Folie 4
conga-TCRP1 | Order Information (2/2)
Article PN Description
DDR5-SODIMM-5600 (8GB) 068930 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C
to +60°C
DDR5-SODIMM-5600 (16GB) 068931 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C
to +60°C
DDR5-SODIMM-5600 (32GB) 068932 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C
to +60°C
DDR5-SODIMM-5600 (48GB) 068933 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C
to +60°C
DDR5-SODIMM-5600 ECC (16GB) 068941 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial
temp 0°C to +60°C
DDR5-SODIMM-5600 ECC (32GB) 068942 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial
temp 0°C to +60°C
DDR5-SODIMM-5600 ECC (48GB) 068943 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial
temp 0°C to +60°C
DDR5-SODIMM-5600 (8GB) / i-temp 068935 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C
to +85°C
DDR5-SODIMM-5600 (16GB) / i-temp 068936 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C
to +85°C
DDR5-SODIMM-5600 (32GB) / i-temp 068937 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C
to +85°C
DDR5-SODIMM-5600 (48GB) / i-temp 068938 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, industrial temp -40°C
to +85°C
DDR5-SODIMM-5600 ECC (16GB) / i-temp 068946 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, industrial
temp -40°C to +85°C
DDR5-SODIMM-5600 ECC (32GB) / i-temp 068947 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, industrial
temp -40°C to +85°C
DDR5-SODIMM-5600 ECC (48GB) / i-temp 068948 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, industrial
temp -40°C to +85°C
© 2026 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is
All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and
other trademarks featured or referred are the property of their respective trademark holders. These trademark
holders are not affiliated with congatec GmbH. Product not yet released for Mass Production.
Preliminary Revision 0.2 – January 12th, 2026
www.congatec.com