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conga-TCRP1:COM Express Type 6 Compact(AMD Ryzen AI Embedded P100)データシート

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AMD Ryzen AI Embedded P100 搭載 COM Express Type 6 Compact モジュール

【conga-TCRP1】は、AMD Ryzen AI Embedded P100シリーズを搭載した COM Express Type 6 Compactモジュールです。コンピューティングコアは、パフォーマンス重視のZen5と、エネルギー効率の高いZen5cを組み合わせており、消費電力を極めて低く抑えつつ、ハイパフォーマンスを実現します。最大4台の4KディスプレイをサポートするRadeon RDNA 3.5 GPUに加え、XDNA2 NPUが最大50 TOPSのAIパフォーマンスを提供します。これにより、クラウド接続やディスクリートのアクセラレーターを必要とせずに、大規模言語モデル(LLM)のリアルタイム処理をローカルで実行することができます。コンフィグレーション可能なTDPは、最小でわずか15Wのため、パッシブ冷却方式の完全密閉型設計の開発を可能にし、-40~+85℃の産業用温度範囲をサポートしているため、SWaP-C要件(サイズ、重量、消費電力、コスト)の厳しいアプリケーションや、堅牢なハンドヘルドデバイス、衛生的な医療用PC、そして過酷な環境で使用されるミッションクリティカルなデバイスに最適です。

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ドキュメント名 conga-TCRP1:COM Express Type 6 Compact(AMD Ryzen AI Embedded P100)データシート
ドキュメント種別 製品カタログ
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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conga-TC700:COM Express Type 6 Compact(インテル Core Ultra) データシート
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コンガテックジャパン株式会社

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conga-TCRP1 AMD Zen5/5c CPU Cores AMD Radeon™ RDNA™ 3.5 Graphics AMD XDNA™ 2 NPU TDP Range from 15W to 54W Onboard NVMe™ SSD (option) Form Factor COM Express® Compact | Type 6 connector pinout CPU Processor Cores / Max TDP NPU Graphics Tj Threads Frequency AMD Ryzen™ AI Embedded P132 6 / 12 4.5 GHz 28W (15-54W) 50 TOPs 4 CUs 0°C to +105°C AMD Ryzen™ AI Embedded P121 4 / 8 4.4 GHz 28W (15-54W) 30 TOPs 2 CUs 0°C to +105°C AMD Ryzen™ AI Embedded P132i 6 / 12 4.5 GHz 28W (15-54W) 50 TOPs 4 CUs -40°C to +105°C AMD Ryzen™ AI Embedded P121i 4 / 8 4.4 GHz 28W (15-54W) 30 TOPs 2 CUs -40°C to +105°C DRAM 2 SODIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) | up to 5600 MT/s | ECC supported Mass Storage NVMe™ SSD up to 512 GB capacity (option instead of SATA ports) Graphics Integrated AMD Radeon™ RDNA™ 3.5 Graphics with up to 4x CUs (Compute Units) AI Acceleration Integrated XDNA 2™ NPU with up to 50 TOPs Display Up to 3x DDI | LVDS or eDP | 4x independent displays Ethernet 2.5 GbE via Intel® i226 Ethernet controller series I/O Interfaces 4x USB 3.2 Gen2 | 4x USB 2.0 | 2x SATA 6Gb/s (if NVMe™ SSD option is not used) | 8x PCIe Gen4 | PEG x4 Gen4 | 1x I²C Bus | 1x GPSPI | 2x UART | 8x GPIO | 1x SMBus | 1x LPC Audio HD-Audio over DDI ports | HDA interface congatec Board Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information controller Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Linux Hypervisor RTS Real-Time Hypervisor Temperature Commercial Temp.: Operating 0°C to 60°C Commercial Temp.: Storage -20°C to 80°C Industrial Temp.: Operating -40°C to +85°C Industrial Temp.: Storage -40°C to 85°C Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond. Size 95 x 95 mm www.congatec.com
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conga-TCRP1 | Block Diagram Dual Channel DDR5 5600 MT/s COM Express 2x SO-DIMM 2x 220 pos Connector Type 6 USB3.2 P0 USB3.2 P1 USB HUB 10Gb USB3.2 P2 USB3.2 P3 4x USB2.0 PCIe 0-3 Gen 4 Up to 4x1 or 2x2 or 1x4 PCIe 4-7 Gen 4 Up to 4x1 or 2x1 or 1x4 AMD Ryzen AI PEG 0-3 Gen 4 Embedded P100 1x4 Series SATA Controller SATA 0-1 NVMe opt. SATA 2-3 (Opt.) i226 GbE SDP DDI1 DDI2 DDI3 eDP MUX eDP to LVDS MUX LVDS / eDP Bridge HDA SPI Flash TPM eSPI to LPC LPC GPIO congatec GP_SPI Board SMBus Controller I2C Flash Gen5 UART 0-1 MGMT / FAN Assembly option – only available on request
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conga-TCRP1 | Order Information (1/2) Article PN Description conga-TCRP1/P132 051803 COM Express Compact module based on AMD Ryzen™ AI Embedded P132 processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C conga-TCRP1/P121 051804 COM Express Compact module based on AMD Ryzen™ AI Embedded P121 processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C conga-TCRP1/P132i 051813 COM Express Compact module based on AMD Ryzen™ AI Embedded P132i processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C conga-TCRP1/P121i 051814 COM Express Compact module based on AMD Ryzen™ AI Embedded P121i processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C conga-TCRP1/CSA-HP-B 051850 Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. conga-TCRP1/CSA-HP-T 051851 Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded. conga-TCRP1/CSP-HP-B 051852 Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole. conga-TCRP1/CSP-HP-T 051853 Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded. conga-TCRP1/HSP-HP-B 051854 Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole. conga-TCRP1/HSP-HP-T 051855 Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded. conga-TEVAL/COMe 3.0 065821 Evaluation carrier board for COM Express Type 6 revision 3.0 modules. www.congatec.com
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conga-TCRP1 | Order Information (2/2) Article PN Description DDR5-SODIMM-5600 (8GB) 068930 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (16GB) 068931 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (32GB) 068932 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (48GB) 068933 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (16GB) 068941 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (32GB) 068942 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 ECC (48GB) 068943 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (8GB) / i-temp 068935 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (16GB) / i-temp 068936 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (32GB) / i-temp 068937 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (48GB) / i-temp 068938 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 ECC (16GB) / i-temp 068946 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, industrial temp -40°C to +85°C DDR5-SODIMM-5600 ECC (32GB) / i-temp 068947 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, industrial temp -40°C to +85°C DDR5-SODIMM-5600 ECC (48GB) / i-temp 068948 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, industrial temp -40°C to +85°C © 2026 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Preliminary Revision 0.2 – January 12th, 2026 www.congatec.com