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conga-TC1000:COM Express Type 6 Compact(インテル Core Ultra Series 3)データシート

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インテル Core Ultra Series 3(Panther Lake-H)搭載 COM Express Type 6 Compact モジュール

【conga-TC1000】は、インテル Core Ultra Series 3(Panther Lake-H)プロセッサーを搭載した COM Express Type 6 Compact モジュールです。 最大16コアのインテル パフォーマンス ハイブリッド設計による先進的なヘテロジニアス コア アーキテクチャーにより、個別のAIアクセラレーターを必要とせず、内蔵AIを最大限に活用することでローカル自然言語処理(NLP)や大規模言語モデル(LLM)の実行、画像分類、センサーフュージョン、自己位置推定と環境地図作成の同時実行(SLAM)を可能にします。 アプリケーションレディの aReady.COM として、ライセンスが付随したOSやハイパーバイザー、ソフトウェア ビルディングブロックをあらかじめコンフィグレーションすることができます。インダストリアル オートメーションやロボティクス、スマートシティ、交通、ヘルスケア、POSなど、AIを活用したマーケットに最適です。

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ドキュメント名 conga-TC1000:COM Express Type 6 Compact(インテル Core Ultra Series 3)データシート
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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【製品ガイド】製品ハイライト2026
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コンガテックジャパン株式会社

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conga-TC300: COM Express Type 6 Compact(インテル Core Series 3)データシート
製品カタログ

コンガテックジャパン株式会社

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conga-TCRP1:COM Express Type 6 Compact(AMD Ryzen AI Embedded P100)データシート
製品カタログ

コンガテックジャパン株式会社

このカタログの内容

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conga-TC1000 Intel® performance hybrid architecture with up to 16 cores Intel® Arc™ Graphics or Intel Graphics Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance DDR5 SODIMM with up to 128 GB RAM system capacity Form factor COM Express® Compact | Type 6 connector pinout CPUs Intel® Core™ Ultra Processors (Series 3) Panther Lake-H DRAM 2x SO-DIMM sockets for DDR5 memory modules up to 64 GB each | Max. 128 GB RAM system capacity | up to 7200 MT/s | in-band ECC (only on selected product variants) Mass Storage NVMe x4 SSD (optional) up to 1 TB capacity Graphics Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with up to 4 Xe cores | Intel® Xe Matrix Extensions AI Acceleration Integrated NPU accelerator up to 50 TOPS | Up to 180 TOPS platform total Display Up to 3x DDI (2x shared with USB4) | LVDS or eDP | 4x independent displays up to 8k Ethernet 2.5 GbE via Intel® i226 Ethernet controller series | Supporting TSN – Time Sensitive Networking (only on selected product variants) | Software Definable Pin (SDP) to be used for IEEE 1588 I/O Interfaces Up to 12x PCIe Gen4 PEG (H484) or up to 4x PCIe Gen4 PEG (H12Xe, H404) | up to 8x PCIe Gen4 Up to 2x USB4 | 3x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0 | 2x SATA (flexible multiplexing) | 2x UART | GPIOs | GP SPI | LPC | SM Bus | I2C Audio HDA | Soundwire (optional) congatec Board controller Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) through Infineon SLB9672 Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 11 | Linux | Yocto Hypervisor RTS Real-Time Hypervisor Temperature Commercial Temp.: Operating 0°C to 60°C Storage -20°C to 80°C Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond. Size 95 x 95 mm www.congatec.com
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conga-TC1000 Dual Channel up to DDR5 7200 Intel® Core™ Ultra MT/s COM Express 2x SO-DIMM SOC (Series 3) 2x 220 pos Connector Type 6 “Panther Lake-H” eDP DDI MUX eDP to LVDS Bridge MUX eDP / LVDS TCP DDI 1 (shared with USB4 Port 1) TCP DDI 2 (shared with USB4 Port 2) TCP DDI 3 USB 3.2 x3 USB 3.2 Port 0-2 Assembly option USB 3.2 Port 3 H484 only PCIe x8 PEG PCIe Gen4 Port 0-7 PCIe x4 PEG PCIe Gen4 Port 8-11 Assembly option PEG PCIe Gen4 Port 12-15 Assembly option x4 NVMe 4x PCIe x1 PCIe Gen 4 Port 0-3 2x PCI x1 PCIe Gen 4 Port 4-5 PCIe MUX PCIe Gen 4 Port 6 Assembly option PCIe Gen 4 Port 7 PCIe to SATA Gen 3 Port 0 SATA x2 SATA Gen 3 Port 1 I226 Ethernet PCIe 2.5 GbE/TSN SDP USB 2.0 x8 USB 2.0 Port 0-7 HDA/SNDW HDA/SNDW SM Bus SM Bus MGMNT GPIO I2C congatec LID#/SLEEP# Board FAN Control UART0 Controller UART1 6th Gen. GP SPI Flash Assembly option eSPI to LPC eSPI ECE1200 LPC SPI SPI TPM 2.0 Flash NOTES Assembly option Only available on request www.congatec.com
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conga-TC1000 Article PN Description COM Express Compact module based on Intel® Core™ Ultra X9 388H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel® Arc™ B390 conga-TC1000/ultraX9-388H 052000 Graphics with 12Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C COM Express Compact module based on Intel® Core™ Ultra 9 386H processor with 4 P-cores, 8 conga-TC1000/ultra9-386H 052001 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C COM Express Compact module based on Intel® Core™ Ultra X7 358H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel® Arc™ B390 conga-TC1000/ultraX7-358H 052002 Graphics with 12Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C COM Express Compact module based on Intel® Core™ Ultra 7 356H processor with 4 P-cores, 8 conga-TC1000/ultra7-356H 052003 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C COM Express Compact module based on Intel® Core™ Ultra 7 355 processor with 4 P-cores and conga-TC1000/ultra7-355 052004 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C COM Express Compact module based on Intel® Core™ Ultra 5 336H processor with 4 P-cores, 4 conga-TC1000/ultra5-336H 052005 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C COM Express Compact module based on Intel® Core™ Ultra 5 325 processor with 4 P-cores and conga-TC1000/ultra5-325 052006 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C COM Express Compact module based on Intel® Core™ Ultra 7 366H processor with 4 P-cores, 8 conga-TC1000/ultra7-366H 052007 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C www.congatec.com
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conga-TC1000 Article PN Description Standard active cooling solution for high performance COM Express module conga- conga-TC1000/CSA-HP-B 052050 TC1000 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. Standard active cooling solution for high performance COM Express module conga- conga-TC1000/CSA-HP-T 052051 TC1000 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded. Standard passive cooling solution for high performance COM Express module conga- conga-TC1000/CSP-HP-B 052052 TC1000 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole. conga-TC1000/CSP-HP-T 052053 Standard passive cooling solution for high performance COM Express module conga- TC1000 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded. conga-TC1000/HSP-HP-B 052054 Standard heatspreader for high performance COM Express module conga-TC1000 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. conga-TC1000/HSP-HP-T 052055 Standard heatspreader for high performance COM Express module conga-TC1000 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. conga-TEVAL/COMe 3.1 065820 Evaluation carrier board for COM Express Type 6 revision 3.1 modules. DDR5-SODIMM-7200 (8GB) 068960 DDR5 SODIMM memory module with up to 7200 MT/s and 8GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-7200 (16GB) 068961 DDR5 SODIMM memory module with up to 7200 MT/s and 16GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-7200 (32GB) 068962 DDR5 SODIMM memory module with up to 7200 MT/s and 32GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-7200 (48GB) 068963 DDR5 SODIMM memory module with up to 7200 MT/s and 48GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-7200 (64GB) 068964 DDR5 SODIMM memory module with up to 7200 MT/s and 64GB RAM, commercial temp 0°C to +60°C © 2025 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is carefully All rights reserved. checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet in mass production and subject to change. Revision 0.5 – December 2025 www.congatec.com