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COM Express Compact Type 6 モジュール: conga-TC700 データシート

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インテル Core Ultra (Meteor Lake) 搭載 COM Express compact Type 6

conga-TC700は、インテル Core Ultra プロセッサー(コードネーム Meteor Lake)を搭載した COM Express Compact Type 6 モジュールです。最大6つの P-core 、最大8つの E-core、2つの低電力 E-core により最大22スレッドをサポートします。最大8個の Xe コアを備えた内蔵の インテル Arc GPU は、最大 2x 8K 解像度のグラフィックスを処理することができます。 内蔵された NPU の インテル AI Boost は、機械学習アルゴリズムと AI 推論を効率的に実行します。 最大 96 GB の DDR5 SO-DIMM は、5600 MT/秒でインバンド ECC をサポートします。

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ドキュメント名 COM Express Compact Type 6 モジュール: conga-TC700 データシート
ドキュメント種別 製品カタログ
ファイルサイズ 331Kb
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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SMARC: conga-SMX95 データシート
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コンガテックジャパン株式会社

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【製品ハイライト】 コンガテック ハイライト2024
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コンガテックジャパン株式会社

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COM Express Compact Type 6 堅牢版: conga-TC675r データシート
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コンガテックジャパン株式会社

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conga-TC700 Intel® performance hybrid architecture with up to 16 cores and 22 threads Integrated Intel® Arc™ Graphics - entry level discrete graphics performance up to 128EUs Intel® AI Boost – Integrated NPU accelerator Up to 96 GB RAM with in-band ECC PCI Express Gen 4 | USB 4 Form factor COM Express® Compact | Type 6 connector pinout CPUs Intel® Core™ Ultra Processors Meteor Lake-U/H (H-Series, U-Series) DRAM 2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) | up to 5600 MT/s | in-band ECC Mass Storage NVMe x4 SSD (optional) up to 1 TB capacity Graphics Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs AI Acceleration Integrated NPU accelerator on all part numbers Display Up to 3x DDI (2x shared with USB4) | LVDS or eDP | 4x independent displays up to 8k Ethernet 2.5 GbE with TSN support via Intel® i226 Ethernet controller series I/O Interfaces Up to 8 PCIe Gen5 PEG (H-Series) or up to 2x4 PCIe Gen4 PEG (U-Series) | up to 8 PCIe Gen4 | up to 2x USB4 | 4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0 | up to 2x SATA | 2x UART | GPIOs | GP SPI | LPC | SM Bus | I2C Audio HDA congatec Board controller Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 11 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto Hypervisor RTS Real-Time Hypervisor Temperature Embedded Temp.: Operating 0°C to 60°C Storage -20°C to 80°C Humidity Operating 10% to 90% r. H. non cond. Storage 5% to 95% r. H. non cond. Size 95 x 95 mm www.congatec.com
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conga-TC700 Dual Channel DDR5 5600 MT/s COM Express 2x SO-DIMM 2x 220 pos Connector Type 6 USB 2.0 Port 0-7 USB 3.2 Port 0-3 Meteor Lake H-Series PCIe 1x8 PEG PCIe Gen4/5 Assembly option Meteor Lake H-Series: Gen4 Port 0-7 Meteor Lake U-Series x4 Meteor Lake U-Series: Gen4 Port 0-7*) PCIe 2x4 NVMe PCIe PCIe Gen4 Port 0-3 PCIe PCIe Gen4 Port 4-5 MUX PCIe Gen4 Port 6 1st Gen. Intel® SATA Port 1 Core™ Ultra SOC PCIe Gen4 Port 7 “Meteor Lake U/H” MUX SATA Port 0 i226 Ethernet PCIe 2.5 GBE/TSN SDP TCP0 DDI 1 (shared with USB4 Port 1) TCP1 DDI 2 (shared with USB4 Port 2) DDIB DDI 3 eDP DDIA MUX eDP to LVDS MUX LVDS/eDP Bridge HDA HD Audio SM Bus SM Bus MGMNT GPIO I2C PECI congatec LID#/SLEEP# Board FAN Control UART0 Controller UART1 6th Gen. GP SPI Flash eSPI to LPC eSPI ECE1200 LPC SPI SPI TPM 2.0 Flash Assembly option – only available on request *) U-Series: If assembly option for NVMe is used PEG port capability is 1x4 on PEG[0:3] www.congatec.com
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conga-TC700 Article PN Description COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.4Ghz up to 4.8GHz (turbo) | conga-TC700/ultra7-155H 045700 E-Cores 0.9GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base-TDP | Intel® code name Meteor Lake-H COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.2GHz up to 4.5GHz (turbo) conga-TC700/ultra5-125H 045701 | E-cores 0.7GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ graphics with 7 Xe cores (112 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base-TDP | Intel® code name Meteor Lake-H COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7Ghz up to 4.8GHz (turbo) | conga-TC700/ultra7-155U 045710 E-cores 1.2GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.3Ghz up to 4.3GHz (turbo) | conga-TC700/ultra5-125U 045711 E-cores 0.8GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U www.congatec.com
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conga-TC700 Article PN Description Standard active cooling solution for high performance COM Express module conga- conga-TC700/CSA-HP-B 045750 TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. Standard active cooling solution for high performance COM Express module conga- conga-TC700/CSA-HP-T 045751 TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded. Standard passive cooling solution for high performance COM Express module conga- conga-TC700/CSP-HP-B 045752 TC700 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole. conga-TC700/CSP-HP-T 045753 Standard passive cooling solution for high performance COM Express module conga- TC700 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded. conga-TC700/HSP-HP-B 045754 Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. conga-TC700/HSP-HP-T 045755 Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. conga-TEVAL/COMe 3.0 065810 Evaluation carrier board for COM Express Type 6 revision 3.0 modules. conga-TEVAL/COMe 3.1 065820 Evaluation carrier board for COM Express Type 6 revision 3.1 modules. DDR5-SODIMM-5600 (8GB) 068930 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (16GB) 068931 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (32GB) 068932 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (48GB) 068933 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (8GB) / i-temp 068934 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (16GB) / i-temp 068935 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C DDR5-SODIMM-5600 (32GB) / i-temp 068936 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C © 2024 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Revision 0.6 – March 2024 www.congatec.com