COM-HPC Client Size B: conga-HPC/cTLH データシート

conga-HPC/cTLH - PCI Express Gen 4 | USB 4.0 - AI/DL Instruction Sets including VNNI - Integrated Xe (Gen 12) graphics with 32 EU - Up to 128 Gbyte DDR4-3200 MT/s - Extended temperature options available Form Factor COM-HPC Size B, (120 x 120 mm) | Client connector pinout CPU Processor Cores/ Threads Base Frequency/max. Turbo TDP Graphics Intel Use Condition i7-11850HE 8C / 16T 2.6GHz / 4.7GHz 45W/35W Intel® UHD 32 General Embedded i5-11500HE 6C / 12T 2.6GHz / 4.5GHz 45W/35W Intel® UHD 32 General Embedded i3-11100HE 4C / 8T 2.4GHz / 4.4GHz 45W/35W Intel® UHD 16 General Embedded 6600HE 2C / 2T 2.6GHz 35W Intel® UHD 16 General Embedded W-11865MRE 8C / 16T 2.6GHz / 4.7GHz 45W/35W Intel® UHD 32 Industrial W-11555MRE 6C / 12T 2.6GHz / 4.5GHz 45W/35W Intel® UHD 32 Industrial W-11155MRE 4C / 8T 2.4GHz / 4.4GHz 45W/35W Intel® UHD 16 Industrial W-11865MLE 8C / 16T 1.5GHz / 4.5GHz 25W Intel® UHD 32 Industrial W-11555MLE 6C / 12T 1.9GHz / 4.4GHz 25W Intel® UHD 32 Industrial W-11155MLE 4C /8T 1.8GHz / 3.1GHz 25W Intel® UHD 16 Industrial Chipset RM590E | QM580E | HM570E DRAM Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (128 GByte total) with 3200 MT/s Graphics Integrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 VDBox | Next Gen IPU6 (Image Processing Unit) with DPHY2.1 | DP 1.4 Display 3x DP/DP++ | 1x eDP/LVDS Ethernet 2x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series I/O Interfaces 4x PCIe Gen4 | PEG support x16 Gen4 | 20x PCIe Gen3 | 2x USB 4.0 | 2x USB 3.2 | 8x USB 2.0 | 2x SATA III (6Gb/s) | eSPI | 2x UART | 12x GPIO | I2C | 4x MIPI-CSI Audio 1x HDA | I2S | 2x Soundwire congatec Board controller Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto Hypervisor RTS Real-Time Hypervisor Temperature Range Commercial: Operating Temperature: 0 to +60°C Storage Temperature: -20 to +80°C Industrial: Operating Temperature: -40 to +85°C Storage Temperature: -20 to +80°C Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. Size 120 x 120 mm² www.congatec.com

conga-HPC/cTLH | optional SO-DIMM 1 SO-DIMM 3 SO-DIMM 0 SO-DIMM 2 11th Gen. Intel® congatec PCH-H Core™/Xeon®/Celeron® Board “500 Series Chipset” “Tiger Lake-H” Controller COM-HPC Client Connectors www.congatec.com eDP DDI 0-2 PCIe Gen 4 PCIe x4 PCIe Gen 4 PCIe x16 MIPI CSI USB 4.0 USB4 0-1 USB4 2-3 USB 0-7 USB 3.2 Gen2 2.5 GbE 2.5 GbE PCIe 0-3 PCIe 4-7 PCIe 12-15 PCIe 32-35 PCIe 36-39 SATA 0-1 HDA / SDW eSPI GSPI SM Bus LID/SLEEP FAN control GPIOs I2C UART 0 UART 1 mux

conga-HPC/cTLH | Article PN Description conga-HPC/cTLH-i7-11850HE 050800 COM-HPC Size B module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range conga-HPC/cTLH-i5-11500HE 050801 COM-HPC Size B module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range conga-HPC/cTLH-i3-11100HE 050802 COM-HPC Size B module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range conga-HPC/cTLH-6600HE 050803 COM-HPC Size B module based on Intel® Celeron 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range conga-HPC/cTLH-W-11865MRE 050810 COM-HPC Size B module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range conga-HPC/cTLH-W-11555MRE 050811 COM-HPC Size B module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range conga-HPC/cTLH-W-11155MRE 050812 COM-HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range conga-HPC/cTLH-W-11865MLE 050813 COM-HPC Size B module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range conga-HPC/cTLH-W-11555MLE 050814 COM-HPC Size B module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range conga-HPC/cTLH-W-11155MLE 050815 COM-HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range www.congatec.com

conga-HPC/cTLH | Article PN Description conga-HPC/cTLH-CSA-HP-B 050850 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heat pipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. conga-HPC/cTLH-CSA-HP-T 050851 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heat pipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread. conga-HPC/cTLH-CSP-HP-B 050852 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heat pipe, 29mm height. All standoffs are with 2.7mm bore hole. conga-HPC/cTLH-CSP-HP-T 050853 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heat pipe, 29mm height. All standoffs are with M2.5mm thread. conga-HPC/cTLH-HSP-HP-B 050854 Standard heat spreader for high performance COM-HPC module conga-HPC/cTLH with integrated heat pipe, 13mm height. All standoffs are with 2.7mm bore hole. conga-HPC/cTLH-HSP-HP-T 050855 Standard heat spreader solution for high performance COM-HPC module conga-HPC/cTLH with integrated heat pipe, 13mm height. All standoffs are with M2.5mm thread. conga-HPC/EVAL-Client 065600 Evaluation Carrier Board for COM-HPC Client type Modules. © 2024 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for mass production. Revision 1.3 – March 2024 www.congatec.com