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COM Express Compact Type 6 堅牢版: conga-TC570r データシート

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COM Express Compact Type 6 モジュール

conga-TC570r は、第11世代インテル Core (Tiger Lake) を搭載した、COM Express compact Type 6 モジュールの堅牢版で、耐振動・耐衝撃のためにメモリは基板に直付けされています。

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ドキュメント名 COM Express Compact Type 6 堅牢版: conga-TC570r データシート
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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SMARC: conga-SMX95 データシート
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コンガテックジャパン株式会社

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【製品ハイライト】 コンガテック ハイライト2024
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コンガテックジャパン株式会社

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COM Express Compact Type 6 モジュール: conga-TC700 データシート
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コンガテックジャパン株式会社

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Page1

Folie 1: 11th Gen Intel® Core™ Processors conga-TC570r

conga-TC570r - Embedded / Industrial use condition - Extended temperature options available - PCI Express Gen 4 - Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/s IBECC - AI / DL Instruction Sets including VNNI Form Factor COM Express® Compact, (95 x 95 mm) | Type 6 connector pinout CPU Processor Cores/ Base Frequency / Threads max. Turbo TDP Graphics Intel Use Condition Core™ i7-1185G7E 4C / 8T 1.80 GHz / 4.40 GHz 12-28W 96 EU Embedded Broad Market Core™ i5-1145G7E 4C / 8T 1.50 GHz / 4.40 GHz 12-28W 80 EU Embedded Broad Market Core™ i3-1115G4E 2C / 4T 2.20 GHz / 3.90 GHz 12-28W 48 EU Embedded Broad Market Celeron 6305E 2C / 2T 1.80 GHz / -- 15W 48 EU Embedded Broad Market Core™ i7-1185GRE 4C / 8T 1.80 GHz / 4.40 GHz 12-28W 96 EU Industrial Core™ i5-1145GRE 4C / 8T 1.50 GHz / 4.10 GHz 12-28W 80 EU Industrial Core™ i3-1115GRE 2C / 4T 2.20 GHz / 3.90 GHz 12-28W 48 EU Industrial DRAM Up to 32 GByte LPDDR4X 4266MT/s SDRAM | memory down | dual channel | IBECC Graphics Integrated Xe Gen 12 graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x4k / 2x8K) | Enhanced media (AV1/12b) with up to 2 VDbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 Display 3x DP/DP++ | 1x eDP Ethernet 2.5 GbE with TSN support via Intel® i226 Ethernet controller series I/O Interfaces 8x PCIe Gen3 | PEG support x4 (PCIe Gen4) 4x USB 3.1 Gen 2 | 8x USB 2.0 | 2x SATA III (6Gb/s) | SPI | 2x UART | 8x GPIO Audio HDA interface congatec Board controller Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 5.0 with battery support Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux | Android | Yocto Hypervisor RTS Real-Time Hypervisor Temperature Range Commercial: Operating Temperature: 0 to +60°C Storage Temperature: -20 to +80°C Industrial: Operating Temperature: -40 to +85°C Storage Temperature: -40 to +85°C Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. Size 95 x 95 mm² www.congatec.com
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Folie 2

conga-TC570r | Dual channel memory LPDDR4x 4266 MT/s 11th Gen Intel® COM Express Core™ 4x LPDDR4x 2x 220 pin Connector Type 6 Processors USB 2.0 Port 0-7 USB 3.1 Port 0-2 MUX USB 3.1 Port 3 PCIe Port 7 x4 PCIe Gen 4 PCIe PEG Port 0-3 PCIe Port 0-4 MUX PCIe Port 5 SATA Port 1 MUX PCIe Port 6 SATA Port 0 Gigabit Ethernet 2.5Gb Ethernet Intel i226 SDP TCP / DDI 0-2 DDI 1-3 MUX eDP to LVDS DDI A Bridge MUX LVDS/eDP DP to VGA DDI B CH7517 CRT Assembly option HDA HD Audio SM Bus SM Bus MGMNT GPIO congatec I2C PECI Board LID# / SLEEP# Controller FAN Control MEC1705 SER0 SER1 eSPI to LPC eSPI ECE1200 LPC SPI SPI TPM 2.0 SPI Flash www.congatec.com
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Folie 3

conga-TC570r | Article PN Description conga-TC570r/i7-1185GRE-32G 050330 COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and 32 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. conga-TC570r/i5-1145GRE-16G 050331 COM Express Type 6 Compact module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and 16GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. conga-TC570r/i3-1115GRE-8G 050332 COM Express Type 6 Compact module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® UHD Graphics with 48EU and 8 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. conga-TC570r/6305E-4G 050320 COM Express Type 6 Compact module based on Intel® Celeron® 6305E 2-core processor with 1.8GHz, 4MB cache, Intel® UHD Graphics with 48EU and 4 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Commercial temperature range. conga-TC570/CSA-HP-B 050350 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. conga-TC570/CSA-HP-T 050351 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. conga-TC570/CSP-HP-B 050352 Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TC570/CSP-HP-T 050353 Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. conga-TC570/HSP-HP-B 050354 Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TC570/HSP-HP-T 050355 Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. conga-TEVAL/COMe 3.0 065810 Evaluation Carrier Board for COM Express Type 6 modules. © 2024 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for mass production. Revision 1.2 – January 25, 2024 www.congatec.com