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COM Express Compact Type 6: conga-TC570 データシート

製品カタログ

COM Express Compact Type 6

conga-TC570 は、第11世代インテル Core (Tiger Lake UP3) を搭載した、COM Express compact Type 6 モジュールです。

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ドキュメント名 COM Express Compact Type 6: conga-TC570 データシート
ドキュメント種別 製品カタログ
ファイルサイズ 249Kb
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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この企業の関連カタログの表紙
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製品カタログ

コンガテックジャパン株式会社

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製品カタログ

コンガテックジャパン株式会社

この企業の関連カタログの表紙
COM Express Compact Type 6 モジュール: conga-TC700 データシート
製品カタログ

コンガテックジャパン株式会社

このカタログの内容

Page1

conga-TC570 - Embedded/Industrial use condition - Extended temperature options available - PCI Express Gen 4 - Integrated high performance Xe (Gen 12) graphics with 96 EU - AI/DL Instruction Sets including VNNI Form Factor COM Express® Compact, (95 x 95 mm) | Type 6 connector pinout CPU Processor Cores/ Threads Base Frequency/max. Turbo TDP Graphics Core™ i7-1185G7E 4C/8T 1.80 GHz / 4.40 GHz 12-28W 96EU Core™ i5-1145G7E 4C/8T 1.50 GHz / 4.40 GHz 12-28W 80EU Core™ i3-1115G4E 2C/4T 2.20 GHz / 3.90 GHz 12-28W 48EU Celeron 6305E 2C/2T 1.80 GHz / -- 15W 48EU Core™ i7-1185GRE 4C/8T 1.80 GHz / 4.40 GHz 12-28W 96EU Core™ i5-1145GRE 4C/8T 1.50 GHz / 4.10 GHz 12-28W 80EU Core™ i3-1115GRE 2C/4T 2.20 GHz / 3.90 GHz 12-28W 48EU DRAM Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s | IBECC Graphics Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 Display 3x DP/DP++ | 1x eDP Ethernet 1x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series I/O Interfaces 8x PCIe Gen3 | PEG support x4 (PCIe Gen4) 4x USB 3.1 Gen 2 | 8x USB 2.0 2x SATA III (6Gb/s) | SPI | 2x UART | 8x GPIO Audio HDA interface congatec Board controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 5.0 with battery support Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux | Android | Yocto | RTS Hypervisor Temperature Range Commercial: Operating Temperature: 0 to +60°C Storage Temperature: -20 to +80°C Industrial: Operating Temperature: -40 to +85°C Storage Temperature: -40 to +85°C Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. Size 95 x 95 mm² www.congatec.com
Page2

conga-TC570 | Dual Channel Intel 11th Gen DDR4 3200 MT/s COM Express 2x 220 pos Core SOC 2x SO-DIMM Connector Type 6 USB 2.0 Port 0-7 USB 3.1 Port 0-2 MUX USB 3.1 Port 3 PCIe Port 7 x4 PCIe Gen 4 PCIe PEG Port 0-3 PCIe Port 0-4 MUX PCIe Port 5 SATA Port 1 MUX PCIe Port 6 SATA Port 0 GBE 2.5Gb Ethernet i226LM/V/IT SDP DDI 1-3 MUX eDP to LVDS Bridge MUX LVDS/eDP DP to VGA DDIA CH7517 CRT Assembly option MIPI DDIB Connector Assembly option HD Audio SM Bus SM Bus MGMNT GPIO congatec I2C PECI Board LID#/SLEEP# Controller FAN Control MEC1705 SER0 SER1/CAN eSPI to LPC eSPI ECE1200 LPC SPI SPI TPM 2.0 SPI Flash www.congatec.com
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conga-TC570 | Article PN Description conga-TC570/i7-1185G7E 050300 COM Express Type 6 Compact module based on Intel® Core™ i7-1185G7E 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Commercial temperature range. conga-TC570/i5-1145G7E 050301 COM Express Type 6 Compact module based on Intel® Core™ i5-1145G7E 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Commercial temperature range. conga-TC570/i3-1115G4E 050302 COM Express Type 6 Compact module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® UHD Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Commercial temperature range. conga-TC570/6305E 050303 COM Express Type 6 Compact module based on Intel® Celeron® 6305E 2-core processor with 1.8GHz, 4MB cache, Intel® UHD Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Commercial temperature range. conga-TC570/i7-1185GRE 050310 COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial temperature range. conga-TC570/i5-1145GRE 050311 COM Express Type 6 Compact module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial temperature range. conga-TC570/i3-1115GRE 050312 COM Express Type 6 Compact module based on Intel® Core™ i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® UHD Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial temperature range. conga-TC570/CSA-HP-B 050350 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. conga-TC570/CSA-HP-T 050351 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. conga-TC570/CSP-HP-B 050352 Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TC570/CSP-HP-T 050353 Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. conga-TC570/HSP-HP-B 050354 Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TC570/HSP-HP-T 050355 Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. conga-TEVAL/COMe 3.0 65810 Evaluation Carrier Board for COM Express Type 6 modules. www.congatec.com
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conga-TC570 | Article PN Description DDR4-SODIMM-3200 (4GB) 068793 DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM DDR4-SODIMM-3200 (8GB) 068794 DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM DDR4-SODIMM-3200 (16GB) 068798 DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM DDR4-SODIMM-3200 (32GB) 068835 DDR4 SODIMM memory module with 3200 MT/s and 32GB RAM DDR4-SODIMM-3200 (4GB) / i-temp 068825 Industrial DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM DDR4-SODIMM-3200 (8GB) / i-temp 068826 Industrial DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM DDR4-SODIMM-3200 (16GB) / i-temp 068827 Industrial DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM DDR4-SODIMM-3200 (32GB) / i-temp 068837 Industrial DDR4 SODIMM memory module with 3200 MT/s and 32GB RAM © 2022 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for mass production. Preliminary Revision 2.4 – Nov 2022 www.congatec.com