COM Express Compact Type 6: conga-TCV2 データシート

conga-TCV2 - High-performance Zen 2 CPU & VEGA GPU - TDP Range 10-54W - Supporting 4 simultaneous 4K displays - Up to 64GByte dual channel DDR4 3200MT/s - AMD Secure Processor with AMD Memory Guard Formfactor COM Express® Compact, (95 x 95 mm) | Type 6 connector pinout CPU General Embedded Versions AMD Ryzen™ Embedded V2748 8 Cores | 16 Threads 4 MB L2 | 8 MB L3 cache 7 GPU CU 35-54 W TDP AMD Ryzen™ Embedded V2718 8 Cores | 16 Threads 4 MB L2 | 8 MB L3 cache 7 GPU CU 10-25 W TDP AMD Ryzen™ Embedded V2546 6 Cores | 12 Threads 3 MB L2 | 8 MB L3 cache 6 GPU CU 35-54 W TDP AMD Ryzen™ Embedded V2516 6 Cores | 12 Threads 3 MB L2 | 8 MB L3 cache 6 GPU CU 10-25 W TDP DRAM Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s and ECC support Graphics Integrated Radeon™ graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | DP 1.4 Display 3x DP/DP++ | LVDS up to FullHD 1920x1200@60Hz| eDP (optional) Ethernet 1x Gigabit Ethernet via Intel® i226 I/O Interfaces 5x PCIe Gen3 (8 lanes) | PEG support x8 | 4x USB 3.1 Gen 2 | 8/4x USB 2.0 | 2x SATA III (6Gb/s) | 2x UART | 8x GPIO | LPC Audio HD-Audio over DP++ ports | HDA interface congatec Board Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information Controller Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control Hardware Health Monitoring | POST Code redirection Embedded BIOS AMI Aptio® UEFI firmware | 16 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Defaults | Features LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard Power Management ACPI 5.0 with battery support Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Ubuntu Linux LTS Hypervisor RTS Real-Time Hypervisor Temperature Range Commercial: Operating Temperature: 0 to +60°C Storage Temperature: -20 to +80°C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 95 mm www.congatec.com

conga-TCV2 SO-DIMM 0 SO-DIMM 1 congatec AMD Ryzen™ Embedded V2000 Board “Zen2 7nm” Controller COM Express Type 6 Connectors conga-TCV2 PCIe 0 PCIe 1 PCIe 2 PCIe 3 PCIe 4-7 PEG 0-7 SATA 0 SATA 2 SATA 1 SATA 3 Ethernet Intel® i226 USB_SS 0 USB_SS 0 USB 3.1 USB_SS 1 Hub USB_SS 2 USB 2.0 1-3 USB 2.0 0 USB 2.0 4-7 DDI 1 DDI 2 DDI 3 LVDS/eDP eDP opt. HDA TMP 2.0 SPI Flash SPI LPC FAN Ctrl. SMB GPIO 0-7 Ser 0 Ser 1 / CAN CAN Opt. I2C

conga-TCV2 | Order Information Article PN Description conga-TCV2/V2748 050500 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2748 8-core processor with 2.9GHz up to 4.25GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. conga-TCV2/V2546 050501 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2546 6-core processor with 3.0GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. conga-TCV2/V2718 050502 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2718 8-core processor with 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. conga-TCV2/V2516 050503 COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2516 6-core processor with 2.1GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. conga-TCV2/CSA-HP-B 050550 Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. conga-TCV2/CSA-HP-T 050551 Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. conga-TCV2/CSP-HP-B 050552 Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TCV2/CSP-HP-T 050553 Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. conga-TCV2/HSP-HP-B 050554 Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TCV2/HSP-HP-T 050555 Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. conga-TEVAL/COMe 3.0 65810 Evaluation Carrier Board for COM Express Type 6 modules. © 2023 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for mass production. Revision 1.4 – December 4th ,2023 www.congatec.com