SMARC: conga-SMX8-X データシート

conga-SMX8-X - NXP i.MX 8X processor series with ARM Cortex-A35 / M4F core complex - Ultra low power architecture with 2-5W - Highest reliability and improved virtualization - Support for up to 2 independent HD displays - Extended longevity up to 15 years - Temperature range up to -40°C .. +85°C Form factor SMARC Specification 2.0 CPU NXP i.MX 8X ARM Processor Cores ARM Cortex-A35 ARM Cortex-M4F GPU i.MX 8QuadXPlus 4x Cortex-A35 @ 1.2GHz 1x Cortex-M4F @ 264MHz 1x GC7000Lite DRAM Up to 4 GByte onboard LPDDR4 memory | 2400 MT/s Ethernet Up to 2x Gbit Ethernet with IEEE 1588 support I/O Interfaces Up to 5x USB 2.0 (1x shared with USB OTG client) | up to 2x USB 3.0 | 1x SDIO 3.0 | 1x PCIe 3.0 | I²C Bus | 1x SPI | 1x QSPI up to 4x UART (2x with Handshake (1x shared with FlexCAN)) | 2x FlexCAN | GPIOs | optional soldered M.2 1216 WiFi/BT Mass Storage eMMC 5.1 up to 128 GByte Sound Up to 2x I²S | optional processor with Tensilica® HiFi 4 DSP Graphics Integrated in NXP i.MX 8X Series GT7000Lite multimedia GPU VPU up to 4K h.265 dec / 1080p h.264 enc/dec | 3D Graphics with up to 4 high performance vec4 shaders and 16 execution units | up to 2 independent displays | OpenGL ES 3.1 | Vulcan VX extensions | OpenCL 1.2 EP | OpenVG 1.1 Video Interfaces 1x dual channel or 2x single channel LVDS 24 bit | 2x MIPI-DSI with 4-lanes shared with LVDS | 1x MIPI-CSI 4-lanes Features Watchdog Timer | I²C bus 400 kHz | Cortex-A35 Console | optional JTAG debug interface | High Precision Real Time Clock Virtualization Hardware Virtualization with Domain Separation | Multiple Operating System Support Security High Assurance Boot support, SHE | Inline Encryption Engine (AES-128) | TRNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096 and secure key storage Boot Loader U-Boot boot loader Operating Systems Linux | Yocto Linux | Android Power Consumption Ultra low power Cortex-A35 | typ. application 2-5W @ 5V Temperature Range Operating Temperature Range: -40 to +85°C industrial grade Storage Temperature Range: -40 to +85°C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non-condensing Size 82 x 50 mm (3,23” x 1,97”) www.congatec.com

conga-SMX8-X | Block Diagram SMARC Connector Onboard LPDDR4 LVDS0/DSI0 LVDS 0/DSI0 LPDDR4 Memory LVDS1/DSI1 LVDS 1/DSI1 JTAG* JTAG GBE0 PHY Ethernet 0 GBE1 PHY Ethernet 1 UART Driver UART PCIe PCIe Gen 3 eMMC eMMC 5.1 MIPI-CSI1 MIPI-CSI 4-lane NXP i.MX 8X Precision RTC I2C Processor SDIO SDIO Series I2S 2x I2S Audio USB 2.0 OTG 1x USB 2.0 OTG USB SS 2x USB 3.0 / 2.0 USB Hub USB 2.0 2x USB 2.0 FlexCAN 2x CAN Bus SDIO* 1x UART 2-wire* PCIe* 2x UART 4-wire WiFi/ BT* USB3* 1x UART 2-wire UART* I2C 2x SPI GPIO GPIO [0:6] GPIO Expander GPIO [7:11] Power Rail Power PMIC Control * Assembly Option www.congatec.com

conga-SMX8-X | Order Information Article PN Description conga-SMX8-X/i-QXP-4G eMMC16 051110 SMARC 2.0 module with ultra low power NXP i.MX 8QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range. conga-SMX8-X/i-QXP-2G eMMC16 051113 SMARC 2.0 module with ultra low-power NXP i.MX 8QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range. conga-SMX8-X/i-CSP-B 051150 Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole. conga-SMX8-X/i-HSP-B 051151 Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole. conga-SEVAL 007010 Evaluation carrier board for SMARC modules. conga-SMC1/SMARC-ARM 020750 3.5’’ carrier board for congatec SMARC modules based on NXP i.MX ARM architecture. © 2024 congatec GmbH. All rights reserved. All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Rev. 1.5, March 18, 2024 www.congatec.com