conga-MC1000：COM Express Type 10 Mini（インテル Core Ultra Series 3）データシート
製品カタログ
インテル Core Ultra Series 3（Panther Lake-H）搭載 COM Express Type 10 Mini モジュール
【conga-MC1000】は、インテル Core Ultra Series 3（Panther Lake-H）プロセッサーを搭載した COM Express Mini モジュールです。 最大16コアのインテル パフォーマンス ハイブリッド設計による先進的なヘテロジニアス コア アーキテクチャーにより、個別のAIアクセラレーターを必要とせず、内蔵AIを最大限に活用することでローカル自然言語処理（NLP）や大規模言語モデル（LLM）の実行、画像分類、センサーフュージョン、自己位置推定と環境地図作成の同時実行（SLAM）を可能にします。 アプリケーションレディの aReady.COM として、ライセンスが付随したOSやハイパーバイザー、ソフトウェア ビルディングブロックをあらかじめコンフィグレーションすることができます。インダストリアル オートメーションやロボティクス、スマートシティ、交通、ヘルスケア、POSなど、AIを活用したマーケットに最適です。
このカタログについて
| ドキュメント名 | conga-MC1000：COM Express Type 10 Mini（インテル Core Ultra Series 3）データシート |
|---|---|
| ドキュメント種別 | 製品カタログ |
| ファイルサイズ | 277.4Kb |
| 登録カテゴリ | |
| 取り扱い企業 | コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧) |
この企業の関連カタログ
このカタログの内容
Page1
Folie 1
conga-MC1000
Intel® performance hybrid architecture with
up to 16 cores
Intel® Arc Graphics with up to 12 Xᵉ cores
Integrated NPU with up to 50 TOPS and up to
180 TOPS total platform performance
Up to 32GB LPDDR5x soldered down memory
for maximum memory bandwidth
Form factor COM Express® Mini | Type 10 connector pinout
CPUs Intel® Core Ultra Processors Series 3 (Panther Lake-H)
DRAM Up to 32GB LPDDR5x soldered down with up 8533 MT/s | In-band ECC (only on selected product variants)
Mass Storage NVMe up to 1 TB capacity SSD
Graphics Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with up to 4 Xe cores | Intel® Xe Matrix Extensions
AI Acceleration Integrated NPU accelerator up to 50 TOPS | Up to 180 TOPS platform total
Display DDI for DP++ | single-channel LVDS or optional eDP | 2x independent displays up to 4k
Ethernet 2.5 GbE via Intel® i226 Ethernet controller series | supporting TSN (only on selected product variants)
I/O Interfaces Up to 4x PCIe Gen4 | 2x USB 3.2 Gen2 | 8x USB 2.0 | 2x SATA | 2x UART (RX/TX only) | GPIOs | GP SPI | LPC |
SM Bus | I2C
Audio High Definition Audio
Module Management Module Management Controller | Multistage Watchdog | Board Information | Board Statistics | I²C bus (fast
Controller mode) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection
Embedded BIOS Feature AMI Aptio® UEFI firmware | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection |
Backlight Control
Security Trusted Platform Module (TPM 2.0)
Power Management ACPI 6.0 | wide range power supply 8.5V – 20V | single supply power
Operating Systems Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 11 | Linux
Hypervisor RTS real-time Hypervisor
Temperature Commercial Temp.: Operating 0°C to 60°C Storage -20°C to 80°C
Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond.
Size 55 x 84 mm
www.congatec.com
Page2
Folie 2
conga-MC1000
Intel® Core Ultra SOC LPDDR5x COM Express
(Series 3) soldered down 1x 220 pos
“Panther Lake-H” Connector Type 10
Assembly Option
eDP
eDP to LVDS
DDI
bridge eDP / LVDS
TCP DP++
USB 3.2 USB 3.2 Port 0-1
USB 2.0 x8 USB 2.0 Port 0-7
PCIe Gen5 x4 NVMe x4
4x PCIe x1 PCIe Gen 4 Port 0-3
SATA Gen 3 Port 0
PCIe PCIe to SATA x2
SATA Gen 3 Port 1
Intel I226
PCIe 2.5 GbE/TSN 2.5Gb Ethernet
HDA HDA
SMB SMB
MGMNT GPIO
FAN control
Module
Management UART 0-1
Controller embedded
EEPROM I2C
Assembly Option
eSPI eSPI to LPC LPC / eSPI
Assembly Option
2x UART
SPI SPI
TPM 2.0 BIOS Flash
Assembly Option
www.congatec.com
Page3
Folie 3
conga-MC1000
Article PN Description
COM Express Mini module based on Intel® Core Ultra X9 388H processor with
4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache
conga-MC1000/ultraX9-388H-32G NVMe128 049900 LLC | Intel® Arc B390 Graphics with 12Xe cores | LPDDR5x memory module with
up to 8533 MT/s and up to 32 GB system memory capacity | commercial grade
temperature range from 0°C to 60°C.
COM Express Mini module based on Intel® Core Ultra 9 386H processor with
4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache
conga-MC1000/ultra9-386H-32G NVMe128 049901 LLC | Intel Graphics with 4Xe cores | LPDDR5x memory module with up to 8533
MT/s and up to 32 GB system memory capacity | commercial grade temperature
range from 0°C to 60°C.
COM Express Mini module based on Intel® Core Ultra 7 356H processor with
4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache
conga-MC1000/ultra7-356H-32G NVMe128 049903 LLC | Intel Graphics with 4Xe cores | LPDDR5x memory module with up to 8533
MT/s and up to 32 GB system memory capacity | commercial grade temperature
range from 0°C to 60°C.
COM Express Mini module based on Intel® Core Ultra 5 325 processor with
4 P-cores and 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel
conga-MC1000/ultra5-325-32G NVMe128 049906 Graphics with 4Xe cores | LPDDR5x memory module with up to 8533 MT/s and
up to 32 GB system memory capacity | commercial grade temperature range
from 0°C to 60°C.
www.congatec.com
Page4
Folie 4
conga-MC1000
Article PN Description
conga-MC1000/HSP-B 049950 Standard heatspreader for high performance COM Express module conga-MC1000. All
standoffs are with 2.7mm bore hole.
conga-MC1000/HSP-T 049951 Standard heatspreader for high performance COM Express module conga-MC1000. All
standoffs are M2.5mm threaded.
conga-TEVAL/COMe 3.1 065820 Evaluation carrier board for COM Express Type 6 revision 3.1 modules.
© 2025 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is carefully
All rights reserved. checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks
featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated
with congatec GmbH. Product not yet in mass production and subject to change.
Draft Revision 0.1 – December 2025
www.congatec.com