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conga-HPC/mPTL:COM-HPC Mini(インテル Core Ultra Series 3)データシート

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インテル Core Ultra Series 3(Panther Lake-H)搭載 COM-HPC Mini モジュール

【conga-HPC/mPTL】は、インテル Core Ultra Series 3(Panther Lake-H)プロセッサーを搭載した COM-HPC Mini モジュールです。 最大16コアのインテル パフォーマンス ハイブリッド設計による先進的なヘテロジニアス コア アーキテクチャーにより、個別のAIアクセラレーターを必要とせず、内蔵AIを最大限に活用することでローカル自然言語処理(NLP)や大規模言語モデル(LLM)の実行、画像分類、センサーフュージョン、自己位置推定と環境地図作成の同時実行(SLAM)を可能にします。 アプリケーションレディの aReady.COM として、ライセンスが付随したOSやハイパーバイザー、ソフトウェア ビルディングブロックをあらかじめコンフィグレーションすることができます。インダストリアル オートメーションやロボティクス、スマートシティ、交通、ヘルスケア、POSなど、AIを活用したマーケットに最適です。

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ドキュメント名 conga-HPC/mPTL:COM-HPC Mini(インテル Core Ultra Series 3)データシート
ドキュメント種別 製品カタログ
ファイルサイズ 331.7Kb
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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【製品ガイド】製品ハイライト2026
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このカタログの内容

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conga-HPC/mPTL Intel® performance hybrid design with up to 16 cores Integrated NPU for dedicated AI acceleration Onboard LPDDR5x with in-band ECC on selected product variants Onboard NVMe SSD with 128GB Form Factor COM-HPC Mini CPUs Intel® Core™ Ultra Processors (Series 3) Panther Lake-H DRAM Up to 32 GB LPDDR5x soldered down (optional up to 96 GB) with max. 8.533 MT/s | dual channel | in-band ECC support on selected SKUs Graphics Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with up to 4 Xe cores | Intel® Xe Matrix Extensions AI Acceleration Integrated NPU accelerator with up to 50 TOPS Display DP/DP++ (adding second DP/DP++ would require separate BIOS which disables USB4) | eDP Ethernet 2x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series (TSN only on selected PNs) I/O Interfaces 4x x1 PCIe Gen4 | 1x x4 PCIe Gen5 | 2x x4 PCIe Gen5 on selected SKUs | USB4 (USB4 would be disabled if second DP/DP++ was enabled by separate BIOS) | up to 4x USB 3.2 Gen2x1 | up to 8x USB 2.0 | 2x UART | GP_SPI | eSPI | SM Bus | FAN Control | 12x GPIO Audio HDA Storage NVMe SSD with 128GB (optional up to 1 TB capacity) congatec Board controller Next Gen 6 congatec Board Controller | Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Linux | Yocto Hypervisor RTS Real-Time Hypervisor Temperature Range Commercial variants Operation: 0°C to 60°C Storage: -20°C to 80°C Humidity Operation: 10 to 85% r. H. non cond. Storage: 5 to 85% r. H. non cond. Size 95 x 70 mm² www.congatec.com
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conga-HPC/mPTL | Dual Channel 2/4x LPDDR5x NVMe 128GB Intel® Core™ Ultra SOC (Series 3) congatec “Panther Lake-H” Board Controller Gen6 COM-HPC Mini Connector *) adding second DP/DP++ would require separate BIOS which disables USB4 www.congatec.com USB4 / DDI1*) USB3 0 USB3 1 USB3 2 USB3 3 only PCIe 8-11 on selected PNs only PCIe 12-15 on selected PNs eDP DDI 0 NBASE-T i226/TSN only on selected PNs NBASE-T i226/TSN only on selected PNs PCIe 0-3 PCIe 4 - 7 USB2 0-7 HDA TPM 2.0 SPI Flash Boot SPI GP SPI eSPI SM Bus FAN Control Lid#/Sleep# GPIO 0-11 I2C 0-2 USB PD I2C UART0 UART1
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conga-HPC/mPTL | Article PN Description conga-HPC/mPTL-9-386H-32G COM-HPC Mini module based on Intel® Core™ Ultra 9 386H processor with 4 P-cores, 8 E-cores and NVMe128 045800 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 32GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H COM-HPC Mini module based on Intel® Core™ Ultra X7 368H processor with 4 P-cores, 8 E-cores conga-HPC/mPTL-X7-368H-32G NVMe128 045801 and 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel® Arc™ B390 Graphics with 12Xe Cores | 32GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H conga-HPC/mPTL-7-366H-16G COM-HPC Mini module based on Intel® Core™ Ultra 7 366H processor with 4 P-cores, 8 E-cores and NVMe128 045802 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H conga-HPC/mPTL-7-356H-16G COM-HPC Mini module based on Intel® Core™ Ultra 7 356H processor with 4 P-cores, 8 E-cores and NVMe128 045803 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H conga-HPC/mPTL-5-336H-16G COM-HPC Mini module based on Intel® Core™ Ultra 5 336H processor with 4 P-cores, 4 E-cores and NVMe128 045804 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H conga-HPC/mPTL-5-325-16G COM-HPC Mini module based on Intel® Core™ Ultra 5 325 processor with 4 P-cores and 4 LPE Cores NVMe128 045805 | Integrated NPU | 12 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H conga-HPC/EVAL-Mini 065640 Evaluation Carrier Board for congatec COM-HPC Mini modules. conga-HPC/3.5-Mini 065630 3.5” Application Carrier Board suitable for congatec COM-HPC Mini Modules. conga-HPC/mPTL-CSA-B 045850 Standard active cooling solution for COM-HPC module conga-HPC/mPTL with 24.8mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. conga-HPC/mPTL-CSA-T 045851 Standard active cooling solution for COM-HPC module conga-HPC/mPTL with 24.8mm overall heat sink height and integrated 12V fan. All standoffs are M2.5 threaded. conga-HPC/mPTL-CSP-B 045852 Standard passive cooling solution for COM-HPC module conga-HPC/mPTL with 24mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-HPC/mPTL-CSP-T 045853 Standard passive cooling solution for COM-HPC module conga-HPC/mPTL with 24mm overall heat sink height. All standoffs are M2.5 threaded. conga-HPC/mPTL-HSP-B 045854 Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are with 2.7mm bore hole. conga-HPC/mPTL-HSP-T 045855 Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are M2.5 threaded. © 2025 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for mass production. Revision 0.13 – December 19th 2025 www.congatec.com