Qualcomm Dragonwing IQ-X シリーズ搭載 COM-HPC Mini: conga-HPC/mIQ-X
【conga-HPC/mIQ-X】は、Qualcomm Dragonwing IQ-X シリーズ プロセッサーを搭載した COM-HPC Mini モジュールで、最大64 GBのLPDDR5Xメモリーを直付け実装可能です。最大12個の Oryonコアにより卓越した演算性能をクラス最高の電力効率で実現し、ローカル機械学習（ML）や大規模言語モデル（LLM）の実行を含むエッジAIアプリケーションは、Qualcomm Hexagon プロセッサーを搭載した専用NPUにより、最大45 TOPSのAI性能を実現します。また、DSPやQualcomm Spectra ISPを搭載しビデオや画像、音声データを超高効率で処理します。 内蔵の Qualcomm Adreno GPUは、最大3台のディスプレイと8K解像度をサポートします。 2つの 2.5 Gbイーサネット、最大16レーンのPCIe Gen3/Gen4、2つのUSB4、2つのUSB3.2 Gen2x1、8つのUSB2.0 を備えています。 グラフィックス出力は2つのDDIとeDPで、MIPI CSI経由で最大4台のカメラを直接接続することができます。過酷な環境向けに -40℃～+85℃の産業用温度範囲をサポートします。
関連メディア
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| ドキュメント名 | COM-HPC Mini: conga-HPC/mIQ-X データシート |
|---|---|
| ドキュメント種別 | 製品カタログ |
| ファイルサイズ | 273.1Kb |
| 登録カテゴリ | |
| 取り扱い企業 | コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧) |
この企業の関連カタログ
このカタログの内容
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conga-HPC/mIQ-X
First high-performance ARM on COM-HPC Mini
Up to 12 Qualcomm® Oryon CPU cores
Qualcomm® Hexagon NPU with 45 TOPS
High performance Qualcomm® Adreno GPU
PCI Express Gen 4 | USB 4
Industrial Temperature Range -40°C to +85°C
Form Factor COM-HPC® Mini
CPUs Qualcomm® Dragonwing IQ-X Series modules featuring Oryon CPU with up to 12 cores
DRAM Soldered down LPDDR5x memory from 16GB up to 64GB capacity | up to 6400 MT/s
Mass Storage UFS 4.0 SSD (optional) up to 1 TB capacity
Graphics Qualcomm® Adreno GPU | Qualcomm® Spectra ISP
AI Acceleration Qualcomm® Hexagon NPU with up to 45 TOPS
Display Up to 2x DDI (2x shared with USB4) | eDP v1.4 | up to 8k (UHD) resolution
Ethernet 2x 2.5 GbE via Qualcomm® QCA8081 Ethernet PHY transceiver | IEEE 1588v2 support | MACsec
I/O Interfaces Up to 16x PCIe lanes (12x PCIe Gen4 + 4x PCIe Gen3) | multiple bifurcation options | Up to 2x USB 4 |
2x USB 3.2 Gen2x1 + 2x USB 3.2 Gen1x1 + 8x USB2.0 | 2x 4-lane CSI | 2x UART | 12x GPIOs | eSPI | GP SPI |
2x I2C | CAN | SM Bus
Audio I2S | SoundWire (optional)
Embedded Controller Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board
Statistics | I²C bus (fast mode, 400 kHz, multi master) | Power Loss Control | Hardware Health Monitoring |
System FAN control
Embedded BIOS Feature AMI Aptio® V UEFI firmware for ARM | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM
Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update
Security Trusted Platform Module (TPM 2.0)
Power Management Embedded Controller | ACPI with battery support
Operating Systems Ubuntu Pro Linux | Yocto | Microsoft® Windows 11 IoT Enterprise LTSC
Temperature Operating: -40°C to 85°C Storage: -40°C to 85°C
Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond.
Size 95 x 70 mm
www.congatec.com
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conga-HPC/mIQ-X
16 COM HPC Mini
16-6-6464
GGBB L PLPDDDRR5x
1616--644G GB BLPDDDDDR
55x LP Rx5x Connector
Qualcomm® CSI 0 MIPI-CSI 4-lane
Dragonwing CSI 1 MIPI-CSI 4-lane
IQ-X Series
System-in-Package
UFS 4.0
UFS 4.0 128 GB to 1 TB
eDP eDP
DDI / USB 4 DDI / USB 4
DDI / USB 4 DDI / USB 4
4x USB 2.0 4x USB 2.0
USB 3.2 Gen 2 USB 3.2 Gen 2
USB 3.2 Gen 2 USB 3.2 Gen 2
USB 3.2 Gen1 USB 3.2 Gen1
USB 3.2 Gen1
USB 3.2 Gen1 USB 3 Hub USB 3.2 Gen1
USB 2
PCIe 8-15 Gen 4 PCIe 8-15
PCIe 4-7 Gen 4 PCIe 4-7
QPS615 Ethernet Phy 2.5 GbE
PCIe 2-3 Gen 3 Bridge
PCIe 2-3
QPS615 PCIe 0-1
PCIe 0-1 Gen 3 Bridge Ethernet Phy 2.5 GbE
3x I2C
2x UART
QSPI
SMB
12x GPIO
I2S / SNDW
SNDW / DMIC
SNDW / DMIC
SPI
SPI Flash Boot SPI
I2C RST#,Sus
ACPI Int Board RSMRST#,
Sleep Int Controller Wake, LID,
Reset Sys Fan
Sys Therm Temp Sens
SPI TPM 2.0
SPI SPI to CAN
CAN
Assembly Option
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conga-HPC/mIQ-X
Article PN Description
COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12
Oryon CPU cores up to 3.4GHz | 64GB soldered down LPDDR5x memory |
conga-HPC/mIQ-X7-64G UFS128 053100 Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |
Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade
temperature range from -40°C to 85°C.
COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12
Oryon CPU cores up to 3.4GHz | 32GB soldered down LPDDR5x memory |
conga-HPC/mIQ-X7-32G UFS128 053101 Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |
Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade
temperature range from -40°C to 85°C.
COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12
Oryon CPU cores up to 3.4GHz | 16GB soldered down LPDDR5x memory |
conga-HPC/mIQ-X7-16G UFS128 053102 Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |
Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade
temperature range from -40°C to 85°C.
COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X5 with 8
Oryon CPU cores up to 3.4GHz | 32GB soldered down LPDDR5x memory |
conga-HPC/mIQ-X5-32G UFS128 053106 Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |
Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade
temperature range from -40°C to 85°C.
COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X5 with 8
Oryon CPU cores up to 3.4GHz | 16GB soldered down LPDDR5x memory |
conga-HPC/mIQ-X5-16G UFS128 053107 Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |
Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade
temperature range from -40°C to 85°C.
www.congatec.com
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conga-HPC/mIQ-X
Article PN Description
conga-HPC/mIQ-X-HSP-B 053154 Standard heatspreader for COM-HPC module conga-HPC/mIQX. All standoffs are with
2.7mm bore hole.
conga-HPC/mIQ-X-HSP-T 053155 Standard heatspreader for COM-HPC module conga-HPC/mIQX. All standoffs are
M2.5mm threaded.
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holders are not affiliated with congatec GmbH. Product not yet released for Mass Production.
Revision 0.1 – November 2025
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