インテル Core Ultra プロセッサー搭載 COM Express: conga-TC750データシート

conga-TC750 Cutting edge Intel® Arc™ Graphics with XMX Systolic Arrays and up to 128 EUs Next level Edge AI performance up to 99 TOPS total Up to 128 GB RAM with in-band ECC Intel® performance hybrid architecture with up to 16 cores and 22 threads PCI Express Gen 4 | USB 4 Form factor COM Express® Compact | Type 6 connector pinout CPUs Intel® Core™ Ultra Processors (Series 2) Arrow Lake-U/H (H-Series, U-Series) DRAM 2x SO-DIMM sockets for DDR5 memory modules up to 64 GB each (max. 128 GB RAM system capacity) | up to 6400 MT/s | in-band ECC Mass Storage NVMe x4 SSD (optional) up to 1 TB capacity Graphics Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs AI Acceleration Up to 99 TOPS (platform total) | Integrated NPU accelerator on all part numbers Display Up to 3x DDI (2x shared with USB4) | LVDS or eDP | 4x independent displays up to 8k Ethernet 2.5 GbE via Intel® i226 Ethernet controller series | Supporting TSN – Time Sensitive Networking (depending on PN) | Software Definable Pin (SDP) to be used for IEEE 1588 I/O Interfaces Up to 8 PCIe Gen4 PEG (H-Series) or up to 2x4 PCIe Gen4 PEG (U-Series) | up to 8 PCIe Gen4 | up to 2x USB4 | 4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0 | up to 2x SATA | 2x UART | GPIOs | GP SPI | LPC | SM Bus | I2C Audio HDA congatec Board controller Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 11 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto Hypervisor RTS Real-Time Hypervisor Temperature Embedded Temp.: Operating 0°C to 60°C Storage -20°C to 80°C Humidity Operating 10% to 85% r. H. non cond. Storage 5% to 85% r. H. non cond. Size 95 x 95 mm www.congatec.com

conga-TC750 Dual Channel DDR5 6400 MT/s COM Express 2x SO-DIMM 2x 220 pos Connector Type 6 USB 2.0 Port 0-7 USB 3.2 Port 0-3 Arrow Lake H-Series PCIe 1x8 PEG PCIe Gen4 Assembly option Arrow Lake H-Series: Gen4 Port 0-7 Arrow Lake U-Series x4 Arrow Lake U-Series: Gen4 Port 0-7*) PCIe 2x4 NVMe PCIe PCIe Gen4 Port 0-3 PCIe PCIe Gen4 Port 4-5 MUX PCIe Gen4 Port 6 Intel® Core™ Ultra SATA Port 1 SOC (Series 2) PCIe Gen4 Port 7 “Arrow Lake U/H” MUX SATA Port 0 i226 Ethernet PCIe 2.5 GBE/TSN SDP TCP0 DDI 1 (shared with USB4 Port 1) TCP1 DDI 2 (shared with USB4 Port 2) DDIB DDI 3 eDP DDIA MUX eDP to LVDS MUX LVDS/eDP Bridge HDA HD Audio SM Bus SM Bus MGMNT GPIO I2C PECI congatec LID#/SLEEP# Board FAN Control UART0 Controller UART1 6th Gen. GP SPI Flash eSPI to LPC eSPI ECE1200 LPC SPI SPI TPM 2.0 Flash Assembly option – only available on request *) U-Series: If assembly option for NVMe is used PEG port capability is 1x4 on PEG[0:3] www.congatec.com

conga-TC750 Article PN Description COM Express Type 6 Compact module based on Intel® Core™ Ultra 9 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.9Ghz up to 5.4GHz (turbo) | conga-TC750/ultra9-285H 045720 E-Cores 2.7GHz up to 4.5GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ 140T graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 45W Base-TDP | Intel® code name Arrow Lake-H COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.0Ghz up to 5.1GHz (turbo) | conga-TC750/ultra7-255H 045721 E-Cores 1.5GHz up to 4.4GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ 140T graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 28W Base-TDP | Intel® code name Arrow Lake-H COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7Ghz up to 4.9GHz (turbo) | conga-TC750/ultra5-225H 045722 E-Cores 1.3GHz up to 4.3GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ 130T graphics with 7 Xe cores (112 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 28W Base-TDP | Intel® code name Arrow Lake-H COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.0Ghz up to 5.2GHz (turbo) | conga-TC750/ultra7-255U 045723 E-Cores 1.7GHz up to 4.2GHz (turbo) | Low Power E-cores up to 2.4GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 15W Base-TDP | Intel® code name Arrow Lake-U COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.5Ghz up to 4.8GHz (turbo) | conga-TC750/ultra5-225U 045724 E-Cores 1.3GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.4GHz (turbo) | Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 15W Base-TDP | Intel® code name Arrow Lake-U www.congatec.com

conga-TC750 Article PN Description Standard active cooling solution for high performance COM Express module conga- conga-TC700/CSA-HP-B 045750 TC700/TC750 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. Standard active cooling solution for high performance COM Express module conga- conga-TC700/CSA-HP-T 045751 TC700/TC750 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded. Standard passive cooling solution for high performance COM Express module conga- conga-TC700/CSP-HP-B 045752 TC700/TC750 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole. Standard passive cooling solution for high performance COM Express module conga- conga-TC700/CSP-HP-T 045753 TC700/TC750 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded. conga-TC700/HSP-HP-B 045754 Standard heatspreader for high performance COM Express module conga-TC700/TC750 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. conga-TC700/HSP-HP-T 045755 Standard heatspreader for high performance COM Express module conga-TC700/TC750 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. conga-TEVAL/COMe 3.1 065820 Evaluation carrier board for COM Express Type 6 revision 3.1 modules. DDR5-SODIMM-5600 (8GB) 068930 DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (16GB) 068931 DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (32GB) 068932 DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C DDR5-SODIMM-5600 (48GB) 068933 DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C © 2025 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Revision 0.2 – February 2025 www.congatec.com