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COM Express Basic Type 6: conga-TS570 データシート

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COM Express Basic Type 6 モジュール

conga-TS570 は、第11世代 インテル Core (Tiger Lake H) プロセッサを搭載したCOM Express Basic Type 6 モジュールです。

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ドキュメント名 COM Express Basic Type 6: conga-TS570 データシート
ドキュメント種別 製品カタログ
ファイルサイズ 385.9Kb
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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COM Express Compact Type 6 モジュール: conga-TC700 データシート
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コンガテックジャパン株式会社

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COM Express Compact Type 6 堅牢版: conga-TC675r データシート
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コンガテックジャパン株式会社

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SMARC: conga-STDA4 データシート
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コンガテックジャパン株式会社

このカタログの内容

Page1

Folie 1: 11th Gen Intel® Core™ Processors conga-TS570

conga-TS570 11th Gen Intel® Core™ Processors Integrated Xe Gen 12 graphics with 32 EU AI / DL Instruction Sets including VNNI PCI Express Gen 4 | NVMe Industrial temperature options available Form Factor COM Express® Basic (125 x 95 mm) | Type 6 connector pinout CPU Processor Cores/ Base Frequency/max. Threads Turbo TDP Graphics Intel Use Condition i7-11850HE 8C / 16T 2.6GHz / 4.7GHz 45W / 35W Intel® UHD 32 General Embedded i5-11500HE 6C / 12T 2.6GHz / 4.5GHz 45W / 35W Intel® UHD 32 General Embedded i3-11100HE 4C / 8T 2.4GHz / 4.4GHz 45W / 35W Intel® UHD 16 General Embedded 6600HE 2C / 2T 2.6GHz 35W Intel® UHD 16 General Embedded W-11865MRE 8C / 16T 2.6GHz / 4.7GHz 45W / 35W Intel® UHD 32 Industrial W-11555MRE 6C / 12T 2.6GHz / 4.5GHz 45W / 35W Intel® UHD 32 Industrial W-11155MRE 4C / 8T 2.4GHz / 4.4GHz 45W / 35W Intel® UHD 16 Industrial W-11865MLE 8C / 16T 1.5GHz / 4.5GHz 25W Intel® UHD 32 Industrial W-11555MLE 6C / 12T 1.9GHz / 4.4GHz 25W Intel® UHD 32 Industrial W-11155MLE 4C / 8T 1.8GHz / 3.1GHz 25W Intel® UHD 16 Industrial Chipset RM590E | QM580E | HM570E DRAM Up to 3 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (96 GByte total) with 3200 MT/s Graphics Integrated Xe Gen 12 graphics with up to 32 EU (Execution Units) | up to 4 independent display units (4x4k / 2x8k resolution) | Enhanced media (AV1/12b) with up to 2 VDBox | Next Gen IPU6 with DPHY2.1 | DP 1.4 Display 3x DP / DP++ | 1x eDP / LVDS Ethernet 2.5 GbE with TSN support via Intel® i226 Ethernet controller series I/O Interfaces 8x PCIe Gen3 | PEG support x16 (PCIe Gen4) 4x USB 3.1 Gen 2 | 8x USB 2.0 | 4x SATA III (6Gb/s) | SPI | 2x UART | 8x GPIO | LPC | I2C Audio HDA interface congatec Board controller Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto Hypervisor RTS Real-Time Hypervisor Temperature Range Commercial: Operating Temperature: 0 to +60°C Storage Temperature: -20 to +80°C Industrial: Operating Temperature: -40 to +85°C Storage Temperature: -40 to +85°C Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. Size 125 x 95 mm² www.congatec.com
Page2

Folie 2

conga-TS570 | SO-DIMM 2 SO-DIMM 1 SO-DIMM 0 11th Gen. Intel® Core™/ congatec PCH-H Xeon®/ Celeron® Board “500 Series Chipset” “Tiger Lake-H” Controller x4 NVMe SSD optional COM-Express Type 6 Connectors www.congatec.com optional CRT DP to VGA optional LVDS/eDP eDP to LVDS DDI (2x) PEG x16 GbE i226 PCIe 0-3 PCIe 4-7 USB3 0-3 USB 0-7 SATA 0-3 TMP 2.0 SPI flash SPI HDA LPC eSPI to LPC SM Bus LID/SLEEP FAN control SER0 SER1 GPIO 0-7 I2C Bus
Page3

Folie 3

conga-TS570 | Article PN Description conga-TS570/i7-11850HE 050700 COM Express Type 6 Basic module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. conga-TS570/i5-11500HE 050701 COM Express Type 6 Basic module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. conga-TS570/i3-11100HE 050702 COM Express Type 6 Basic module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. conga-TS570/6600HE 050703 COM Express Type 6 Basic module based on Intel® Celeron 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. conga-TS570/W-11865MRE 050710 COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. conga-TS570/W-11555MRE 050711 COM Express Type 6 Basic module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. conga-TS570/W-11155MRE 050712 COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range -40°C to 85°C. conga-TS570/W-11865MLE 050713 COM Express Type 6 Basic module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. conga-TS570/W-11555MLE 050714 COM Express Type 6 Basic module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. conga-TS570/W-11155MLE 050715 COM Express Type 6 Basic module based on Intel® Xeon® W-11155MLE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. www.congatec.com
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Folie 4

conga-TS570 | Article PN Description conga-TS570/CSA-HP-B 050750 Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. conga-TS570/CSA-HP-T 050751 Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. conga-TS570/CSP-HP-B 050752 Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TS570/CSP-HP-T 050753 Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are M2.5mm thread. conga-TS570/HSP-HP-B 050754 Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. conga-TS570/HSP-HP-T 050755 Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. conga-TS570/HPA 050756 Standard heat pipe adapter for high performance COM Express module conga-TS570. conga-TEVAL/COMe 3.0 065810 Evaluation Carrier Board for COM Express Type 6 modules. © 2024 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Revision 1.4 – April 3, 2024 www.congatec.com