Vishay Dale Thin Film THJP

THJP www.vishay.com Vishay Dale Thin Film ThermaWickTM Thermal Jumper Surface Mount Chip FEATURES • Electrically isolated thermal conductor • High thermal conductivity AlN substrate Available (170 W/mK) Available • Electrically isolated terminations (> 999 MΩ) • Low capacitance • Available with SnPb or lead (Pb)-free wra p terminations Available • Material categorization: for definitions of complianc e please see www.vishay.com/doc?99912 LINKS TO ADDITIONAL RESOURCES 3D 3 APPLICATIONS D 3D Models Infographics • Power supplies and converters THJP surface mount chips are designed to provide an • RF amplifiers electrically isolated thermal conductive pathway to a groun d • Synthesizers plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum • Switch mode power supplies nitride substrates in both SnPb and Pb-free wraparound • Pin and laser diodes termination styles. The low capacitance of the device make s them an excellent choice for high frequency and thermal • Filters ladder applications. Custom sizes available. FUNCTIONAL APPLICATIONS / CONSTRUCTION CONNECTION OPTIONS Solder coating • Component to heat sink • Component to case • Component to ground plane Nickel termination • Pad to pad • Pad to via Aluminum nitride substrate • Pad to trace HEAT TRANSFER DEMONSTRATION Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to caus e the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumpe r connecting the device to the heat sink. Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction Thermal jumper location Ceramic Resistor Chip Without Thermal Jumper (149.8 °C) Ceramic Chip Resistor With Thermal Jumper (95.5 °C) Revision: 18-Mar-2021 1 Document Number: 60157 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

THJP www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches W L T D D CASE SIZE L W T D 0603 0.061 ± 0.005 0.033 ± 0.005 0.030 ± 0.005 0.015 ± 0.005 0612 0.063 ± 0.005 0.126 ± 0.005 0.030 ± 0.005 0.015 ± 0.005 0805 0.079 ± 0.005 0.047 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 1206 0.126 ± 0.005 0.063 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 1225 0.126 ± 0.005 0.252 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 2512 0.252 ± 0.005 0.126 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 TYPICAL CHARACTERISTICS CASE SIZE 0603 0612 0805 1206 1225 2512 Thermal resistance (°C/W), TR 14 4 13 15 4 15 Thermal conductance (mW/°C), TC 70 259 77 65 259 65 Capacitance (pF) 0.07 0.26 0.15 0.07 0.26 0.07 Dielectric withstanding voltage kVAC, RMS (60 Hz) > 1.5 > 1.5 > 1.5 > 1.5 > 1.5 > 1.5 Note • TR = ------------L------------ k (T • W) where k is the thermal conductivity of AIN, 170 W/mK T = --1C ---- TR STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS Operating temperature range -65 °C to +150 °C Storage temperature range -65 °C to +150 °C STANDARD MATERIAL SPECIFICATIONS Substrate material Aluminum nitride (170 W/mK) Termination (tin / lead) Electroplate tin / lead over electroplate nickel Termination (lead (Pb)-free) Electroplate tin (e3) over electroplate nickel ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 / AEC-Q200 Requirements) ENVIRONMENTAL TEST CONDITIONS LIMITS TYPICAL VISHAY PERFORMANCE Solderability Visual J-STD-002, method B and B1 95 % Acceptable Solder mounting integrity Visual MIL-PRF-55342, method par. 4.8.13.1 Pass / fail Pass Board flex Visual AEC-Q200, method 005 Pass / fail Pass Revision: 18-Mar-2021 2 Document Number: 60157 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

THJP www.vishay.com Vishay Dale Thin Film GLOBAL PART NUMBER INFORMATION New Global Part Numbering: THJP1206AST1 T H J P 1 2 0 6 A S T 1 GLOBAL MODEL CASE SIZE THICKNESS TERMINATION PACKAGING THJP 0603 A = 0.030" B = wraparound Sn/Pb solder BS = BULK 100 min., 1 mult. 0805 with nickel termination 0612 S = wraparound Sn (e3) solder TAPE AND REEL 1206 with nickel termination T0 = 100 min., 100 mult. 1225 RoHS compliant T1 = 1000 min., 1000 mult. 2512 T3 = 300 min., 300 mult. T5 = 500 min., 500 mult. TF = full reel TS = 100 min., 1 mult. TI = 100 min., 1 mult. (item single lot date code) TP = 100 min., 1 mult. (package unit single lot date code) Revision: 18-Mar-2021 3 Document Number: 60157 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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