LLS EVO II

LLS EVO II The flexible load lock platform for deposition of metals, TCOs and magnetic films

LLS EVO II MAIN FEATURES — High throughput deposition of metals, TCOs and aligned magnetic films — Flexibility for single and co sputter for alloys or continuous phasing — Load-lock chamber with additional degas, heating and etch capability — Substrate sizes up to 200x230mm — Accelerated pumping for load lock and main chamber Full of new features to enhance throuphput The LLS EVO II is the flexible load lock platform for deposition of metals, TCOs and magnetic films with a whole host of new features that enhance productivity and reduce materials consumption. Whether its new oval cathode technology for reduced materials costs and particles, next generation magnet systems for enhanced target life, or the new high speed pumping solution, the new LLS EVO II platform raises yields and lowers production costs. Typical nano- crystalline Magnetization loops micro-structure in easy and hard axis of a laminated of a laminated 1μm soft-magnetic CoTaZr film (12x (80nm layer stack, 10x CTZ/2nmAl2O3). Hc = (30nm NiFe21 + 0.15 Oe, Hk = 18 Oe. 2nm C) on 20nm On 8’’ substrates: Ti seed, with a Alignment of easy axis poly-crystalline better than ± 2°, capping layer Uniformity of Hk ± 2.5% 2

LLS EVO II Take a closer look at LLS process capabilities — Cost-effective deposition of soft magnetic multilayers (e.g. NiFe, CoFeB, CTZ, laminated by AlN, Al2O3, SiO2), anisotropy axis orientation by aligning field and/or collimator technologies — High throughput metal and alloy stack despostion including Pt, Au, AuSn, AuZn, WTi, NiTi, Al, Ag, Ti, Ni, Cr — Co deposition from up to three sources for alloys or continuous phasing of materials — Load-lock chamber with degassing. Heating and RF or ion beam etch cleaning capabilities — Long-life-Cathodes for high Ms materials, about 1mm total magnetic film thickness on 8” wafers per target Source Technology - Higher Substrate Handling - Platform Control - rates and better uniformities The choice is yours Keeping you informed than ever Whether you choose full face deposition, LLS EVO II runs on the proven WindowsTM Install up to 5 vertical cathodes in DC, RF, shadow masking or customised edge 7 based graphical user interface displaying mixed DC/RF or Pulsed DC mode. Parallel exclusion, LLS can be configured for either system status and trends, tracking and operation for up to 3 sources enables higher manual load or fully automatic cassette to logging process information, managing alarms rates and allows mixtures or continous cassette handling. and handling recipes. System diagnostics phasing of different materials. Ask us about — Manual loading for complete or mixed including data logging, run reports including the following source options. batches of substrate sizes of 2,3,4,5,6, and RGA data and ‘RAID 1’ mirroring backup all — 8 inch. Change configuration of substrate New oval cathode technology for reduced comes as standard. LLS EVO II complies sizes in just a few minutes materials cost and even lower particle with SECS/ GEM interface protocols and — counts Batch processing of substrates up to supports the drive to delivering new standards maximum size of 200x230mm in environmental control reporting media — “High Energy Cathode” technology — 6 axis automated robot solution with consumption. for improved throughput in high rate cassette buffer, flat/notch aligner and bar metallisation processes ( Al & Al alloys) code reader — High performance magnet systems for extended life in sputter of both magnetic and non magnetic materials 3

LLS EVO II Platform summary ƒ Substrate sizes up to 200mm x 230mm The flexible load lock platform for deposition ƒ Single or mixed substrate size handling of metals, TCOs and magnetic films ƒ Manual or automated cassette loading TYPICAL LAYOUT 3100 CONTROL RACK POWER RACK 1700 3400 ROBOT-HANDLING TYPICAL SYSTEM CAPACITY PER RUN Substrate Size Capacity Maximum substrate (inch) (pcs) thickness (mm) 2 132 16 3 72 14.5 4 36 13 5 30 11 6 12 8.5 8 9 1.3 ABOUT EVATEC Evatec offers complete solutions for thin film deposition Our team is ready to offer process advice, sampling and etch in the Advanced Packaging, Power Devices, services and custom engineering to meet our customers MEMS, Wireless Communication, Optoelectronics and individual needs in platforms from R&D to prototyping and Photonics markets. true mass production. Our technology portfolio includes a range of advanced We provide sales and service through our global network sputter technologies, plasma deposition & etch as well as of local offices. For more information visit us at standard and enhanced evaporation. www.evatecnet.com or contact our head office. Evatec AG Tel: + 41 81 403 80 00 Product descriptions, photos and data are supplied within the brochure for general information only and Hauptstrasse 1a Fax: + 41 81 403 80 01 may be superseded by any data contained within CH-9477 Trübbach info@evatecnet.com Evatec quotations, manuals or specifications. Edition 3 Printed June2020 (Edition 2 first printed Switzerland www.evatecnet.com August 2017, Edition 1 first printed January 2016). EVA_Brochure_LLS_EVO_Edition3_June2020