HEXAGON

PLATFORMS HEXAGON Thin film solutions in FanOut & Wafer Level Packaging

Supporting your technology roadmap in FanOut and Wafer Level Packaging We all want electronic devices that do more and cost less to buy and own… and packaging is key …technology that enables smaller feature sizes, processes highly outgassing organic materials and drives down costs. The new HEXAGON simply gives you more when it comes to thin film processes for WLCSP and FanOut on 200 or 300mm. Choose the new HEXAGON for… ƒ Class leading RC ƒ Best throughputs ƒ Highest seed layer reliability ƒ Lowest consumable costs ƒ Longest kit lives ƒ Smallest footprint 2

“Choose the new HEXAGON for the lowest cost of ownership” 3

It begins with the right DEGAS technology… From cassette to aligner and then degasser, Evatec’s proven front end atmospheric handling robot with dual arm end effector delivers 200mm or 300mm substrates to the critical first step in their process journey. Atmosheric pressure degassing under N2 laminar flow ensures precise substrate temperatures, enables efficient volatiles transport, and avoids the cross contamination seen with vacuum degas processes. “Atmospheric degas is key” Radiation heating Vacuum molecular flow Hot N2 laminar flow ƒ Best temperature Newly introduced substrate uniformity across the wafer Degassed substrate ƒ Best repeatability Vacuum degassing Atmospheric (N2) degassing Basic comparison of batch degassing in vacuum and atmosphere. Desorped ƒ Batch processing (up to 44 wafers) molecules are symbolized as blue vectors. Grey substrates are hot and degassed, blues ones are cold and not degassed. for best throughput Criteria Vacuum Atmospheric ƒ Best degas efficiency Degassing (N2) degassing Complexity – – + Scaling simplicity – + Temperature control (overshoot & uniformity) – – + + Influence of substrate emissivity – – + + Cross contamination – – + + Transport of volatiles – – + + 4

It continues with enhanced ETCH technology… Evatec’s artic etch technology with enhanced pumping performance and new “insitu pasting” reduces wafer pasting frequency and prepares the wafers for the lowest Rc in the industry after downstream metallization. “New generation Artic etch sets the standard” ƒ Improved “within wafer” etch uniformities < 2% ƒ Longest kit life of >20,000 wafers 5

…and it ends with proven METALLIZATION technology 70 years of know how in PVD processes delivers deposition of metallic layers like Cu and Ti with outstanding uniformities and repeatabilities from targets with longer lives and low manufacturing costs. Optimized shield design facilities low particle counts and high power operation in daily production. “PVD technology that drives down costs” ƒ Longest target life ƒ Deposition uniformity better than 2% ƒ Reduced target costs per wafer 6

A tool built for the production environment Flexible platform – configuration with up to 5 process stations Easy maintenance with quick access to all tool areas & services Wafer Handling – up to 90 wafers per hour dry cycle time Evatec XPERIENCE – Software that keeps you firmly in control 7

HEXAGON HEXAGON is the ideal solution for processing of the latest generation ICs, organic passivated- or reconstituted (mold) wafers. Evatec is the market leader in UBM & RDL metallization. ABOUT EVATEC Evatec offers complete solutions for thin film deposition Our team is ready to offer process advice, sampling and etch in the Advanced Packaging, Power Devices, services and custom engineering to meet our customers MEMS, Wireless Communication, Optoelectronics and individual needs in platforms from R&D to prototyping and Photonics markets. true mass production. Our technology portfolio includes a range of advanced We provide sales and service through our global network sputter technologies, plasma deposition & etch as well as of local offices. For more information visit us at standard and enhanced evaporation. www.evatecnet.com or contact our head office. Evatec AG Tel: + 41 81 403 80 00 Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded Hauptstrasse 1a Fax: + 41 81 403 80 01 by any data contained within Evatec quotations, manuals or CH-9477 Trübbach info@evatecnet.com specifications. Edition 3: Printed May 2022, (Edition 2: First printed Aug Switzerland www.evatecnet.com 2017, Edition 1 first printed Sep 2015). EVA_Brochure_HEXAGON_Edition3_May2022