CLUSTERLINE 200/300

PLATFORMS CLUSTERLINE® FAMILY A flexible family of 200mm and 300mm cluster tools

THREE REASONS TO CHOOSE CLUSTERLINE® 1 PROVEN PLATFORM RELIABILITY CLUSTERLINE® is a high volume single wafer processing production solution enabling integration of PVD, highly ionized PVD, Soft Etch and PECVD process technologies. Let CLUSTERLINE® do the work - from deposition of highly aligned magnetic films to high performance AlN (NanoSmooth™), or high aspect ratio TSV metallization in Advanced Packaging. You can rely on Evatec engineers to deliver proven hardware, proven processes and the advanced substrate handling capabilities you will need for today and tomorrow. 2 PROVEN HANDLING — Advanced vacuum, wafer handling and “in situ” alignment for the most accurate wafer placement in the industry — Direct thin wafer handling down to 70μm and 6mm bow with carrier solutions for even thinner wafers — Bridge or Split Tool capability 2

CLUSTERLINE® THREE REASONS TO CHOOSE CLUSTERLINE® 3 PROVEN PVD KNOW-HOW Proven process capabilities come as standard when you choose CLUSTERLINE® and extensive pre and post- treatment steps can be added just as you need them. Take a closer look at the CLUSTERLINE® family process capabilities 1. 2. 5. 6. 7. 3. 4. 8. 9. 1. BAW/SAW 3. BACKSIDE METALLIZATION 6. THIN FILM HEADS — Extremely uniform and smooth piezoelectric & THIN WAFER PROCESSING — Dielectric layers, Al2O3 , AlN, SiO2, SiC, a-C AlN layers with high degree of crystalline — Wafer handling design assures defect-free — Conductive seed layers, Cr, Cu, Ta, TaN, W, Ru orientation at controlled levels of stress for front side — NiFe, CoFe, CoNiFe with magnetic resonators, reflectors and electrodes, e.g. — Bare wafers, thin wafers on carriers or alignment AlN, AlScN, ZnO, Ti-Mo, Ti-Pt, Al, Al alloys, TAIKO wafers < 50μm W, SiO2, Si3N4, PZT — Stress control, e.g Al-Ti-NiV-Ag, Ti- NiV-Ag/ 7. MEMS Au, Cr-Ni-Ag/Au, AuAs-Ag-NiV-AuGe — System flexibility enables full process 2. WAFER LEVEL PACKAGING — Complete solution with “in-situ” pre-etch support for niche applications including — UBM/RDL for WLP production solutions, and contact anneal at 45 wafers/hour sensors and biomedical applications, e.g. e.g. Ti-Cu, TiW-Cu, TiW-Au, TiW(N)-Au,Ti- Ni, Pt, NiFe, NiCr, SiCr, TaN, ITO, TiOxNy and NiV-Cu, Al-NiV-Cu at throughputs up to 60 4. LED dielectrics SiC, AlN, SiO2, Al2O3, TiO2, TiC, wafers/hour — Lattice matching AlN layer (NanoSmooth™) Ta2O5, Si3N4, PZT — Integrated Passives: TaN, SiCr resistors, Cu between wafer and GaN coils, NiFe, CZT, laminated magnetic cores, — Metal deposition for barrier, contacts and 8. INTEGRATED PASSIVE DEVICES BST/ PZT capacitors solder materials — Resistors with low TCR, e.g. TaN, NiCr, SiCr — 3D/TSV (Through Silicon Via) with AR up to — Passivation layers e.g. SiNx, SiOxNy — Laminated magnetic cores for couplers, 15 coils and inductors — Organic/mold substrates (Fanout, InFo) 5. WIRELESS with batch degasser and low temperature processing — Active compound semiconductor devices 9. IC INTERCONNECTS — Thin wafer processing on carriers or TAIKO — Low temperature backside via metallization — Multi-level metallizations including barrier wafers of contact layers & barriers e.g. TiW- layers, liners, plugs, planarization and ARC, Au, AuGe, Ti/TiW(N)-Au, TiW-Al, stress e.g.Ti-TiN, Ti-Al alloy, TiN optimized Cr-Ni- Au, Pt, AuZn, AuSn — Throughput up to 50 wafers/hour (Align- degas- etch- 30nm Ti- 500nm Al- 150nm ARC TiN- cool) 3

CLUSTERLINE® 200 Proven deposition processes for piezoelectrics, magnetic layers, metals and dielectrics CHOOSE CLUSTERLINE® 200 FOR: — LED — MEMS — WIRELESS — BACKSIDE METALLIZATION & — THIN FILM HEADS THIN WAFER PROCESSING PLATFORM FEATURES – Dedicated solutions that give you the edge From the modular chuck design for rapid exchange between 100,150 or 200mm formats to the twin high speed load locks or the Windows interface and SEMI SECS/ GEM compliant interface, CLUSTERLINE® 200 ensures maximum tool utilisation and full fab integration. — A uxiliary module functions including wafer alignment, degassing, cooling, six-slot buffer, DMC/ID reader. — T wo load lock cassette stations with auto-home, featuring ergonomic loading, soft pump and soft vent, mapping functions to detect cross-slotted, double-loaded wafers, instant wafer slide out (protrusion) detection. — M odular chuck design for fast size and configuration conversion (4”, 5”, 6” and 8”). — 1 00/150/200 bridge or split tool capability. 4

CLUSTERLINE® CLUSTERLINE® 200 BRINGS YOU: — PVD, high energy PVD, Soft Etch or PECVD process technologies on substrates up to 200mm — Up to 6 Process Modules plus additional auxiliary modules for alignment, cool or degas, buffer or “in situ” metrology — Direct thin wafer handling and processing capability for thicknesses down to 70μm and wafer bow up to 6mm — Open system architecture, easily configurable and expandable PROCESS MODULE CAPABILITIES - A dedicated solution just for your application Evatec offers a range of degas, etch and high uniformity deposition technologies with “in situ” Advanced Process Control (APC) capability that gives you the edge in throughput and yield. Ask our application engineers about a solution that’s just right for you. — RF and DC planar magnetron sputter sources with specific magnet solutions for extremely high film uniformity and homogeneity and alignment of magnetic films. — Rapid degas and cool module for wafer conditioning and enhanced process throughput — ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2 and O2 is available. MSQ200 with 4 different targets — Multisource Quattro with rotating chuck (clamped/clamp less) with up to four sources on one module for single target or simultaneous co-sputtering using RF, DC or RF/DC superimposed sputtering. — PECVD process module featuring a separate reactor within the process chamber to provide enhanced uniformity, film purity and control of doping. “In situ” cleaning technology takes away the usual requirement for the frequent cleaning needed in standard reactors. — Highly ionized PVD source technology for high aspect ratio TSV applications - mainly for 3D packaging and MEMS. — Substrate chucks can be configured for either configured as ESC, clamp less or clamped setup using gas conduction for active wafer cooling or heating in PVD and or ICP soft etch modules. Chuck RF Bias is an option. Chuck temperatures controlled from -30°C up to 800°C, specific Carbon Heater solutions for up to 800°C (Sapphire) or 860°C ( Silicon) in the deposition of high performance AlN (NanoSmooth™ process) or PZT. MSQ 200 with shutter installed 5

CLUSTERLINE® 300 UBM/RDL, TSV, Fanout and High Speed Backside Metallization Processes CHOOSE CLUSTERLINE® 300 FOR: — WAFER LEVEL PACKAGING — BACKSIDE METALLIZATION & THIN WAFER PROCESSING PLATFORM FEATURES - ATMOSPHERIC FRONT END - All the performance you need for Advanced Reliable handling each and Packaging and Backside Metallization processes every time in 24/7 production Building on the know how from CLUSTERLINE® 200, the 300mm tool Atmospheric front end handling in a Class 1 mini environment by four integrates rapid atmospheric front end handling and advanced new axis robot with standard options including heating or cooling, wafer process components for AP and BSM applications whilst retaining inverter, active wafer centering and buffering means perfect delivery of flexibility for 200mm wafer handling. Just like all the CLUSTERLINE® each and every wafer in 24/7 production. family, easy operating Windows based handling and SEMI SECS/GEM — BROOKS JCP AFEM with up to four FOUP load-port cassette compliant interface come as standard. stations, with mapping functions to detect cross-slotted, double- — High volume 300mm tool with Split or Bridge Tool capability for loaded wafers, with instant wafer slide out (protrusion) detection at 200mm wafers. cassette stations. — Six dedicated SEMI standard interfaces for process modules, — Vision™ Load Port Modules with 300mm FOUP load ports or open three configurable interface modules (either single or dual airlock cassettes for 200mm. configuration) for e.g. six slot buffer, cooler or degasser. — Wafer aligner (RAZOR™) for rotational pre-alignment (0.3°) and — Mini environment with 300mm FOUP load ports or open cassettes centering of wafers (0.05mm). for 200mm. — Wafer flip station for back side metallization. 6 — Buffer station for up to 12 wafers.

CLUSTERLINE® CLUSTERLINE® 300 BRINGS YOU: — PVD, high energy PVD and soft etch process technologies on substrate sizes up to 300mm — Direct thin wafer handling and processing capability for thicknesses down to 300μm and wafer bow up to 4mm — “Arctic” dome and chuck capability for stable Rc processes on organic wafers PI/PBO PROCESS MODULES / COMPONENTS - Dedicated source technologies deliver high efficiency Rc and TSV metallization processes — The PVD module comes with either DC or pulsed DC sputter source with uniformity compensation over target life. Chuck tops are available either in metal or ceramized versions, and either with mechanical clamping, ESC with shadow mask and gas conduction back side heater/cooler for precise temperature control or clamp less chuck with shadow mask. Controlled chuck temperature is available from -30°C up to 500°C, optional chuck RF Bias. — WAFER LEVEL PACKAGING Suitable for reactive processing with N2 or O2. — ICP soft etch process module with MF Plasma enhanced RF Etch enabling — BACKSIDE METALLIZATION & THIN WAFER PROCESSING high etch rate (SiO2 removal 0,6 – 0,8 nm/s) and excellent uniformity at low bias voltages. Reactive processing with H2 and O2 is available. — For special heat treatment a separate hot chuck Degas Module or Radiation Degasser source is available. — High Pressure Degasser module (wafer at ~140°C in ~10sec with He up to 20mbar, max 180°C). — Optimized configuration for organic/mold substrates which comes with Arctic Atmospheric front end metal cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO. — Atmospheric Batch Degasser integrated in AFEM with 44 slots allowing continuous degassing of advanced packaging substrates. — Highly ionized PVD source technology for high aspect ratio TSV applications mainly for 3D packaging. — Multisource with rotating chuck - up to 4 RF or DC sources on one module for single target or simultaneous sputtering. Process modules with Proven wafer handling easy access — Optional APC with fully integrated Pyrometer. 7

CLUSTERLINE® The CLUSTERLINE® series provides state-of-the-art process capabilities as well as extensive pre- and post-treatment steps. The open system architecture allows easy tool configuration for PVD, highly ionized PVD, and Soft Etch for wafer sizes up to 300mm. TYPICAL LAYOUT - CLUSTERLINE® 200 TYPICAL LAYOUT - CLUSTERLINE® 300 2900 5300 3700 4500 ABOUT EVATEC Evatec offers complete solutions for thin film deposition Our team is ready to offer process advice, sampling and etch in the Advanced Packaging, Power Devices, services and custom engineering to meet our customers MEMS, Wireless Communication, Optoelectronics and individual needs in platforms from R&D to prototyping and Photonics markets. true mass production. Our technology portfolio includes a range of advanced We provide sales and service through our global network sputter technologies, plasma deposition & etch as well of local offices. For more information visit our website at as standard and enhanced evaporation. www.evatecnet.com or contact our head office. Product descriptions, photos and data are supplied within the Evatec AG Tel: + 41 81 403 80 00 brochure for general information only and may be superseded by any data contained within Evatec quotations, manuals or Hauptstrasse 1a Fax: + 41 81 403 80 01 specifications. CH-9477 Trübbach info@evatecnet.com Edition 5 April 2023 (Edition 4: first printed December 2021,Edition 3 first printed Aug 2017, Edition 2 first printed Switzerland www.evatecnet.com Jan 2016, Edition 1 first printed Sep 2015). EVA_Brochure_CLUSTERLINE_FAMILY_Edition5_April2023