CLUSTERLINE 600

PLATFORMS CLUSTERLINE® 600 Large area cluster tool for single panel processing

CLUSTERLINE® 600 EVATEC’S ALL IN ONE SEED LAYER SOLUTION FOR PANEL LEVEL PACKAGING Miniaturization and lower cost are driving the demand for Panel Level Packaging. Evatec’s process know-how in Advanced Packaging enables customers around the globe to cope with these challenging developments and demands. Low contact resistance (Rc) and excellent adhesion of the deposited seed layers combined with low particle generation are some of the major achievements of the CLUSTERLINE® 600 that set the benchmark in the market segments for IC-Substrates and FOPLP. 2

CLUSTERLINE® 600 Next generation FOPLP IC-Substrates ƒ IC-Substrate ƒ Low Density Fan Out Product ƒ Embedded dies ƒ High Density Fan Out ƒ Substrate-like PCB ƒ Fine line interconnects with ƒ Wide adoption for PMIC and RF roadmap down to 2µm L/S ƒ New potential for High Density Fan Out for APs ƒ Embedded die technologies and heterogenous integration (CPU, memory) Market Trends ƒ FO on substrate ƒ Push to FOPLP as supporter of cost reduction ƒ PVD becomes crucial to support roadmap and heterogenous integration roadmap as chemical Cu alternative ƒ Seed Layer deposition ƒ Seed Layer deposition ƒ TGV seeding ƒ Reactive Ion Etching (RIE) Device Technology ƒ Reactive Ion Etching (RIE) ƒ Nano-Descum ƒ Nano-Descum ƒ Deep Etching ƒ Degassing organic substrates ƒ Physical Argon etching ƒ Reactive Ion Etching Process / Application ƒ Harsh chemical etching ƒ Sputtering seed layer metals (e.g. Ti and Cu) ƒ DC or DC pulsed ƒ Reactive sputtering 3

THE WORKHORSE FOR PANEL LEVEL PACKAGING CLUSTERLINE® 600 is qualified at the major OSATs and IDMs for Panel Level Packaging. It enables the latest technologies on panel sizes up to 650 x 650mm. IN ATMOSPHERE TRANSITION IN VACUUM HANDLING BATCH DEGASSER COOLING CCP ETCH PVD SPUTTER Tailormade handling Atmospheric batch After degassing, Evatec etch Evatec cathode packed with quality degassing is ideal for the substrates technology ensures technology combines control features for repeatable accurate are transferred to ideal interface high uniformity with safe manipulation outgassing of organic vacuum. Cooling preparation for excellent target of substrates from substrates. during the transition subsequent PVD utilisation and thermal cassette or buffer, ensures enough processes management within through the process thermal budget for the → Maximize adhesion strict substrate and back again. subsequent process → Minimize R temperature limits. steps. c 4

CLUSTERLINE® 600 5

DEGAS ETCH SPUTTER DEGASSING Repeatable and reliable outgassing of organic substrates The atmospheric batch degasser (ABD), where a batch of substrates are simultaneously degassed in multiple heated slots with nitrogen laminar flow, is the preferred solution for organic substrates (e.g. AMC, ABF, PID, PI, etc.). The advantages of the atmospheric batch degasser are: ƒ Panel slots with individual N2 laminar flow for: - fast and precise temperature control of substrates (conductive heating) - emissivity independent temperature control (no overheating and no local hot spots) - transporting volatile compounds away from the substrates (no re-contamination) ƒ Smart design for easy access and maintenance 6

CLUSTERLINE® 600 “EVATEC PATENTED ABD TECHNOLOGY ELIMINATES THE RISK OF LOCAL OVER HEATING” ATMOSPHERIC BATCH THE BENEFITS OF DEGASSING OFFERS: ATMOSPHERIC DEGASSING ƒ Fast and precise temperature control Diffusion of volatile components from the bulk material to the surface is driven by ƒ Outstanding temperature uniformity temperature and time. Desorption is driven by the concentration gradient which is ƒ Nitrogen laminar flow for transporting the same whether desorption takes place in vacuum or in atmosphere. However, volatile compounds the advantage in atmosphere is that the concentration gradient can always be kept ƒ Sufficient time for diffusion of volatile high if a laminar flow of inert gas is applied, while in vacuum the degassing of the compounds and moisture volatile components has to take place by less efficient molecular diffusion. Radiation heating Vacuum molecular flow Hot N2 laminar flow Newly introduced substrate Degassed substrate Vacuum degassing Atmospheric (N2) degassing Basic comparison of batch degassing in vacuum and atmosphere. Desorbed molecules are symbolized as blue vectors. Orange substrates are hot and degassed, blue ones are cold and not degassed. 7

DEGAS ETCH SPUTTER ETCHING Perfect for large area panel processing Removing native oxides and preparing the substrates’ successfully in balance. interface are the major reasons for etching in Advanced Just as important, non-moving parts and a static substrate Packaging. Low Rc and superior adhesion of the sputtered during processing avoid unwanted particle generation and seed layer are the results. yield losses. Leveraging our patented plasma source design, Evatec’s The CLUSTERLINE® 600’s CCP Etch Modules are capable process know-how on CLUSTERLINE® 600 uses dual of providing physical (Ar-sputter Etch) or chemical etch frequency CCP with a high and a very high frequency processes (CHF3, C3F8, CF4, O2, N2+H2, Ar+H2, etc.) or a controlling plasma density and ion bombardment. Etch combination of these in one module using our long history rates, uniformity and thermal budget can all be kept of process know-how. “DUAL TAKE A LOOK AT THE RESULTS Panel size: 600 x 600, 36 SiO2 chips, measurement EE = 20mm FREQUENCY CCP ETCH AND NO MOVING PARTS DURING PROCESSING GUARANTEE BEST IN CLASS ETCH RESULTS” 8

CLUSTERLINE® 600 Features and benefits Dual frequency benefits ƒ DC bias (ion bombardment) adjustable with frequency combination ƒ Directional etching is possible (anisotropic etching) ƒ Very good for directionality and small features ƒ Uniformity control easier (one plasma source) Reactive ion etching benefits ƒ Same tool can perform chemical and physical etch by different gas and frequency combinations ƒ Comprehensive library of process data for RIE ƒ Development of DRIE for deep etch applications (same module, additional gases) Low pressure regime benefits ƒ Long free path ƒ High directionality of ions (anisotropic etching) ƒ Uniform etch rate ƒ Ideal for small and narrow structures 9

DEGAS ETCH SPUTTER SPUTTERING Superior seed layer adhesion and uniformity Benefit from Evatec’s long history in delivering tailormade PVD based metallization processes to the semiconductor industry. Rotating cathode sputter technology delivers excellent film uniformity over large areas, and just like for etch processing, static panels during deposition avoids particle generation. The benefits of rotating target technology ƒ Best panel cooling due to combination of steady substrate during process and superior target cooling ƒ Excellent deposition uniformites by innovative moveable magnet bar technique ƒ Production proven technology ƒ No redeposition areas above panel ƒ Design for rapid cathode maintenance using motorized drawer concept TAKE A LOOK AT THE RESULTS 10 x 10 points were measured by 4-point probe Ti deposition Cu deposition 10

CLUSTERLINE® 600 “ROTATING TARGET TECHNOLOGY OFFERS LONGEST TARGET LIFE FOR LOWEST COST OF OWNERSHIP” 11

HANDLING Advanced control for safe production Evatec’s long experience in delivering systems of cluster architecture with fully automated robot handling means you can be confident of secure and robust handling all the way from FOUP or cassette through processing and back again. The systems and control features on the CLUSTERLINE® 600 are designed specifically for panel handling in particular, and of course, the system is SECS / GEM compliant for fab integration. 12

CLUSTERLINE® 600 LP LP LP LP Atmospheric Front End Module ABD AFEM (AFEM) Front End Robot ITM The robot handles movements in and out of the FOUP, the batch degasser (ensuring “first in first out” processing) and to and from the system Interface Transfer Module (ITM) via any intermediate test stations required. Handle glass, EMC, CCL, FR4 and other thin substrates direct or on carriers according to your application. LP LP LP LP TRANSFER Cooling and pumping ABD AFEM Evatec’s elegant 2 stage architecture brings benefits in both process control and throughput: ITM ƒ Most efficient pumping and suffcient cooling time increases thermal budget prior to next process steps VTM ƒ Faster 2 stage pumping to reach base pressure prior to transfer to the central Vacuum Transport Module (VTM) ƒ Seperated air locks for Panel In and Panel Out ƒ Space for additional panels in vacuum e.g. for pasting Vacuum Transfer Module Our 6 sided transfer module is equipped with dual robot arm allowing integration of up to 5 process modules. Additional flanges for RGA are available on all process modules. Features & benefits ƒ Robust and safe handling for production - up to 3.1kg payload - up to 12mm handling warpage/sag/bow - semi S2 and S8 compliant ƒ Fully SECS / GEM compliant ƒ Additional features possible - e.g. ionizer, in-situ warpage measurement, RFID reader ƒ Advanced positioning system (APS) 13

PRODUCTION PERFORMANCE LET EVATEC BE YOUR GUIDE Securing production for today Combining innovations in panel handling together with CLUISTERLINE® 600 is a tool designed for daily careful selection of source designs and our many years production. You can be sure of excellent adhesion and low process know-how in degas, etch and PVD technology Rcs in processes like FOPLP at the levels seen in wafer eliminates risk. CLUSTERLINE® 600 is already qualified at based processes. Robust handling and efficient process several OSAT and IDMs. flow ensure run rates of 24 panels per hours. RUN RATE 24 panels per hour ADHESION > 1000 N/m Seeding Ti+Cu on different PI films (DuPont, Process: 40’ degas at 120C, 20nm etch, 100nm etc.) and ABF materials (GY50, GX-T62, etc.) Ti, 200nm Cu Seed layer deposition with CLUSTERLINE® 600 Substrate: 500µm thick EMC or ABF build up; system → electroplating → post-baking (for ABF) good emissivity towards the chuck; maximum → thermal cycle test → machine peel test for temperature permitted 120ºC adhesive bond evaluation Rc < 1 mOhm ROBUST HANDLING Single Kelvin structures; via diameter = 30µm; Up to 12mm sag/bow on end effector dielectric thickness or via height = 8µm; PBO High payload up to 3.1kg passivated; In-situ warpage measurement 40 minutes Degas, 20nm Etch (SiO2 equ.), 100nm Ti, 300nm Cu; Alignment station in AFEM Advanced alignment features CLUSTERLINE 600® – Giving you the lead in production  Avoid particles with static panels during etch and deposition processes  Manage thermal budget with innovative system and process design  Reduce production cost with high utilization of rotatable tube targets  SEMI-like system architecture and features  Fully SECS / GEM integrateable 14

CLUSTERLINE® 600 Working on the capabilities needed tomorrow Today, the CLUSTERLINE® 600 is the benchmark for all in one Seed Layer sputtering in FOPLP and IC-Substrate manufacturing. Evatec is working on the next generation of process capabilities with selected customers and partners. Thanks to its cluster-type system architecture, new capabilities and features can easily be integrated to the CLUISTERLINE® 600 as they become available. 15

CLUSTERLINE® 600 Large area cluster tool for single panel processing Technical Information ƒ Processing area: 600mm x 600mm ƒ Degas temperature: 120°C ± 10°C (BKM) ƒ Panel size up to: 650mm x 650mm ƒ Panel temperature in process typically <100°C ƒ Maximum panel weight: up to 3.1kg ƒ Excellent Rc results ƒ Up to five process modules ƒ Excellent adhesion of Seed Layer on substrates ƒ Up to 24 panels per hour (panel sides) ƒ Excellent uniformity results ƒ Up to two Atmospheric Batch Degasser (ABD) ƒ Reactive Ion Etch (RIE) option ABOUT EVATEC Evatec offers complete solutions for thin film deposition Our team is ready to offer process advice, sampling and etch in the Advanced Packaging, Power Devices, services and custom engineering to meet our customers MEMS, Wireless Communication, Optoelectronics and individual needs in platforms from R&D to prototyping and Photonics markets. true mass production. Our technology portfolio includes a range of advanced We provide sales and service through our global network sputter technologies, plasma deposition & etch as well of local offices. For more information visit us at as standard and enhanced evaporation. www.evatecnet.com or contact our head office. Evatec AG Tel: + 41 81 403 80 00 Product descriptions, photos and data are supplied within the brochure for general information only and Hauptstrasse 1a Fax: + 41 81 403 80 01 may be superseded by any data contained within CH-9477 Trübbach info@evatecnet.com Evatec quotations, manuals or specifications. Edition 2 Printed December 2021 (Edition 1 Printed Switzerland www.evatecnet.com July 2020) EVA_Brochure_CLUSTERLINE®600_Edition2_December2021