BAK/Multi BAK

PLATFORMS BAK Evaporator family

THE BAK A new generation Taking the best from the past and expanding your horizons for the future! Welcome to the latest generation BAK evaporator – a family of platform sizes and geometries taking all the best from the tried and tested BAK generations before, and extending your capabilities with new sources, new process control options and new handling solutions – from fully manual load in the BAK 501 to full robot calotte load in large systems. The BAK1401 – ready to support your mass production challenges BAK 501 – manual Large BAKs – option for calotte load / unload via robot 2

BAK EVAPORATOR FAMILY More than 2000 BAK systems delivered worldwide 3

THE BAK Just the right size The BAK batch coater delivers thin film deposition and etch capabilities for precision optics, optoelectronics and semiconductor applications to customers around the globe. From deposition of multilayer dielectrics and metals to TCOs or whole range of compounds, it can be configured just the way you need for directional coating, enhanced thickness uniformities and the tightest optical, mechanical and environmental specifications. Our applications specialists are here to help you identify just the right platform in our range between 0.5 metres and 1.5 metres according to your throughput and processes. The new generation BAK family brings you the complete solution including processes and substrate handling know-how on a platform with proven production reliability for the best ever cost of ownership. “For the best cost of ownership” BAK 501 641 761 901 1101 1401 2” 47 95 152 186 216 330 3” 20 36 64 88 104 167 4” 9 24 40 51 64 104 6” 5 9 18 23 24 47 8” 3* 6 9 10 16 28 Substrate capacity by machine type (full calotte) 4 *with planets

BAK EVAPORATOR FAMILY LEADING THE WAY with Advanced Process Control (APC) Full automation through pump down, process and vent and full data logging functionality on Evatec’s “KHAN” system and Process 1. Layer process controller make production and quality control easier Start deposition than ever. The information is displayed ergonomically and still represents the benchmark in the industry for evaporators. The reoptimisation 2. Check Host communication follows the protocols based on GEM spectrum loop and SECS-II standards. Well established Advanced Process Control (APC) Process 3. Recalculate remaining techniques like broadband optical monitoring with “real time layers or continue End without changes in-situ process reoptimization” increase yields for the most demanding optical stacks. In-situ process reoptimization enables tighter optical tolerances Hybrid monitoring raises the bar even further In recent developments, hybrid monitoring solutions allow switch between monochromatic and broadband modes for different layers within a stack for the ultimate in process control. Due to absorption, the amplitude of the extrema is decreasing. However, by tracking the extreme values and the time between them, the layer termination can be triggered accurately at the intended thickness. Monochromatic monitor signal (reflectance at 906nm) of an absorbing layer material deposited in a BAK tool UNICALC shaper optimization solutions enable fast track development of efficient dielectric and metals deposition processes for optoelctronics and semiconductor applications, optimize thickness uniformity over the calotte, increase your throughputs and reduce your precious metals consumption costs. Unicalc fast track shaper development for reduced materials consumption 5

THE BAK Just the right geometry The standard BAK chamber is just the starting point for a whole series of custom production solutions. Your BAK can also be delivered with “Lift Off” geometry where the source is lowered, and for the ultimate flexibility in deposition geometry we offer solutions for simple manual or motorized adaptation of geometry in the same chamber. For handling of the most reactive coating materials or the very fastest cycle times, a “split chamber” variant enables the sources to be isolated in their own vacuum chamber and kept ready during main chamber vent, and for high uniformity “in-situ” deposition & etch capability the chamber back can be extended to enable installation of movable ion sources. Irrespective of the geometry, all our platform variants are engineered for rapid source access, replenishment and easy use with comfortable operator access for maintenance and repair. Platform geometry Typical applications ƒ High rate metallization Standard throw ƒ Optical interference coatings ƒ TCO deposition e.g. ITO ƒ Extended throw optimized for “Lift Off” processes “Lift Off” ƒ SAW / BAW / Laser Bar device ƒ “Reactive” coating materials Split chamber ƒ Special doping processes Rear extension ƒ Combined deposition and etch “The most flexible BAK series ever built” 6

BAK EVAPORATOR FAMILY “Our engineering team has the solution” 7 7

BAK A BLUEPRINT FOR SUCCESS Process chamber A tried and tested chamber design, extendable for different process geometries, flexible for different source configurations. Ready for whatever the future brings. Sources Choose from our biggest ever range of sources from deposition to custom etch, e-guns to effusion cells, barrel sources to boats. With closed loop process control to ensure the right thin film result every time. 8

BAK EVAPORATOR FAMILY BAK A BLUEPRINT FOR SUCCESS Pumping system Pumping configurations according to your preference. Turbomolecular, diffusion or cryopumping. Tailor-made to bring you the best process results and highest production throughputs. Custom tooling Custom tooling for optics, optoelectronic and semiconductor processes. Manual handling or cassette-to-cassette with automated robot handling. With the BAK there is always a solution. Process controller An integrated system and process controller built around a robust industrial server, SEMATECH compliant, with intuitive handling for operators, process engineers and maintenance. Fully prepared for whatever sources you introduce. 9

THE BAK SOURCES & LAYER THICKNESS CONTROL Your BAK is prepared for installation of a whole range of deposition and etch sources including accessories like front and backside heating systems. The chamber base “Tighter process plate and side walls come with a series of standard feedthroughs enabling installation of the combinations of deposition and etch sources required for layer processing. tolerances than ever” All our sources are engineered for 24/7 production, robust and easy to maintain, optimized for the lowest materials utilization and the best repeatability. As process requirements change in the future, simply reconfigure your system by moving, exchanging or adding new ones, reconfigure your “KHAN” control system in just a few minutes and you are ready to go. Control rates and terminate your layers with Evatec’s QCM quartz monitoring technology at 5 or 6 MHz featuring high sampling rates, high speed switch between crystals and simultaneous control of up to 4 quartz heads from a single controller. For real time direct measurement of optical layer performance during deposition choose QCM Crystal monitoring system for multi head control monochromatic, broadband or hybrid according to your process requirements. 10

BAK EVAPORATOR FAMILY Maximise your process performance by choosing from our widest ever range of sources. From simple thermal boats and high capacity barrel sources to effusion cells, E-Guns and etch sources. Thermal E-Guns Wire Feeder Evaporation From 1 to 60 Two position wire Standard and pocket, single or feeder for source custom designs for co-evaporation, for replenishment complex substrate dielectrics, metals in thick layer geometries and and TCOs deposition a large variety of coating materials Barrel Source PIAD Effusion Cells A range of source Improved Complex alloying volumes for film qualities, processes and deposition of very lower process processing of very thick layers temperatures and low vapor pressure shorter process materials at up to times 2000°C Etch Heating Glow Round and Combined Discharge moveable linear front and /or 700W or 2000W sources for high backside heating according to rate, accurate for process application in-situ deposition temperatures up and etch to 350°C processes From multilayer optical stacks with edge tolerances <1nm to ultrathin precious metal layers and co-evaporation of alloys there is a BAK process control solution that fits. Quartz Monitoring Single, 6, or 12 way quartz with increased sampling rates for termination accuracy in single and co-deposition processes KHAN KHAN is the well-established and proven closed loop Optical Monitoring control system of the BAK. It supports a large range of UV to IR, processing and measuring equipment for a customer monochromatic specific tool configuration. Its functionality includes or broadband, test co-evaporation of multiple sources, process statistics, glasses or direct run protocols, parameter tracking and a SECS/GEM substrate measurement interface for a host integration. 11

TOOLING TOOLING that makes the difference Complete freedom with “Flexcalotte” “LOPS” - Planetary for “Lift off” “Flip” calotte for double sided processes 2 axis rotation – individual axis control with 2 axis rotation 12

BAK EVAPORATOR FAMILY Evatec’s portfolio of tooling solutions is designed Example of optimized capacity based to maximize batch capacity for evaporation on tooling choice for BAK 761 processes without compromise on film quality. Choose from single piece and segmented domes Substrate Substrate handling with standard or “lift off” geometries or flip size systems for double sided processes. For high 4 segments 3 segments Knudsen rate metallization our range of planetary system 3” 64 72 123 designs enable larger batch sizes and lowest material utilization and for complex substrate 4” 40 39 78 geometries our engineering department offers a bespoke design service. 6” 16 18 33 8” 8 9 15 Classic “Knudsen” planetary drive “Flip” planetary system for Complete custom engineering with 2 axis rotation double sided coating e.g. variable angle deposition “For the best cost of ownership” 13

THE MULTI BAK NEW THINKING IN EVAPORATION TECHNOLOGY Evatec has long know-how in evaporation, vacuum load lock and automated handling technology for processing of 6 and 8 inch wafers, but now it’s time to put them together in a new way in evaporators delivering improvements in throughput and process repeatability. Available either with manual calotte load for a single load lock / process chamber, or as cassette-to-cassette configuration with atmospheric robot handling when integrating up to 4 process modules. MULTI BAK For large volume manufacturing, integrating up to MULTI BAK 4 tools in a cluster like configuration, the MULTI BAK offers even more: ƒ Front end automation of wafer loading, (6 or 8 inch) direct from cassette to segment and then from segment to calotte in a controlled environment eliminating risk of operator errors and reducing risk of particles / wafer damage or breakage ƒ Automated management and tracking of substrate journey ƒ Wafer ID reading on the fly ƒ Tracking of each and every wafer to an individual location / segment / process batch ƒ Automated management of return of wafer to same cassette and location within the cassette after processing ƒ Optional: Automated handling of 2 inch monitor wafers for each and every batch. This includes placement of monitor wafers within a segment prior to coating plus retrieval and presentation of monitor wafers after coating to separate carriers alongside each cassette. Front end now available with SMIF load ports Watch the ƒ Even lower particle levels MULTI BAK video ƒ Fully automated fabs Imagine increasing production output by 70% for a single tool 14

BAK EVAPORATOR FAMILY BAK 911 The BAK 911 provides the next step in thin film production BAK 911 with manual solutions for building on the advantages of split chamber systems: segment loading and removal ƒ Not just source chamber, but also the complete process chamber remains under vacuum continuously, delivering the most stable process environment possible for even greater levels of process repeatability when required ƒ The only elements entering and leaving the process chamber during production are segments loaded with wafers. These enter and leave the process chamber via a load lock transfer module (LLTM) ƒ Rapid pump and transfer in this step offers a great opportunity to make additional overall gains in throughput ƒ Just as in the Split Chamber, sources replenished by wire feeder remain continuously under vacuum in a “ready state” for the highest stability. Opening of the process chamber itself is then limited to periodic maintenance such as shield change Watch the BAK 911 video ƒ An operator loads and unloads the uncoated and coated segments at the front end 15

BAK FAMILY With new levels of flexibility, and new levels of process control the BAK Evaporator is the industry leader in selected applications across Power Device, Wireless, LED, MEMS and Photonics applications. There is a BAK that is suitable for everyone - from the compact BAK 501 for universities and research institutions to the BAK 1401, a production giant. BAK - The industry standard 2000 4150 Service Area Typical layout for the BAK 761* – an industry standard. Contact us for detailed specifications and layouts for all BAK sizes. *Approximate sizes for illustration only 2000 ABOUT EVATEC Evatec offers complete solutions for thin film deposition Our team is ready to offer process advice, sampling and etch in the Advanced Packaging, Power Devices, services and custom engineering to meet our customers MEMS, Wireless Communication, Optoelectronics and individual needs in platforms from R&D to prototyping and Photonics markets. true mass production. Our technology portfolio includes a range of advanced We provide sales and service through our global network sputter technologies, plasma deposition & etch as well of local offices. For more information visit us at as standard and enhanced evaporation. www.evatecnet.com or contact our head office. Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded Evatec AG Tel: + 41 81 403 80 00 by any data contained within Evatec quotations, manuals or specifications. Hauptstrasse 1a Fax: + 41 81 403 80 01 Edition 6: Printed November 2023 (Edition 5 first printed CH-9477 Trübbach info@evatecnet.com November 2022; edition 4 first printed August 2017; edition 3 first printed May 2016; edition 2 first printed May 2014; Switzerland www.evatecnet.com edition 1 first printed Dec 2012) EVA_Brochure_BAK Family_Edition6_November2023 3150 2250 3750