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SOLARIS

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超高速枚葉式スパッタ装置 SOLARISファミリー

『SOLARISファミリー』は、1枚当たり最速3秒の成膜を可能としたインライン式生産プラットフォームです。

5000台を超える高速光ディスク用システムを納入したノウハウと、
3000台を超える半導体用PVD装置から得られた経験を組み合わせて、
薄膜の大量生産における新しいアプローチを提供。

「完全に自動化された工場」向けに設計されており、スループットを
向上させ、手動処理を排除します。

【特長】
■基板成膜に「インライン」式アーキテクチャを導入
■「完全に自動化された工場」向けに設計
■スループットを向上させ、手動処理を排除
■柔軟性の高いプロセス向けの高速生産ソリューションを提供

※詳しくは関連リンクをご覧いただくか、お気軽にお問い合わせください。

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ドキュメント名 SOLARIS
ドキュメント種別 製品カタログ
ファイルサイズ 2.2Mb
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取り扱い企業 日本エバテック株式会社 (この企業の取り扱いカタログ一覧)

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CLUSTERLINE 200/300
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日本エバテック株式会社

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CLUSTERLINE 600
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日本エバテック株式会社

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LLS EVO II
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日本エバテック株式会社

このカタログの内容

Page1

SOLARIS PLATFORMS Fully automated solutions for thin film production
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NEW THINKING IN PVD PRODUCTION A NEW APPROACH TO MANUFACTURING - FAST, ACCURATE, RELIABLE SOLARIS platforms combine the know how from delivering over 5000 high speed optical disk systems with experience gained from over 3000 semiconductor PVD tools to deliver a new approach in thin film mass production. From Touch Panels to Thermoelectric Generators, Power Devices to Photovoltaics, SOLARIS S151 and S380 platforms deliver flexible high speed manufacturing solutions for both rigid and flexible substrates up to 15 inch diagonal. SOLARIS capabilities in a nutshell — High speed sputter processing — Full integration into automated fab — Dielectrics, metals, metal oxides & TCOs — Antireflection and Antismudge Coatings — Small footprint for reduced cleanroom costs 2
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SOLARIS FULLY AUTOMATED FAB LINES SOLARIS increases your throughput, raises your yields and reduces your production costs by eliminating operating personnel. Take a look at some typical SOLARIS manufacturing solutions. Example 1: One Glass Processing (OGS) for Touch Panel Applications Typical configuration S151 or S380 Process portfolio Key Drivers „ Best equipment AS Coating utilisatSionn – mini Cu Ag Output Cassettes AR Coating batches or simNpi, lNei V Au exchange betweAel n NiV Substrate Output Cassettes substrate sizes uTip to Cr Al ( >1000nm) Handling IM Coating n-type Si Al Alignment Substrate ITO Coating 15 inch Metal Contact Substrate Substrate „ One platform Al ( >1000nm) Handling Alignment type - enabling the Intput Cassettes Output Cassettes complete process portfolio Intput Cassettes Handling Example 2: Power Devices - HAliiggnmhe nst peed metallization (single or double sided) Typical configuration S151 Intput Cassettes Process portfolio Key Drivers Output Cassette AS Coating Sn Cu Ag „ Throughput – new AR Coating NH levels of throughput Oai,un Ntpdi uli V tn Cg Au assette MaAslk Handling NiV in single & double Substrate Alignment WaTfei r Cooling Cr sided proceAsHandling l s( e>1s000nm) IM Coating nWM-tyaapsfeker HFSaliipndling Al AS Coating Substrate Sn ITO CoatingCu AliAggnment AR Coating MetNail, CNoiVntact SubAsutrate Substrate IWafer Cooling WO nutpatfpeut r t C F C a lipa sssseetttete Al ( >1000nm) Al NiV Substrate Ti IHnatCpnurdtl inCgassette Al ( >1000nm) IM Coating n-type Si MaAslk Handling Substrate ITO Coating Alignment Metal Contact Substrate SuWbasfterra Cteooling Wafer Flip Al ( >1000nm) Twin TrackIn tput Cassette Output Example 3: Photovoltaics- BTwain ck side metallization on Si Cells Track Typical configuration S151 Output Twin Track Handling Process portfolio Key Drivers & Alignment AS Coating Sn Cu „ Contact QualityA –g Twin Track Handling & Alignment TwAinR Coating Ni, NiV suitable for highA u TTrwacink O efficiency PERC, Truatput Al NiV Scukb strate Input Ti PERT and PERLC trype Al ( >1000nm) TwIMin Coating n-type Si cells Al Track Substrate Twin Track Handling ITO Coating & Alignment Input Metal Contact Substrate „ Additional plaSutfbosrtrmat e Al ( >1000nm) flexibility - TCO and AR process Twin technologies Track Input 3
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SOLARIS S151 MAIN FEATURES — Substrates sizes up to 8 inch diagonal or mini batches — Single substrate / carrier processing at throughputs up to 1200 pieces / hour** — Up to 6 process stations for RTP, PVD, Etch or CVD SOLARIS S151 carrier for flexible substrate sizes: 3.5” to 8” (max. area Ø220mm) 2” carrier 3.5” carrier 8” carrier 8” carrier ** C ycle times according exact process Carrier Ø 245mm
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SOLARIS S380 MAIN FEATURES — Substrates sizes up to 15 inch diagonal or mini batches — Single substrate / carrier processing at throughputs up to 900 pieces/hour** — Up to 5 process stations for RTP, PVD, Etch or CVD SOLARIS S380 carrier for flexible substrate sizes: 3.5” to 15” (max. area Ø380mm) 8” carrier 12” carrier 15” carrier EMI carrier ** C ycle times according exact process Carrier Ø 430mm
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THE POWER BEHIND SOLARIS SOLARIS SUBSTRATE HANDLING - SPEED AND FLEXIBILITY Whether you choose the S151 or S380 platform you can handle glass, silicon or polymeric substrates with ease. Parallel carrier transfer around SOLARIS by synchronous indexer is the perfect solution to achieve high speed processing and lowest cost of ownership in mass production applications. — Carriers for individual substrates or mini batches without compromise on process uniformity — Simple conversion between rigid, 2.5D substrates & foils — Make multiple passes in front of process stations for complex stack designs — Change direction of indexer travel enabling sputter in reverse order for more process flexibility 6
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SOLARIS SOURCE TECHNOLOGY From EMI shielding applications to Thermoelectric Generators, SOLARIS brings you advanced source technologies for deposition of metals, alloys, oxides, dielectrics and TCOs. SOLARIS SOURCE TECHNOLOGY - SPEED WITHOUT COMPROMISE IN FILM QUALITY Choose from large area single DC, DC Reactive or RF sputter with cooling, etch and RTP capabilities up to 550ºC , or Evatec multisource capability for up to 4 sputter cathodes at a single process station. All process modules run independently in isolation and are configured according to your application. — Dielectrics: SiN-H, SiN, SiO2, Al2O3, SiC — Metal Oxides: NbO2, TiO2, Ta2O5 — TCOs: ITO, GZO, Zn:AlO — Metal stacks: Al, NiV, Ag, AuGe — Alloys with MSQ multisource — Deposition uniformities <±2% over whole carrier PENTA PLUS CATHODE TECHNOLOGY Penta Plus cathode technology delivers perfect step coverage in deposition of alloys in EMI shielding and reduces both consumables costs and target change times 7
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SOLARIS Platform summary ƒ Fully automated production solutions From Touch Panels to Thermoelectric Generators, Power Devices to Photovoltaics, SOLARIS platforms deliver ƒ High-throughput on substrates sizes up to 15” diagonal flexible high speed manufacturing solutions. ƒ Flexible configurations TYPICAL LAYOUTS SOLARIS S380 SOLARIS S151 ABOUT EVATEC Evatec offers complete solutions for thin film deposition Our team is ready to offer process advice, sampling and etch in the semiconductor, optoelectronics and services and custom engineering to meet our customers photonics markets. individual needs in platforms from R&D to prototyping and true mass production. Our technology portfolio includes standard and enhanced evaporation, a range of advanced sputter technologies as We provide sales and service through our global network well as plasma deposition & etch. of local offices. For more information visit us at www.evatecnet.com or contact our head office. Evatec AG Tel: + 41 81 403 80 00 Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded Hauptstrasse 1a Fax: + 41 81 403 80 01 by any data contained within Evatec quotations, manuals or CH-9477 Trübbach info@evatecnet.com specifications. Edition 3: Reprinted March 2018, first printed June 2017. Switzerland www.evatecnet.com (Edition 2 first printed Jan 2016, Edition 1 first printed Sep 2015). EVA_Brochure_SOLARIS_Edition3_March2018