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Tiger Lake UP3(最大28WのIntel®Core™およびCeleron®TDP)3.5 インチ SBCフォームファクター【PD11TGS】
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MiTAC Tiger Lake UP3(最大28WのIntel®Core™およびCeleron®TDP)3.5 インチ SBCフォームファクター
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ドキュメント名 | Tiger Lake UP3(最大28WのIntel®Core™およびCeleron®TDP)3.5 インチ SBCフォームファクター【PD11TGS】 |
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ドキュメント種別 | 製品カタログ |
ファイルサイズ | 226.1Kb |
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取り扱い企業 | 株式会社マイタックジャパン (この企業の取り扱いカタログ一覧) |
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Industrial Motherboard Industrial Motherboard
58 59
PD11TGS 3.5" SBC Form FactorTiger Lake UP3 (Intel® Core™ and Celeron® TDP up to 28W) PD11TGS 3.5" SBC
MECHANICAL
Form Factor 3.5" SBC Embedded: 4” x 5.8” (102mm x 147mm)
Features SYSTEM
Processor 11th Gen Intel® Tiger Lake-UP3 i3-1115G4E (Dual Core, 6MB Cache, up to 3.90 GHz)
option: 11th Gen Tiger Lake-UP3 Celeron 6305E / i5-1145G7E / i7-1185G7E
Chipset ®
● Intel® Tiger Lake UP3 Core i7/i5/i3 / Celeron ULV SATAIII
Intel SoC Integrated
SO-DIMM
DDR4 Memory DDR4 3200MHz / 1 x 260-pin SO-DIMM / Max. 32GB (Non-ECC)
processors Graphics Intel
® Iris Xe Graphics
M.2 B key Ethernet Intel® I219LM Giga LAN + I225LM 2.5G
● Outstanding graphic computing capability with COM Audio Realtek® ALC256
Integrated Intel ® Iris Xe graphics M.2 E key I/O Chipset Nuvoton NCT6126DTPM Nuvoton NPCT750AABYX TPM2.0
● Intel® vPro technology support Expansion Slot Storage / LTE / 5G: M.2 2242 / 2260 / 2280 / 3042 / 3052 B Key (USB2.0/*PCIex1/SATAIII)
● 1 x DDR4 SO-DIMM and support up to 32GB Wireless: M.2 2230 E KEY (PCIe / USB) *Not support M.2 M Key NVMe SSDBIOS AMI BIOS
● Support quadruple display for HDMI, DisplayPort DC Power Input H / W Monitor Temperature Monitor, Voltage Monitor, Fan Monitor
Watchdog Timer 1~255 Steps by Software Program and LV DS / eDP Smart Fan Control CPU Fan
● 1 x SATA III GRAPHICS
1 x Intel® 1G + 2.5G LAN port HDMI 2.0b Up to 4K (4096 x 2160) @60 Hz ● HDMI 2.0b Up to 4K (4096 x 2160) @60 Hz
● 2 x USB 2.0, 4 x USB 3.1 Gen2 and 4 x COM DisplayPort 1.4 Up to 5120 x 3200 @60 Hz
LVDS Up to 1920 x 1200 @60 Hz
● 8V~24V wide voltage power input
CPU eDP (Option) Up to 5120 x 3200 @60 Hz
REAR I/O
USB 4 x USB 3.1 Gen2
Display I/O 2 x HDMI 2.0b, 1 x DisplayPort 1.4
Audio I/O —
LAN I/O 2 x RJ-45
LVDS Serial Port —
PS/2 Port —
USB 3.1 Gen2 DisplayPort Others 1 x 2-pin Remote Power ON/OFF Terminal Block Connector
INTERNAL CONNECTORS
Storage 1 x SATAIII
USB 2 x USB2.0
Display I/O 1 x LVDS (colay eDP)1 x Backlight Connector
FCC Class B Wide Range Wide Temp. All Solid 2.5G LAN
DC-in Range Capacitor Line-out 2.5G +1G LAN HDMI DisplayPort Audio I/O 1 x Audio Header Supporting System Stereo Speaker
(Optional) 1 x Audio Header (Front Panel Mic-in & Line-out)
Serial Port 4 x RS232 (One Supports RS232/422/485)
Block Diagram PS/2 Port —Parallel Port —
GPIO —
Fan 1 x 4-pin CPU Fan Header
OPT Power 1 x 8~24V 4-pin Power Connector, 1 x AT/ATX Mode Select Jumper
eDisplayPort RES DDR4 Others 1 x Front IO Header (PWR ON/RESET/PWR LED/HDD LED)1 x Nano SIM slot, 1 x Buzzer
LVDS PS8625 POWER REQUIREMENT
Audio codec ALC256 Power Input 8~24V Wide Range DC Input w/ 4-pin Power Header (Pitch: 2.5mm)
HDMI ENVIRONMENTAL
Audio Header 15W TDP: -40 ~ 60°C (-40 ~140°F)
HDMI Operating Temperature 28W TDP: -40 ~ 50°C (-40 ~122°F)
DisplayPort Speaker Out with 0.7m/s Air Flow and Wide Temperature Memory/StorageStorage Temperature -40 ~ 85°C (-40 ~185°F)
Remote Power on/off Operating Humidity 10% ~ 95% R/H, non-condensing
Certification CE & FCC Class B
SATAIII M.2 3052/ 3042/
Tiger Lake-UP3 2280/ 2260/ 2242 B Key
OS
M.2 2230 E Key OS Support Windows® 10 64bit, Linux (support by request)
Ordering Information
TPM 2.0 Nano SIM
Model Number Processor HS Configuration Model Number Processor HS Configuration
SIO NCT6126D PD11TGS-6305E-HSK Celeron 6305E MB + Heatsink PD11TGS-1145G7E-HSK i5-1145G7E MB + Heatsink
RJ-45 (I219) PD11TGS-1115G4E-HSK i3-1115G4E MB + Heatsink PD11TGS-1185G7E-HSK i7-1185G7E MB + Heatsink
*Option 1: eDP
COM1 RS232 *Option 2: w/o LVDS/eDP, with 2nd DP
RJ-45 (I225) Packing List
COM2 RS232 Packing
COM3 RS232 2 x USB 2.0 ● 1 x Motherboard ● 1 x 50cm SATA Cable ● 1 x Quick Guide ● 1 x 45cm SATA Power Cable
COM4 RS232 / 422 / 485 4 x USB 3.1 Gen2