MiTAC　Intel ®Coffee Lake Xeon/ Core-I パワフルプロセッサーを搭載したファンレス組み込みシステム【MX1-10FEP-D】

Embedded System Embedded System 64 65 MX1-10FEP-D Embedded System for GPU Computing Supports Intel® Coffee Lake Xeon / Core-i Powerful Processor MX1-10FEP-D Embedded System for GPU Computing SYSTEM ® 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W Introduction CPU 9th & 8th Gen Intel ® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max 35W Chipset Intel® C246 MiTAC’s MX1-10FEP-D embedded system is the next System Memory DDR4 2666MHz, 2 x 260-pin SO-DIMM, Max. 32GB (Xeon: ECC; Core-i: Non-ECC)Graphics Intel® HD Graphics generat ion embedded system with Intel ® Cof fee Lake Display Interface HDMI, DisplayPort, DVI-I C246 workstat ion chipset which can suppor t Xeon and Storage Slot 3 x 2.5 HDD / SSD (1 w/ Removable HDD Bay, 2 w/ Internal HDD Bracket) Core-i LGA1151 socket type processor. The excel lent 2 x mSATA Ethernet Intel® I219-LM Giga LAN + I210-IT Giga LAN per formance, power ful processor, OCP/OVP power Audio Realtek® ALC662 / ALC888 protect ion, and expandable design provide the solut ion I/O Chipset Nuvoton NCT6116D for every compl icated task and most types of appl ica- TPM Nuvoton NPCT750AAAYX t ion. Storage: M.2 2242 / 2260 / 2280 M key (PCIe X4 / SATAIII) The MX1-10FEP-D’s 8.5 l i ter chassis design and Xpand- Storage/LTE/Wireless: 2 x Mini PCIe Full / Half size (USB2.0/ PCIe X1/ SATAIII), w/ SIM Card Holder able module design give i t the possibi l i ty to implement Expansion Slot Wireless: M.2 2230 E key (PCIe X1 / USB2.0) the compl icated tasks and for every workspace and PCIe 3.0 X16, PCIe 3.0 X1 (Option: 2 x PCIe 3.0 X8) envi ronment. F lexibi l i t ies also mean a r ich ar ray of I/O Indicator Power LED, HDD LED, DIO LED, LAN1 & 2 ACT / SPEED 2 x USB 3.0 por ts ( including 2 x Ethernet RJ45, 8 x USB, 1 x HDMI, 1 x 1 x HDMI 1.4 DVI-I, 1 x DisplayPor t, 2 x COM, PCIe X16 + X1 s lots, 3-pin FRONT I/O 2 x SIM Card Slot w/ Cover Terminal B lock Power Input, and 3 x Expansion doors) to 1 x 2.5" SATAIII HDD / SSD Bay add a var iety of per ipherals. Storage expandabi l i ty is 4 x USB 3.1 Gen 2 (Gbps), 2 x USB 2.0, 2 x RJ-45 , 1 x DisplayPort 1.2, 1 x DVI-I, 1 x PS/2 suppor ted for 3 x high-densi ty hard dr ives in 2 .5” HDD 2 x RS232 / 422 / 485 (Support Power 5V / 12V), 1 x Mic-in, 1 x Line-out bracket design. The reserved space for dual PCIe s lots 1 x 2-pin Terminal Block Remote Power on / off can be used for 1 x GFX Card instal lat ion. Two mPCIe REAR I/O 1 x 2-pin Terminal Block Remote Power reset (shared with mSATA) s lots provide the suppor t of SSD and 1 x 4-pin Terminal Block External Fan Connector wireless inter faces which al low ef for t less connect ion to 1 x 3-pin Terminal Block Power Input Wi-Fi and Bluetooth networks, and 4Gconnect ivi ty. Optional Peripheral 4 x SMA Antenna (Optional for WiFi/LTE function) DIO/COM/LAN/PoE/Power Igni toin expansion modules Edge AI Engine (Optional) 1X/2X/3X/4X Movidius Myriad X VPU, and Intel ® OpenVINO™ toolkit supported (Optional) Model Number Description extend the capabi l i ty and possibi l i ty to be used in more MS-48CDN-DT10 POWER REQUIREMENT appl icat ions. Xpansion Module with 4 x RS232 / 422 / 485, Power Input 9~48V Wide Rage DC Input w/ Terminal Block Connectivity 8-bit Isolated DIDO (4 x DI, 4 x DO) MECHANICAL a. Fanless w/o Venting HolesMS-04LAN-R10 Thermal Design b. With 2 x Internal 40x40x20 System Fan (Supporting NVIDIA GTX1650/GTX1660 Graphic Cards) Xpansion Module Mounting / Material c. With 2 x Internal 40x40x28 System Fan and Fan Duct (Supporting NVIDIA Tesla T4/P4 GPU Cards) with 4 x Intel i210-IT Giga LAN, RJ45 Port Dimension Wallmount / Top cover: Aluminum Alloy , Bezel and chassis: Steel 10.6” x 9.7” x 5.0” (268 mm x 246 mm x 128 mm) MS-04LAN-M10 ENVIRONMENTAL Xpansion Module 35W TDP Processor: -40°C to 70°C 8KV/15KV 5G/50Grms with 4 x Intel i210-IT Giga LAN, M12 Port Operating Temperature 51~65W TDP Processor: -40°C to 50°C / 71~80W TDP Processor: -40°C to 40°C Isolation I/O Power Ignition High ESD High shock & protection vibration *The operating temperature is based on fanless design w/o GPU card installation.MS-04POE-R10 protection **with 0.7m/s Air Flow and Wide Temperature Memory/Storage Xpansion Module Dimension (mm) Operating Humidity 10%~90% R/H (Non-condensing)with 4 x PoE+, Intel i210-IT Giga LAN, RJ45 Port Operating, 5 Grms, 5-500 Hz, 3 Axes Vibration Resistance (w/ SSD, according to IEC60068-2-64) MS-04POE-M10 Operating, 50 Grms, Half-sine 11 ms Duration Xpansion Module Shock Resistance (w/ SSD, according to IEC60068-2-27) with 4 x PoE+, Intel i210-IT Giga LAN, M12 Port EMC: CE & FCCCertification Safety: compliant with LVD,EN60950-1 / EN62368-1 Compliant with EN50155/EN50121/E-mark ME-02POE-R10 Xpansion Module OS OS Support Windows® 10 64-bit, Linux (support by request) with 2 x PoE +, Intel i210-IT Giga LAN, RJ45 Port Ordering Information MS-01IGN-S10 PCIe Slot Thermal Vehicle Power Ignition Card, Model Number AC Adaptor 12V/24V and Power ON/OFF Timing Selectable MX1-10FEP-D-C246-FL X16 + X1 Fanless None MX1-10FEP-D-C246-FL-AC300 X16 + X1 Fanless 300W AC to DC Adaptor 220W Power Adapter AC to DC, DC24V / 9.2A, 220W* MX1-10FEP-D-C246-IF-AC300 X16 + X1 2 x Internal 2 x Internal 40x40x20 System Fan 300W AC to DC Adaptor AC to DC, DC24V / 12.5A, 300W* MX1-10FEP-D-C246-IEF-AC300 X16 + X1 2 x Internal System Fan 1 x External System Fan 300W AC to DC Adaptor300W Power Adapter * Safety Operating: 0~40°C, parctical Operating: -30~60°C (Over 40°C need derating by 2.5%/°C ). Packing List * AC to DC Accessory for industrial application. Not for railay application Packing Packing ● 1 x MX1-10FEP-D ● 1 x 3-pin Terminal Block Connector ● 1 x 4-pin Terminal Block Connector ● 1 x CPU Cooler (passive) ● 1 x DVI to VGA converter ● 1 x Wall Mount Bracket ● 1 x Screw Pack (For HDD) ● 2 x 2-pin Terminal Block Connector