MiTAC Intel ®Coffee Lake Xeon/ Core-I パワフルプロセッサーを搭載したファンレス組み込みシステム【MX1-10FEP】

Embedded System Embedded System 64 65 MX1-10FEP Fanless Embedded System Supports Intel® Coffee Lake Xeon / Core-i Powerful Processor MX1-10FEP Fanless Embedded System SYSTEM 9th & 8th Gen Intel®® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W Introduction CPU 9th & 8th Gen Intel ® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max 35W Chipset Intel® C246 System Memory DDR4 2666MHz, 2 x 260-pin SO-DIMM, Max. 32GB (Xeon: ECC; Core-i: Non-ECC) MiTAC’s MX1-10FEP embedded system is the next genera- Graphics Intel® HD Graphics t ion embedded system with Intel ® Cof fee Lake C246 Display Interface HDMI, DisplayPort, DVI-I workstat ion chipset which can suppor t Xeon and Core-i Storage Slot 3 x 2.5 HDD / SSD (1 w/ Removable HDD Bay, 2 w/ Internal HDD Bracket) LGA1151 socket type processor. The excel lent per for- 2 x mSATAEthernet Intel® I219-LM Giga LAN + I210-IT Giga LAN mance, power ful processor, OCP/OVP power protect ion, Audio Realtek® ALC662 / ALC888 and expandable design provide the solut ion for every I/O Chipset Nuvoton NCT6116D compl icated task and most types of appl icat ion. TPM Nuvoton NPCT750AAAYX Storage: M.2 2242 / 2260 / 2280 M key (PCIe X4 / SATA) The MX1-10FEP’s 7.8 l i ter fan-less chassis design and Storage/LTE/Wireless: 2 x Mini PCIe Full / Half size (USB / PCIe / SATA), w/ SIM Card Holder Xpandable module design give i t the possibi l i ty to imple- Expansion Slot Wireless: M.2 2230 E key (PCIe / USB)PCIe 3.0 X16 ment the compl icated tasks and for every workspace Indicator Power LED, HDD LED, DIO LED, LAN1 & 2 ACT / SPEED and envi ronment. VESA mount holes al low for space-sav- 2 x USB 3.0 ing and rear-mount ing on VESA arms. F lexibi l i t ies also 1 x HDMI 1.4 mean a r ich ar ray of I/O por ts ( including 2 x Ethernet 2 x SIM Card Slot w/ Cover FRONT I/O RJ45, 8 x USB, 1 x HDMI, 1 x DVI-I, 1 x DisplayPor t, 2 x COM, 1 x 2.5" SATAIII HDD / SSD Bay PCIe X16 s lot, 3-pin Terminal B lock Power Input, and 3 x 4 x USB 3.1 Gen 2 (Gbps), 2 x USB 2.0, 2 x RJ-45 , 1 x DisplayPort 1.2, 1 x DVI-I, 1 x PS/2 Expansion doors) to add a var iety of per ipherals. Storage 2 x RS232 / 422 / 485 (Support Power 5V / 12V), 1 x Mic-in, 1 x Line-out expandabi l i ty is suppor ted for 3 x high-densi ty hard 1 x 2-pin Terminal Block Remote Power on / off drives in 2 .5” HDD bracket design. Two mPCIe (shared REAR I/O 1 x 2-pin Terminal Block Remote Power reset with mSATA) s lots provide the suppor t of SSD and wi reless 1 x 4-pin Terminal Block External Fan Connector inter faces which al low ef for t less connect ion to Wi-Fi and 1 x 3-pin Terminal Block Power Input Bluetooth networks, and 4Gconnect ivi ty. DIO/COM/LAN/- Optional Peripheral 4 x SMA Antenna (Optional for WiFi/LTE function) - PoE/Power Igni toin expansion modules extend the capa- H/W MonitorModel Number Description Watchdog Timer 1~255 Steps by Software Program bi l i ty and possibi l i ty to be used in more appl icat ions. MS-48CDN-DT10 Xpansion Module with 4 x RS232 / 422 / 485, Edge AI Engine (Optional) 1X/2X/3X/4X Movidius Myriad X VPU, and Intel ® OpenVINO™ toolkit supported (Optional) 8-bit Isolated DIDO (4 x DI, 4 x DO) POWER REQUIREMENTPower Input 9~48V Wide Rage DC Input w/ Terminal Block Connectivity MS-04LAN-R10 MECHANICAL Xpansion Module Thermal Design Fanless with 4 x Intel i210-IT Giga LAN, RJ45 Port Mounting Wallmount Dimension 10.6” x 9.7” x 4.3” (268 mm x 246 mm x 108 mm) MS-04LAN-M10 EN-50155 Material Top cover: Aluminum Alloy , Bezel and chassis: Steel 8KV/15KV 5G/50Grms Xpansion Module EN-50155 Isolation I/O Power Ignition High ESD High shock & Fanless Design with 4 x Intel i210-IT Giga LAN, M12 Port ENVIRONMENTAL protection vibration 35W TDP Processor: -40°C to 70°C protection Operating Temperature MS-04POE-R10 51~65W TDP Processor: -40°C to 50°C 71~80W TDP Processor: -40°C to 40°C Xpansion Module Dimension (mm) Operating Humidity 10%~90% R/H (Non-condensing)with 4 x PoE+, Intel i210-IT Giga LAN, RJ45 Port Operating, 5 Grms, 5-500 Hz, 3 Axes Vibration Resistance (w/ SSD, according to IEC60068-2-64) MS-04POE-M10 Shock Resistance Operating, 50 Grms, Half-sine 11 ms Duration Xpansion Module (w/ SSD, according to IEC60068-2-27) with 4 x PoE+, Intel i210-IT Giga LAN, M12 Port EMC: CE & FCCCertification Safety: compliant with LVD,EN60950-1 / EN62368-1 Certified with EN50155/EN50121/E-mark ME-02POE-R10 OS Xpansion Module OS Support Windows® 10 64-bit, Linux (support by request) with 2 x PoE +, Intel i210-IT Giga LAN, RJ45 Port Ordering Information *with 0.7m/s Air Flow and Wide Temperature Memory/Storage MS-01IGN-S10 Model Number Chipset Thermal Power AC Adaptor Vehicle Power Ignition Card, 12V/24V and Power ON/OFF Timing Selectable MX1-10FEP-C246 C246 Fanless 9~48V Wide Rage DC Input w/ Terminal Block Connectivity None MX1-10FEP-C246-AC300 C246 Fanless 9~48V Wide Rage DC Input w/ Terminal Block Connectivity 300W AC to DC Adaptor MX1-10FEP-C246-AC220 C246 Fanless 9~48V Wide Rage DC Input w/ Terminal Block Connectivity 220W AC to DC Adaptor 220W Power Adapter AC to DC, DC24V / 9.2A, 220W* 300W Power Adapter AC to DC, DC24V / 12.5A, 300W* Packing List * Safety Operating: 0~40°C, parctical Operating: -30~60°C (Over 40°C need derating by 2.5%/°C ). Packing Packing * AC to DC Accessory for industrial application. Not for railay application ● 1 x MX1-10FEP ● 1 x 3-pin Terminal Block Connector ● 1 x 4-pin Terminal Block Connector ● 1 x CPU Cooler (passive) ● 1 x DVI to VGA converter ● 1 x Wall Mount Bracket ● 1 x Screw Pack (For HDD) ● 2 x 2-pin Terminal Block Connector