ファンレス組込みPC PERFECTRON SR200-X2/X2SG

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マシン・工場・ビルオートメーション・GPUサーバー向け小型PC

SR200-X2 特長 ■幅308×高さ76×奥行149mm 3.49リットル ■MIL規格準拠(MIL-STD-810G) ■第6世代 Core i7-6820EQ CPU、ファンレス動作 ■DDR4 XR-DIMM (最大32GB) ■2 mPCIe 拡張スロット ■オンボード NANO SATA 3.0 SSD (最大64GB) 搭載可 ■マルチディスプレイ 4 DisplayPort ■拡張温度対応 -40~70℃ ■ワイドDC入力 9V~36V 仕様 ■CPU Core i7-6820EQ (4C x 2.8/3.5GHz) 8M Cache(45W) ■チップセット QM170 ■メモリ DDR4 XR-DIMM x 1 (最大32GB) ■GPU NVIDIA GT730M ■拡張スロット mPCIe x 2 (mSATA x 1対応済) ■ストレージ Onboard uSSD 最大64GB (SATA III 6Gb/s) ■I/Oコネクタ  10/100/1000 Base-T x 2 USB3.0 x 4 RS232/422/485 x 1 DVI-I x 1, DisplayPort x 4 ( 最大3840x2160 )  オーディオ Mic-in, Line-out ■入力電源 DC 9 ~ 36V入力 ■動作温度 -40~70℃ ■寸法/重量 308mm(W) x 76mm(H) x 149mm(D) ■認証 MIL-STD-810G, CE, FCC SR200-X2SG 特長 ■幅308×高さ76×奥行149mm 3.49リットル ■MIL規格準拠(MIL-STD-810G) ■第6世代 Core i7-6820EQ CPU、ファンレス動作 ■DDR4 XR-DIMM (最大32GB) ■2 mPCIe 拡張スロット ■オンボード NANO SATA 3.0 SSD (最大64GB) 搭載可 ■マルチディスプレイ 4 DisplayPort ■拡張温度対応 -20~60℃ ■ワイドDC入力 9V~36V 仕様 ■CPU Core i7-6820EQ (4C x 2.8/3.5GHz) 8M Cache(45W) ■チップセット QM170 ■メモリ DDR4 XR-DIMM x 1 (最大32GB) ■GPU NVIDIA GTX950M ■拡張スロット mPCIe x 2 (mSATA x 1対応済) ■ストレージ Onboard uSSD 最大64GB (SATA III 6Gb/s) ■I/Oコネクタ  10/100/1000 Base-T x 2 USB3.0 x 4 RS232/422/485 x 1 DVI-I x 1, DisplayPort x 4 ( 最大3840x2160 )  オーディオ Mic-in, Line-out ■入力電源 DC 9 ~ 36V入力 ■動作温度 -20 ~ 60℃ ■寸法/重量 308mm(W) x 76mm(H) x 149mm(D) ■認証 MIL-STD-810G, CE, FCC

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ドキュメント名 ファンレス組込みPC PERFECTRON SR200-X2/X2SG
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SR200-X2 Intel® 6th Gen. Skylake® Core™ i7-6820EQ NVDIA GTX950M GPUMIL-STD Fanless Rugged System • MIL-STD 810G Compliance • 6th Generation Intel® Core™ i7-6820EQ Skylake Processor • Up to 32GB DDR4 RAM • Onboard uSSD SATAIII up to 64 GB • NVIDIA GTX950M Independent Displays by 2 x DP • 2 x mPCIe expansion slot (One Co-Layout with mSATA) • 2 x Intel® Gigabit Ethernet • 4 x USB 3.0, 1 x COM port • 9V to 36V DC-in • Extended Temperature -40~+60°C © Copyright STACKRACK Co., Ltd. All Rights Reserved . WWW.STACKRACK.COM

SR200 WWW.STACKRACK.COM Specifications Specifications Intel® 6th Gen Core™ i7-6820EQ (Frequency 2.8GHz, Turbo Boost Frequency up to 3.5GHz), Quad-Core, 8 Thread Support, 8MB SmartCache. High Performance Processor Build-in HD Graphics 530 for excellent 3D, Turbo Boost Technology 2.0, VPro and Hyper-Threading support Memory Up to 32GB DDR4 RAM Intel® QM170 Chipset providing integrated USB 3.0 and supporting 6th Chipset generation Intel® Core™ processor families Expansion Slot 1 x Full-size mPCIe (w/ SIM card and mSATA supported) 1 x Half-size mPCIe Display GPU NVIDIA GTX950M Display Port Resolution up to 3840 x 2160@60Hz DVI-I Resolution up to 1920 x 1200@60Hz Storage uSSD Onboard uSSD SATAIII up to 64 GB mSATA Solid State Disk (SSD) - up to 512GB Capacity. Rugged Industrial NAND Flash mSATA Storage w/ Rugged -40/+85C High Capacity, mSATA optional Pre-loaded with Linux or Windows OS. 64 / 128 / 256 / 512GB Innodisk 3MG2-P Series MLC SATA III 6Gb/s Flash SSD, Rated for 520 MB/sec Sequential Read ; 350 MB/sec Write Max. Ethernet Ethernet 2 x Intel Gigabit Ethernet LAN Interfaces (10/100/1000Mbps) Rear I/O DisplayPort 2 x 20Pin DisplayPort connectors (Female) DVI-I 1 x 29Pin DVI-I connector (Female) Ethernet 2 x RJ45 Gigabit Ethernet LAN Interfaces Audio 2 x 3.5mm Audio Jacks (1 x MIC, 1 x Line-Out) Serial Port 1 x DB9 connector (RS-232/422/485) USB Port 2 x USB3.0 standard-A connectors Front I/O Button 1 x Power Button DC-IN 4P Rugged Terminal connector Indicator LED Power, HDD, LAN (Link/Active/Speed) USB Port 2 x USB3.0 standard-A connectors DisplayPort 2 x 20Pin DisplayPort connectors (Female) © Copyright STACKRACK Co., Ltd. All Rights Reserved .

SR200 WWW.STACKRACK.COM Applications, Operating System Commercial and Military Platforms Requiring Compliance to MIL-STD-810G Embedded Computing, Process Control, Intelligent Automation and manufactur- Applications ing applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions. Used in all aspects of the military. Windows 10 Operating System Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20 Physical Dimension (W x D x H) TBD Weight TBD Chassis Aluminum Alloy, Corrosion Resistant. Finish Anodic aluminum oxide (Color Iron gray) Cooling Natural Passive Convection/Conduction. No Moving Parts DC-IN : PHOENIX CONTACT 1776715 RJ45 Ethernet : RTB-19GB9J1A Connectors DVI-I : BANGSON DVI02-0123001-T DisplayPort : FOXCONN 3VD21203-H7U0-4 Audio : WTJ-035-67S1A01/ WTJ-035-67S1A02 Ingress Protection Dust Proof (Similar to IP50) Environmental Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) MIL-STD-810G Test Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Operating Temperature -40 to 60°C (ambient with air flow) Storage Temperature -40 to 85°C EMC CE and FCC compliance Ordering Information SR200-X2 MIL-STD-810G Rugged Computer with Intel® Core i7- 6820EQ, NVIDIA GTX950M GPU, 4 Independent DP, Mini PCIe, 9V to 36V DC-in, Extended Temp -40 to 60°C © Copyright STACKRACK Co., Ltd. All Rights Reserved .

SR200 WWW.STACKRACK.COM SR200-X2, EBX rugged system is a powerful system that is driven by Intel® 6th generation Skylake CPU and chipset soldering onboard, integrated with Nvidia GPU GTX950M that supports 2 independent DisplayPort. Processor i7- 6820EQ plus Intel® QM170 chipset supports clock speed 2.8GHz, up to 3.5GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Appearance Front IO Back IO Dimensions © Copyright STACKRACK Co., Ltd. All Rights Reserved .

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