Molex Official Info
2.00mm Pitch MFB (Futurebus+) Header, Vertical, 5-Row, Press-Fit Pin, 240 Circuits, Gold (Au) 0.38µm
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Main Usage
Backplane
Number of Columns | N/A |
---|---|
PC Tail Length | 13.60mm |
Polarized to PCB | No |
Current - Maximum per Contact | 1.0A |
Temperature Range - Operating | -55° to +125°C |
Material - Plating Mating | Gold |
Net Weight | 23.250/g |
Circuits (Loaded) | 240 |
Stackable | Yes |
PCB Thickness - Recommended | 2.40mm |
Keying to Mating Part | Yes |
Durability (mating cycles max) | 250 |
Orientation | Vertical |
Pitch - Mating Interface | 2.00mm |
Number of Rows | 5 |
Surface Mount Compatible (SMC) | No |
Circuits (maximum) | 240 |
Number of Pairs | Open Pin Field |
PCB Retention | None |
Data Rate | 622.0 Mbps |
Packaging Type | Tray |
Voltage - Maximum | 100V AC |
Manufacturer Brand | Molex |
---|---|
GTIN | 800753940727 |
Model Page | https://www.molex.com/molex/products/datasheet.jsp?part=active/0553322404_BACKPLANE_CONNECTO.xml |