SEMICONDUCTOR EQUIPMENT

Okamoto Semiconductor Equipment Technology Slicing Okamoto has been developing total abrasive technology Okamoto has been developing our technology for semiconductor materials and electrical component materials since brittle materials and Ge were sliced. Our slicing machine is equipped with the latest control unit and a user-friendly for semiconductor wafers. Our products are capable of operating system for higher precision and throughput. ingot processing to final products. Okamoto is pursuing Internal Slicer cutting-edge planarization technology. ASM200B High efficient ingot grinder Specifications Unit ASM200B Footprint（W×D×H） mm 2000×1280×2585 Applications － Brittle materials/SiO2 ingot Maximum Wafer Size mm φ150×600 Multi Slicer ASM420M Okamoto multi slicing machine is equipped with high power and high rigidity spindle motor to enable to process high efficient slicing process. Specifications Unit ASM420M Footprint（W×D×H） mm 2150×1455×1430 Applications － Brittle materials Table working cap (length×width) mm 400×200 Lapping Wafers and electrical components need to be processed with many types of conditions. Okamoto lapping machine has varieties of option which covers the customers’ requirements. Supersize Lapping Machine Precision Lapping Machine SPL3000 SPL15F Capable for φ3000mm work pieces. Many types of options make the variety of high-precision-process (OF: facing, ELG, etc.). Specifications Unit SPL3000 Footprint（W×D×H） mm 3680×4710×2680 Specifications Unit SPL15F Applications － Electrical components/brittle materials Footprint（W×D×H） mm 1000×1510×1300 Table dia. mm φ3000 Applications － Electrical components/brittle materials Table dia. mm φ380

Grinding Polishing Today’s semiconductor devices require excellent flatness. Okamoto CMP machines have been developed to achieve 200mm Back Grinder 200/300mm Wafer Grinder excellent accuracy, high throughput, and low cost. GNX200B GNX312/212 High precision, high productivity wafer grinder equipped Ultra high precision, high productivity wafer grinder with down-feed grinding system and index transfer. equipped with down-feed grinding system and index CMP (Chemical Mechanical Polishing) transfer. SPP600S/800S Specifications Unit GNX200B Footprint（W×D×H） mm 1350×2515×1841 Specifications Unit GNX312/212 R&D manual CMP with various types of software. Simultaneous process － 5 GNX312：1650×3450×1943 Footprint（W×D×H） mm Applications － Si wafer GNX212：1400×3078×1858 Maximum Wafer Size mm φ200 Applications － Si wafer Specifications Unit SPP600S/800S Maximum Wafer Size inch φ4"～12" SPP600S：1380×1110×1873 Footprint（W×D×H） mm SPP800S：1755×1200×2086 Wafers processed Simultaneously － 2 Applications － Si wafer, Electronics parts, Brittle materials SPP600S：φ200 Maximum Wafer Size mm SPP800S：φ300 Back Grinder + Polisher for Ultra Thin Wafer Ultra Precision Grinder GNX200BP VG202MKII Back grinder + polisher inline system. SOI wafer grinder. Film thickness can be measured. This feature creates the excellent wafer strength. Final Polisher This machine can achieve high precision + high Specifications Unit VG202MKII productivity. Footprint（W×D×H） mm 2160×1295×1740 PNX332B/312 Applications － Ultra precision SOI wafer 300mm wafer polisher. Maximum Wafer Size mm φ200 Cutting-edge technology for excellent edge profile and Specifications Unit GNX200BP non-uniformity. 2830×2515×1841 Footprint（W×D×H） mm （Polishe：r1480×1700×1800） Simultaneous process － 7 Specifications Unit PNX332B/312 Applications － Si wafer PNX332B：2440×3260×2200 Maximum Wafer Size mm φ200 Footprint（W×D×H） mm PNX312 ： 3050×2200×2200 PNX332B：10 Wafers processed Simultaneously － PNX312 ： 6 Applications － Si wafer Grinder for Brittle Materials PNX332B：φ300 Maximum Wafer Size mm VG401/101 PNX312 ：φ200 High rigid grinder for difficult-to-cut materials. 11kw spindle motor is equipped. Specifications Unit VG401/101 VG401： 910×1456×2007 Footprint（W×D×H） mm VG101：1300×1230×1733 Applications － Brittle materials Maximum Wafer Size mm ～φ400