製品ハイライト

ハイライト 2022

サーバ・オン・モジュール 組込み高性能コンピューティング NEW NEW NEW conga-HPC/sILH conga-HPC/sILL conga-B7XI Formfactor COM HPC Server Size D (optional Size E) COM HPC Server Size D COM Express Basic Type 7 Intel® XEON® D-2700 processors Intel® XEON® D-1700 processors Intel® Xeon® D-2796TE | 20x Cores / 40x Threads | 30MB Cache | 118W TDP Intel® Xeon® D-1746TER | 10x Cores / 20x Threads | 15MB Cache | 67W TDP CPU Intel® Xeon® D-2775TE | 16x Cores / 32x Threads | 25MB Cache | 100W TDP Intel® Xeon® D-1732TE | 8x Cores / 16x Threads | 15MB Cache | 52W TDP Intel® Xeon® D-2752TER | 12x Cores / 24x Threads | 20MB Cache | 77W TDP Intel® Xeon® D-1715TER | 4x Cores / 8x Threads | 10MB Cache | 50W TDP Intel® Xeon® D-2733NT | 8x Cores / 16x Threads | 15MB Cache | 80W TDP Intel® Xeon® D-1735TR | 8x Cores / 16x Threads | 15MB Cache | 59W TDP Intel® Xeon® D-2712T | 4x Cores / 8x Threads | 15MB Cache | 65W TDP Intel® Xeon® D-1712TR | 4x Cores / 8x Threads | 10MB Cache | 40W TDP 4x DIMM sockets for DDR4 memory modules | Max. 4x DIMM sockets for DDR4 memory modules | Max. capacity = 512GB capacity = 256GB Max. DIMM Memory Type DIMM Capacity Max. DIMM Speed Memory Type DIMM Capacity up to 4x SODIMM sockets Speed DRAM RDIMM 8GB – 64GB 2933 MT/s RDIMM 8GB – 64GB for DDR4 memory modules 2933 MT/s LRDIMM 64GB – 128GB 2933 MT/s LRDIMM 64GB – 128GB up to 32GByte | Max. 2933 MT/s VLP RDIMM 8GB – 64GB 2666 MT/s VLP RDIMM 8GB – 64GB capacity = 128GB 2400 MT/s UDIMM (ECC) 8GB – 32GB 2666 MT/s UDIMM (ECC) 8GB – 32GB 2666 MT/s UDIMM (Non-ECC 4GB – 32GB 2666 MT/s UDIMM (Non-ECC) 4GB – 32GB 2666 MT/s 1x 2.5GbE TSN Ethernet 1x 2.5GbE TSN Ethernet Ethernet 1x 2.5GbE TSN Ethernet 4x 25G/10G/2.5G/1G/100M lanes | Maximum total 4x 10GbE supporting CEI/ 8x 25G/10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb* bandwidth 100Gb* KR/SF Serial ATA 2x SATA III (6Gb/s) PCI Express 32x PCIe Gen4 16x PCIe Gen4 16x PCIe Gen4 16x PCIe Gen3 16x PCIe Gen3 16x PCIe Gen3 USB 4x USB 3.0 | 4x USB 2.0 4x USB 3.0 | 4x USB 2.0 Other 2x UART | 12x GPIO | 2x SM Bus | 2x I²C 2x UART | 8x GPIO | SPI congatec Board Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics Controller I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Managment ACPI 5.0 with battery support Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux | Android | Yocto | RTS Hypervisor Temperature Commercial: Operating Temperature: 0°C to +60°C* | Storage: -20°C to +80°C* Industrial: Operating Temperature: -40°C to +80°C* | Storage: -40°C to +80°C* Humidity Operating: 10 .. 90°C r. H. non cond Storage: 5 - 95% r.H non cond. Size 160 x 160 mm 160 x 160 mm 125 x 95 mm Optional available on Size E 160 x 200 mm *Depending on CPU

低消費電力クラス 省電力テクノロジー conga-SMX8-Mini conga-SMX8-Plus conga-SMX8-X conga-QMX8-Plus Formfactor SMARC 2.1, 82 x 50 mm² Qseven, 70 x 70 mm² NXP processor with commercial operating temperature 0°C .. +60°C i.MX 8M Mini i.MX 8X Quad 4x Cortex-A53 1.8 GHz + 1x i.MX 8M Plus QuadXPlus 4x Cortex-A35 1.2 GHz i.MX 8M Plus M4F Quad 4x Cortex-A53 1.8 GHz + 1x M7 + 1x M4F Quad 4x Cortex-A53 1.8 GHz + 1x M7 Dual 2x Cortex-A53 1.8 GHz + 1xM4F NPU up to 2.3 Tops (optional) + GPU DualXPlus 2x Cortex-A35 1.2 GHz + NPU up to 2.3 Tops (optional) + GPU Solo 1x Cortex-A53 1.8 GHz + 1x M4F 1x M4F CPU NXP processor with industrial operating temperature -40°C .. +85°C i.MX 8M Mini i.MX 8X Quad 4x Cortex-A53 1.6 GHz + 1x i.MX 8M Plus QuadXPlus 4x Cortex-A35 1.2GHz + i.MX 8M Plus M4F Quad 4x Cortex-A53 1.6 GHz + 1x M7 1x M4F Quad 4x Cortex-A53 1.6 GHz + 1x M7 Dual 2x Cortex-A53 1.6 GHz + 1xM4F NPU up to 2.3 Tops (optional) + GPU DualXPlus 2x Cortex-A35 1.2GHz + NPU up to 2.3 Tops (optional) + GPU Solo 1x Cortex-A53 1.6 GHz + 1x 1x M4F M4F DRAM max. 6 GByte LPDDR4x 4000 MT/s max. 6 GByte LPDDR4x 4000 MT/s max. 4 GByte LPDDR4 3000 MT/s max. 4 GByte LPDDR4 2400 MT/s with Inline ECC with Inline ECC Ethernet 1x 1 Gb 2x 1 Gb with IEEE 1588 (1x TSN) 2x 1Gb with IEEE 1588 1x 1 Gb with TSN support Serial ATA - - - - PCI Express 1x Gen 2 1x Gen 3 1x Gen 3 1x Gen 3 USB 2x 3.0 / 5x 2.0 (shared with 1x USB 1x 3.0 / 5x 2.0 (shared with 1x USB 2x 3.0 / 3x 2.0 (shared with 1x USB 5x 2.0 (shared with 1x USB OTG) OTG) OTG) OTG) SDIO | 2x I²C | SPI | 4x UART | GPIO | SDIO | I²C | SPI | ESPI | 4x UART | Other SDIO | I²C | SPI | UART | GPIO | SDIO | I²C | SPI | UART | GPIO | 2x CAN FD | WiFi/BT module 2x CAN FD | GPIO | WiFi/BT module WiFi/BT module optional CAN FD optional optional Mass Storage Onboard Solid State Drive eMMC 5.1 Onboard Solid State Drive eMMC 5.1 Onboard Solid State Drive eMMC 5.1 up to 128 Gbyte up to 128 Gbyte up to 128 Gbyte Sound 2x I²S | optional 1x Tensilica® HiFi 2x I²S, optional 1x Tensilica® HiFi 4 2x I²S I²S | optional 1x Tensilica® HiFi 4 DSP 4 DSP DSP Integrated in SoC | GC7000UL 3D | up Integrated in SOC | GT7000Lite 3D Integrated in SoC | GC7000UL 3D | up Integrated in SoC | GC NanoUltra Graphics to 2x Vec4 shaders | GC520L 2D | VPU GPU | up to 4 Vec4 shaders and 16 to 2x Vec4 shaders | GC520L 2D | VPU 3D GPU | VPU with 1080p h.265 with up to 1080p h.265/h.264 dec and execution units | VPU up to 4K h.265 with up to 1080p h.265/h.264 dec and dec/h.264 video enc enc | integrated ISP dec / 1080p h.264 enc enc | integrated ISP 2x LVDS (1x 24 bit) | optinal HDMI 1x LVDS (2x 24 bit) |1x HDMI 2.0a | 1x LVDS (2x 24 bit) | 1x MIPI-DSI | 1x LVDS (2x 24 bit) |1x HDMI 2.0a | Video Interface 1.3 | 1x MIPI-DSI | 2x 4-lane MIPI-CSI 1x MIPI-CSI | optional DP | 1x MIPI-DSI | up to 2x 4-lane MIPI- 2x MIPI-DSI | 1x MIPI-CSI | on optional FFC | up to 3 simultan 1 simultan display CSI | up to 3 simultan displays up to 2 simultan displays displays Boot loader U-Boot boot loader Power Management NXP Power Management IC (PMIC) Operating Systems Linux, Yocto, Android Operating commercial: 0 .. +60°C Temperature Range Operating industrial: -40 .. +85°C Storage: -40 .. +85°C Humidity Operating: 10 .. 90 % r. H. non cond. Storage: 5 .. 95 % r. H. non cond.

パフォーマンスクラス 高速かつ高エネルギー 効率 NEW NEW NEW conga-HPC/cALS conga-HPC/cALP conga-TC670 Formfactor COM HPC Client Size C COM HPC Client Size A COM Express Compact 12th Gen Intel® Core™ processors (Alder Lake) Intel® Core™ i7-12800HE | 6x 2.4/4.6GHz P-Cores | 8x 1.8/3.5GHz E-cores | 24MB Smart Cache | 45W TDP Intel® Core™ i9 12900E | 8x 2.3/5.0 GHz P-Cores | 8x Intel® Core™ i7-1270PE | 4x 1.8G/4.5GHz P-Cores | 8x 1.2/3.3GHz E-cores | 18MB Smart Cache | 28W TDP 1.7/3.8 GHz E-Cores | 30MB Smart Cache | 65W TDP Intel® Core™ i7-1265UE | 2x 2.6/4.7GHz P-Cores | 8x 1.2/3.5GHz E-cores | 12MB Smart Cache | 15W TDP Intel® Core™ i7 12700E | 8x 2.1/4.8 GHz P-Cores | 4x Intel® Core™ i5-12600HE | 4x 2.5/4.5GHz P-Cores | 8x 1.8/3.3GHz E-cores | 18MB Smart Cache | 45W TDP CPU 1.6/3.6 GHz E-Cores | 25MB Smart Cache | 65W TDP Intel® Core™ i5-1250PE | 4x 1.7/4.4GHz P-Cores | 8x 1.2/3.2GHz E-cores | 12MB Smart Cache | 28W TDP Intel® Core™ i5 12500E | 6x 2.9/4.5 GHz P-Cores | Intel® Core™ i5-1245UE | 2x 2.5/4.4GHz P-Cores | 8x 1.1/3.3GHz E-cores | 12MB Smart Cache | 15W TDP 18MB Smart Cache | 65W TDP Intel® Core™ i3-12300HE | 4x 1.9/4.3GHz P-Cores | 4x 1.5/3.3GHz E-cores | 12MB Smart Cache | 45W TDP Intel® Core™ i3 12100E | 4x 3.2/4.2 GHz P-Cores | Intel® Core™ i3-1220PE | 4x 1.5/4.2GHz P-Cores | 4x 1.1/3.1GHz E-cores | 12MB Smart Cache | 28W TDP 12MB Smart Cache | 65W TDP Intel® Core™ i3-1215UE | 2x 1.2/4.4GHz P-Cores | 4x 0.9/3.3GHz E-cores | 10MB Smart Cache | 15W TDP Intel® Celeron® 7305E | 1x 1.0GHz P-Core | 4x 0.9GHz E-cores | 8MB Smart Cache | 15W TDP Chipset Intel® R680E | Intel® Q670E integrated in SOC DRAM 4 SO-DIMM sockets for DDR5 memory modules up 2 SO-DIMM sockets for DDR5 memory modules up to 32 GByte each (max. 64 GByte system capacity) | up to 32 GByte each (128 GByte system capacity) to 4800 MT/s Ethernet 2x 2.5 GbE TSN Ethernet (via Intel® i225 LM) 2.5 GbE TSN Ethernet (vial Intel® i225 LM) Serial ATA up to 2x SATA III (6Gb/s) 1x16 PCIe Gen 5 (PEG port) up to x8 PCIe Gen4 (PEG port) PCI Express up to x8 PCIe Gen4 (PEG port) up to 1 x4 PCIe Gen 4 2 x4 PCIe Gen4 8 PCIe Gen3 up to 2 x4 PCIe Gen3 up to 8 PCIe Gen3 USB 4x USB 3.2 Gen2 | 8x USB 2.0 2x USB 3.2 | 8x USB 2.0 up to 4x USB 3.2 | 8x USB 2.0 Other up to 2x Thunderbolt | 2x UART | 2x MiPi-CSI | 12x 2x UART | CAN (opt.) | GPIOs | SPI | LPC | SM Bus | 2x UART | 12x GPIO | eSPI | SM Bus | I²C GPIO | eSPI | SM Bus | I²C | GSPI I²C | NVMex4 SSD (optional) Sound 2x Soundwire | HDA | I2S (opt.) 2x Soundwire | 2x Soundwire or HDA or I2S (opt.) HDA Graphics Intel® UHD Graphics 770 with Xe Graphics up to Intel® Iris Xe Graphics Architecture | up to 96 Eus Architecture | up to 32 EU Video Interface 3x DDI | eDP 3x DDI | LVDS (optional eDP) | VGA (optional) congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Managment ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto | Real-Time Systems Hypervisor Temperature Operating Temperature: 0°C to +60°C | Storage: -20°C to +70°C Humidity Operating: 10 .. 90°C r. H. non cond Storage: 5 - 95% r.H non cond. Size 120 x 160 mm 120 x 95 mm 95 x 95 mm

パフォーマンスクラス 高速かつ高エネルギー 効率 conga-HPC/cALS conga-HPC/cALP conga-TC670 conga-TC570 conga-TC570r conga-HPC/cTLU conga-TS570 conga-HPC/cTLH Formfactor COM HPC Client Size C COM HPC Client Size A COM Express Compact Formfactor COM Express Compact Type 6 COM HPC Client Size A COM Express Basic Type 6 COM HPC Client Size B 12th Gen Intel® Core™ processors (Alder Lake) 11th Gen Intel® Core™ / Celeron® processors 11th Gen Intel® Xeon® W / Core™ / Celeron® processors Intel® Core™ i7-12800HE | 6x 2.4/4.6GHz P-Cores | 8x 1.8/3.5GHz E-cores | 24MB Smart Cache | 45W TDP (Tiger Lake UP3) (Tiger Lake H) Intel® Core™ i9 12900E | 8x 2.3/5.0 GHz P-Cores | 8x Intel® Core™ i7-1270PE | 4x 1.8G/4.5GHz P-Cores | 8x 1.2/3.3GHz E-cores | 18MB Smart Cache | 28W TDP commercial versions 0 .. +60°C operating temperature 1.7/3.8 GHz E-Cores | 30MB Smart Cache | 65W TDP Intel® Core™ i7-1265UE | 2x 2.6/4.7GHz P-Cores | 8x 1.2/3.5GHz E-cores | 12MB Smart Cache | 15W TDP Intel® Core™ i7 12700E | 8x 2.1/4.8 GHz P-Cores | 4x Intel® Core™ i5-12600HE | 4x 2.5/4.5GHz P-Cores | 8x 1.8/3.3GHz E-cores | 18MB Smart Cache | 45W TDP Xeon W-11865MLE | 8x1.5/4.5GHz | 25W TDP CPU 1.6/3.6 GHz E-Cores | 25MB Smart Cache | 65W TDP Intel® Core™ i5-1250PE | 4x 1.7/4.4GHz P-Cores | 8x 1.2/3.2GHz E-cores | 12MB Smart Cache | 28W TDP Xeon W-11555MLE | 6x1.9/4.4GHz | 25W TDP Intel® Core™ i5 12500E | 6x 2.9/4.5 GHz P-Cores | Intel® Core™ i5-1245UE | 2x 2.5/4.4GHz P-Cores | 8x 1.1/3.3GHz E-cores | 12MB Smart Cache | 15W TDP Core i7-1185G7E | 4x1.8/4.4 GHz | 12-28W cTDP Xeon W-11155MLE | 4x1.8/3.1GHz | 25W TDP 18MB Smart Cache | 65W TDP Intel® Core™ i3-12300HE | 4x 1.9/4.3GHz P-Cores | 4x 1.5/3.3GHz E-cores | 12MB Smart Cache | 45W TDP Core i5-1145G7E | 4x1.5/4.1 GHz | 12-28W cTDP CPU Core i7-11850HE | 8x2.6/4.7GHz | 45W/35W cTDP Intel® Core™ i3 12100E | 4x 3.2/4.2 GHz P-Cores | Intel® Core™ i3-1220PE | 4x 1.5/4.2GHz P-Cores | 4x 1.1/3.1GHz E-cores | 12MB Smart Cache | 28W TDP Core i3-1115G4E | 2x2.2/3.9 GHz | 12-28W cTDP Core i5-11500HE | 6x2.6/4.5GHz | 45W/35W cTDP 12MB Smart Cache | 65W TDP Intel® Core™ i3-1215UE | 2x 1.2/4.4GHz P-Cores | 4x 0.9/3.3GHz E-cores | 10MB Smart Cache | 15W TDP Celeron 6305E | 2x1.8 GHz | 15W TDP Core i3-11100HE | 4x2.4/4.4GHz | 45W/35W cTDP Intel® Celeron® 7305E | 1x 1.0GHz P-Core | 4x 0.9GHz E-cores | 8MB Smart Cache | 15W TDP Celeron 6600HE | 2x2.6GHz | 35W TDP Chipset Intel® R680E | Intel® Q670E integrated in SOC industrial operating temperature -40°C .. +85°C DRAM 4 SO-DIMM sockets for DDR5 memory modules up 2 SO-DIMM sockets for DDR5 memory modules up to 32 GByte each (max. 64 GByte system capacity) | up Core i7-1185GRE | 4x1.8/4.4 GHz | 12-28W cTDP Xeon W-11865MRE | 8x2.6/4.7GHz | 45W/35W cTDP to 32 GByte each (128 GByte system capacity) to 4800 MT/s Core i5-1145GRE | 4x1.5/4.1 GHz | 12-28W cTDP Xeon W-11555MRE | 6x2.6/4.5GHz | 45W/35W cTDP Core i3-1115GRE | 2x2.2/3.9 GHz | 12-28W cTDP Xeon W-11155MRE | 4x2.4/4.4GHz | 45W/35W cTDP Ethernet 2x 2.5 GbE TSN Ethernet (via Intel® i225 LM) 2.5 GbE TSN Ethernet (vial Intel® i225 LM) Up to 2x DDR4 Serial ATA up to 2x SATA III (6Gb/s) Up to 2x DDR4 Up to 32 GByte LPDDR4X Up to 3x DDR4 Up to 4x DDR4 DRAM SO-DIMM 3200 MT/s SO-DIMM 3200 MT/s 4266MT/s soldered ECC SO-DIMM 3200 MT/s ECC SO-DIMM 3200 MT/s 1x16 PCIe Gen 5 (PEG port) up to x8 PCIe Gen4 (PEG port) 64 GByte total PCI Express up to x8 PCIe Gen4 (PEG port) 64 GByte total IBECC 96 GByte total 128 GByte total up to 1 x4 PCIe Gen 4 2 x4 PCIe Gen4 IBECC 8 PCIe Gen3 up to 2 x4 PCIe Gen3 up to 8 PCIe Gen3 Chipset integrated in SOC RM590E | QM580E | HM570E USB 4x USB 3.2 Gen2 | 8x USB 2.0 2x USB 3.2 | 8x USB 2.0 up to 4x USB 3.2 | 8x USB 2.0 Ethernet 1x 2,5GbE TSN Ethernet 2x 2,5 GbE TSN Ethernet 1x 2.5 GbE TSN Ethernet 2x 2.5 GbE TSN Ethernet Other up to 2x Thunderbolt | 2x UART | 2x MiPi-CSI | 12x 2x UART | CAN (opt.) | GPIOs | SPI | LPC | SM Bus | 2x UART | 12x GPIO | eSPI | SM Bus | I²C Serial ATA 2x SATA III (6Gb/s) 4x SATA III (6Gb/s) 2x SATA III (6Gb/s) GPIO | eSPI | SM Bus | I²C | GSPI I²C | NVMex4 SSD (optional) PCI Express 4x PCIe Gen4 16x PCIe Gen4 20x PCIe Gen4 Sound 2x Soundwire | HDA | I2S (opt.) 2x Soundwire | 2x Soundwire or HDA or I2S (opt.) HDA 8x PCIe Gen3 8x PCIe Gen3 20x PCIe Gen3 Graphics Intel® UHD Graphics 770 with Xe Graphics up to Intel® Iris Xe Graphics Architecture | up to 96 Eus USB 2x USB 4.0 | 2x USB 3.2 Gen2 2x USB 4.0 | 2x USB 3.2 | 8x Architecture | up to 32 EU 4x USB 3.2 Gen2 | 8x USB 2.0 4x USB 3.1 Gen 2 | 8x USB 2.0 | 8x USB 2.0 USB 2.0 Video Interface 3x DDI | eDP 3x DDI | LVDS (optional eDP) | VGA (optional) 2x SATA III (6Gb/s) | SPI Other SPI | 2x UART | 8x GPIO eSPI | 2x UART | 12x GPIO congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics SPI | 2x UART | 8x GPIO 2x UART | 12x GPIO | LPC | I2C I2C | 4x MIPI-CSI I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection 8x MIPI-CSI Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS Mass Storage Optional onboard NVMe - - default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update SSD up to 1TB capacity Security Trusted Platform Module (TPM 2.0) Sound HDA interface 1x I2S | 2x Soundwire HDA interface 1x I2S | 2x Soundwire Power Managment ACPI 6.0 with battery support Integrated Xe (Gen 12) graphics engine with up to 32 EU Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 (Execution Units) | Supporting 4 independent display units Operating Systems Microsoft® Windows 11 | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto | Real-Time Systems Hypervisor Graphics independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 VDBox Temperature Operating Temperature: 0°C to +60°C | Storage: -20°C to +70°C Gen IPU6 with DPHY2.1 | HDMI 2.0/2.1 | DP 1.4 | Next Gen IPU6 (Image Processing Unit) with DPHY2.1 | DP 1.4 Humidity Operating: 10 .. 90°C r. H. non cond Storage: 5 - 95% r.H non cond. Video Interface 3x DP/DP++ | 1x eDP/LVDS Size 120 x 160 mm 120 x 95 mm 95 x 95 mm congatec Board Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics Controller I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux | Yocto | RTS Hypervisor Temperature Industrial: Operating Temperature: -40°C to +85°C Storage: -40°C to +85°C Commercial: Operating Temperature: 0°C to +60°C Storage: -20°C to +80° Humidity Operating: 10 .. 90°C r. H. non cond Storage: 5 - 95% r.H non cond.

© 2022 congatec GmbH. All rights reserved. conga, congatec, and XTX are registered trademarks of congatec GmbH. Intel, Pentium, Xeon, and Atom are trademarks of Intel Corporation in the U.S. and other countries. SMARC, Qseven, and SGET are registered trademarks of SGET e.V. AMD is a trademark of Advanced Micro Devices, Inc. COM Express and COM-HPC are registered trademarks of PICMG. PCI Express is a registered trademark of the Peripheral Component Interconnect Special Interest Group (PCISIG). Winbond is a registered trademark of the Winbond Electronics corps. AMICORE8 is a registered trademark of American Megatrends inc. Microsoft, Windows, Windows NT, Windows CE, and Windows XP® are registered trademarks of Microsoft corporation. VxWorks is a registered trademark of WindRiver. AMD and Fusion are registered trademarks of AMD. I.MX and NXP are registered trademarks of NXP, Inc. All product names and logos are property of the respective manufacturers. All data is for information purposes only. Although all the information contained within this document is carefully checked no guarantee of correctness is implied or expressed. 本社 congatec GmbH Auwiesenstraße 5 94469 Deggendorf Germany Phone +49 (991) 2700-0 info@congatec.com www.congatec.com 子会社 congatec Asia Ltd. congatec, Inc. コンガテックジャパン株式会社 congatec Korea Ltd. 2F., No.186, Sec. 3, 6262 Ferris Square congatec Japan K.K. leaders building #707, 42 Jangmi-ro, Bundan-gu, Chengde Rd. San Diego 〒105-0013 東京都 港区 浜松町1-2-7 Seongnam-si, Gyeonggi-do, 10366 Taipei, Taiwan CA 92121 USA 浜松町一丁目ビル301 13496 South Korea Phone +886 (2) 2597-8577 Phone +1 (858) 457-2600 Phone: +81 (3) 6435-9250 Phone: +82 (10) 2715-6418 sales-asia@congatec.com sales-us@congatec.com sales-jp@congatec.com ckr-sales@congatec.com www.congatec.tw www.congatec.us www.congatec.jp www.congatec.kr Real-Time Systems GmbH congatec Australia Pty Ltd. congatec China Technology Ltd. Gartenstrasse 33 Unit 2, 62 Township Drive Sunyoung Center, 901 Building B, 88212 Ravensburg West Burleigh No. 28 Xuanhua Road, Changning District, Germany Queensland 4219, Australia Shanghai 200050, China Phone +49 (751) 359558-0 Phone +61 (7) 5520-0841 Phone +86 (21) 6025-5862 info@real-time-systems.com sales-au@congatec.com sales-asia@congatec.com www.real-time-systems.com www.congatec.com www.congatec.cn