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COM Express Compact Type 6: conga-TC670 データシート

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COM Express Compact Type 6 モジュール

conga-TC670 は、第12世代インテル Core プロセッサ(以前のコードネームは Alder Lake)を搭載した、COM Express Compact Type 6 (95x95 mm) モジュールです。ハイブリッドアーキテクチャを搭載した新しいプロセッサは10種類(5〜14コア)から選択でき、2つのSODIMMソケットにより、最大64GBのDDR5メモリ(4800MT/s)を実装することができます。最大8 PCIe Gen 4、8 PCIe Gen 3、2.5 GbE TSNイーサネット、最大4x USB 3.2 Gen 2をサポートしています。専用のAIエンジンを搭載しており、Windows ML、インテルOpenVINOツールキット、およびChrome CrossMLをサポートしています。リアルタイムシステムズがサポートするハイパーバイザや、Linux、Windows、VxWorksなどを含む、すべての主要なRTOSに対して、包括的なボード・サポート・パッケージが提供されます。

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ドキュメント名 COM Express Compact Type 6: conga-TC670 データシート
ドキュメント種別 製品カタログ
ファイルサイズ 239.5Kb
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取り扱い企業 コンガテックジャパン株式会社 (この企業の取り扱いカタログ一覧)

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このカタログの内容

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conga-TC670 - Intel® hybrid design combines Performance- cores with Efficient–cores - Up to Intel® Iris® Xe Graphics architecture with up to 96 EUs - PCI Express Gen 4 | USB 3.2 - AI Acceleration with Intel® Deep Learning Boost (VNNI) - Embedded Use Condition SKUs Form factor COM Express® Compact | Type 6 connector pinout CPUs CPU TDP Target Cores count Processor P-cores E-cores Gfx Execution (P+E) Threads Freq. GHz Freq. GHz Units i7-12800HE 45W 14 (6+8) 20 2.4 / 4.6 1.8 / 3.5 96 i7-1270PE 28W 12 (4+8) 16 1.8/ 4.5 1.2 / 3.3 96 i7-1265UE 15W 10 (2+8) 12 1.7/ 4.7 1.2 / 3.5 96 i5-12600HE 45W 12 (4+8) 16 2.5 / 4.5 1.8 / 3.3 80 i5-1250PE 28W 12 (4+8) 16 1.7 / 4.4 1.2 / 3.2 80 i5-1245UE 15W 10 (2+8) 12 1.5 / 4.4 1.1 / 3.3 80 i3-12300HE 45W 8 (4+4) 12 1.9 / 4.3 1.5 /3.3 48 i3-1220PE 28W 8 (4+4) 12 1.5 / 4.2 1.1 / 3.1 48 i3-1215UE 15W 6 (2+4) 8 1.2 / 4.4 0.9 / 3.3 64 Celeron 7305E 15W 5 (1+4) 6 1.0 / - 0.9 / - 48 DRAM 2 SO-DIMM sockets for DDR5 memory modules up to 32 GByte each (max. 64 GByte system capacity) | up to 4800 MT/s Mass Storage NVMe x4 SSD (optional) Graphics Intel® UHD Graphics or Intel® Iris® Xe Graphics architecture | up to 96 EUs Display 3x DDI (up to 8K support) | LVDS (optional eDP) | VGA (optional) Ethernet 2.5 GbE TSN Ethernet (vial Intel® i225 LM) I/O Interfaces Up to 8 PCIe Gen4 PEG | 8 PCIe Gen3 | 8x USB (up to 4x USB 3.2, up to 8x USB 2.0) | up to 2x SATA | up to 2x UART | CAN (opt.) | GPIOs | SPI | LPC | SM Bus | I2C Audio HDA congatec Board controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update Security Trusted Platform Module (TPM 2.0) Power Management ACPI 6.0 with battery support Operating Systems Microsoft® Windows 11 | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto | Real Time Systems Hypervisor Temperature Operating.: 0°C … +60°C Storage.: -20°C … +70°C Humidity Operating.: 10% … 90% r. H. non cond. Storage.: 5% … 95% r. H. non cond. Size 95 x 95 mm www.congatec.com
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conga-TC670 Dual Channel DDR5 4800 MT/s COM Express 2x 220 pos 2x SO-DIMM Connector Type 6 USB 2.0 Port 0-7 USB 3.2 Port 0-3 PCIe PEG Port 0-7 PCIe Port 0-3 PCIe Port 4-5 12th Gen. Intel® MUX PCIe Port 6 Core™ SOC SATA Port 0 “Alder Lake-P” MUX PCIe Port 7 SATA Port 1 i225 PCIe 2.5 GBE/TSN Ethernet SML0 SDP DDI 1-3 MUX eDP to LVDS DDIA Bridge MUX LVDS/eDP Assembly option VGA DDIB Converter VGA Assembly option x4 PCIe NVME Assembly option HDA HD Audio SM Bus SM Bus MGMNT GPIO congatec I2C SML1 Board LID#/SLEEP# Controller FAN Control 5th Gen. SER0 CAN SER1/CAN Assembly option eSPI to LPC eSPI ECE1200 LPC SPI SPI TPM 2.0 SPI Flash www.congatec.com
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conga-TC670 Article PN Description COM Express Type 6 Compact module based on Intel® Core™ i7-12800HE processor conga-TC670/i7-12800HE 049700 with 6 P-cores 2.4GHz up to 4.6GHz and 8 E-cores 1.8GHz up to 3.5GHz | 24MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (H-Series) COM Express Type 6 Compact module based on Intel® Core™ i7-1270PE processor with conga-TC670/i7-1270PE 049701 4 P-cores 1.8GHz up to 4.5GHz and 8 E-cores 1.2GHz up to 3.3GHz | 18MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (P-Series) COM Express Type 6 Compact module based on Intel® Core™ i7-1265UE processor with conga-TC670/i7-1265UE 049702 2 P-cores 1.7GHz up to 4.7GHz and 8 E-cores 1.2GHz up to 3.5GHz | 12MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (U-Series) COM Express Type 6 Compact module based on Intel® Core™ i5-12600HE processor conga-TC670/i5-12600HE 049703 with 4 P-cores 2.5GHz up to 4.5GHz and 8 E-cores 1.8GHz up to 3.3GHz | 18MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 80EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (H-Series) COM Express Type 6 Compact module based on Intel® Core™ i5-1250PE processor with conga-TC670/i5-1250PE 049704 4 P-cores 1.7GHz up to 4.4GHz and 8 E-cores 1.2GHz up to 3.2GHz | 12MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 80EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (P-Series) COM Express Type 6 Compact module based on Intel® Core™ i5-1245UE processor with conga-TC670/i5-1245UE 049705 2 P-cores 1.5GHz up to 4.4GHz and 8 E-cores 1.1GHz up to 3.3GHz | 12MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 80 EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (U-Series) COM Express Type 6 Compact module based on Intel® Core™ i3-12300HE processor conga-TC670/i3-12300HE 049706 with 4 P-cores 1.9GHz up to 4.3GHz and 4 E-cores 1.5GHz up to 3.3GHz | 12MB Intel® Smart Cache | Intel® UHD Graphics with 48EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (H-Series) COM Express Type 6 Compact module based on Intel® Core™ i3-1220PE processor with conga-TC670/i3-1220PE 049707 4 P-cores 1.5GHz up to 4.2GHz and 4 E-cores 1.1GHz up to 3.1GHz | 12MB Intel® Smart Cache | Intel® UHD Graphics with 48EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (P-Series) COM Express Type 6 Compact module based on Intel® Core™ i3-1215UE processor with conga-TC670/i3-1215UE 049708 2 P-cores 1.2GHz up to 4.4GHz and 4 E-cores 0.9GHz up to 3.3GHz | 10MB Intel® Smart Cache | Intel® UHD Graphics with 64EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (U-Series) COM Express Type 6 Compact module based on Intel® Celeron® 7305E processor with 1 conga-TC670/7305E 049709 P-core 1.0GHz and 4 E-cores 0.9GHz | 8MB Intel® Smart Cache | Intel® UHD Graphics with 48EUs | Dual channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (U-Series) www.congatec.com
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conga-TC670 Article PN Description Standard active cooling solution for high performance COM Express module conga- conga-TC670/CSA-HP-B 049750 TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. Standard active cooling solution for high performance COM Express module conga- conga-TC670/CSA-HP-T 049751 TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded. Standard passive cooling solution for high performance COM Express module conga- conga-TC670/CSP-HP-B 049752 TC670 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole. conga-TC670/CSP-HP-T 049753 Standard passive cooling solution for high performance COM Express module conga- TC670 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded. conga-TC670/HSP-HP-B 049754 Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. conga-TC670/HSP-HP-T 049755 Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. conga-TEVAL2 065810 Evaluation Carrier Board for COM Express Type 6 modules © 2022 congatec GmbH. All data is for information purposes only. Although all the information contained within this document is All rights reserved. carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Preliminary Revision 1.1 – June 8th 2022 www.congatec.com