TE zSFP+(SFP28)｜BtoB & I/Oコネクタ製品群

zSFP+ (SFP28) 28 GBPS PLUGGABLE I/O INTERCONNECT The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28 Gbps with possible expansion to 40 Gbps. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is hot-swappable with existing SFP+ connectors for fast system upgrades of 28-40Gbps. Alternatively, users can design-in the zSFP+ connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm cost savings as this would eliminate the need to fully redesign for higher performance. The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire product family is offered as a dual source option with Molex. LLC. DATA AND DEVICES /// zSFP+ 28 GBPS I/O INTERCONNECT

zSFP+ 28 Gbps Pluggable I/O Interconnect FEATURES • Data rates: 28 Gbps (with possible expansion to 40 Gbps), 10 Gbps Ethernet and 16 Gbps Fibre Channel • Surface-mount connector design for single high 1xN cages Light pipe options include: • Press-fit 1xN cages and stacked assemblies (connector and cage) for one-step, easy PCB placement No light pipes • Coupled, narrow-edged, blanked- and formed-contact beam geometry and insert molding for superior signal integrity, All 4 light pipes (shown left) mechanical and electrical performance Inner light pipes • Backwards-compatibility: Shares same mating interface and cage dimensions with the SFP+ connector (connector/single Outer light pipes [standard] high cages are also PCB footprint-compatible) • Elastomeric gasket or spring finger options for EMI Three light pipes containment Outer light pipes [reversed] • Single high cages (1xN) for design flexibility; accommodates belly-to-belly applications for increased density and PCB space savings; available in 1x1, 1x2, 1x4 or 1x6 port configurations • Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12 port • Heat sinks, LEDs and plating choices offered • Additional light pipe configurations available APPLICATIONS • Telecommunications: Cellular infrastructure, central office uplink equipment, optical transport equipment, switches/ routers, access equipment (CMTS, PON, DSL, etc) • Data Center: Data center switches and routers, servers, storage • Medical: Medical diagnostic equipment • Networking: Network interface, switches, routers • Test and Measurement Equipment 20-Pin Surface-Mount Connector Electrical • Voltage (max.): 120V AC • Current (max.): 0.5A • Dielectric Withstanding Voltage: 300V AC between contacts Mechanical • Mating Force: 25N • Unmating Force: 11.5N • Durability (min.): 250 cycles Physical • High-temperature thermoplastic housing (glass-filled, UL 94V-0 black) • High-performance copper alloy contacts • Plating: - Nickel underplating; Tin plating on solder tail area; Gold plating on mating area - Plating options: 15 and 30μ” Gold or Palladium Nickel • Operating Temperature: -40 to +85oC DATA AND DEVICES /// zSFP+ 28 GBPS I/O INTERCONNECT PAGE 2

zSFP+ 28 Gbps Pluggable I/O Interconnect Connector P/N Description 2170088-1 30μ” in Au or Au Flash Over PdNi 2170088-2 15μ” in Au or Au Flash Over PdNi Cages with Elastomeric Gaskets EMI Light Pipe Suppression Option 1X1 1X2 1X4 1X6 1X8 No 2198709-1* 2198720-1 2198722-1 2198724-1 TBD** EMI gasket Yes 2198708-1* 2198719-1 2198721-1 2198723-1 TBD** Cages with EMI Springs EMI Light Pipe Heat Sink Suppression Option Option 1X1 1X2 1X4 1X6 1X8 2274001-1 2304921-1 No No 2227728-1 2227730-1 2227732-1 EMI Spring 2291579-1 (PCI) 2295325-6 Fingers Yes No 2274000-1 2227727-1 2227729-1 2227731-1 TBD** Yes Yes TBD* TBD** 2304342-X 2293156-X 2294408-X *Tooling in process **Not yet tooled, but planned Ganged 1xN Cages Mechanical • Transceiver insertion force (max.): 34 N without heat sink and clip; Physical 45.37 N with heat sink and clip • Cage material: Nickel Silver • Transceiver extraction force (max.): 12.5 N without heat sink and • PCB thickness (min.): 1.50mm in single sided clip; 14.36 N with heat sink and clip applications; 2.25mm (EMI springs) or 3.0mm • SFP+ module to surface-mount connector and zSFP+ cage. (elastomeric gasket) in belly-to-belly applica- tions • Cage press fit insertion force (max.): 44.5 N for single port cage, o 54.3 N for ganged cage • Operating Temperature: -40 to +85 C • Cage press fit extraction force (min.): 8.9 N for single port and ganged cages • Durability (min.): 100 cycles Ganged SFP+ 1x4 vs. zSFP+ 1x4 0 -10 -20 -30 -40 Ganged SFP+ 1x4 — -50 Ganged zSFP+ 1x4 — -60 -70 -80 0 5 10 15 20 25 30 GHz DATA AND DEVICES /// zSFP+ 28 GBPS I/O INTERCONNECT PAGE 3 Radiated source RF leakage (dB)

zSFP+ 28 Gbps Pluggable I/O Interconnect Stacked 2xN Assemblies Electrical Stacked SFP+ vs. zSFP+ 0 • Voltage (max.): 120V AC • Current (max.): 0.5A -10 • Dielectric Withstanding Voltage: 300V AC between contacts -20 -30 Mechanical • Durability (min.): 100 cycles -40 Physical -50 Stacked SFP+ — • Cage material: Nickel Silver -60 Stacked zSFP+ — - High-temperature thermoplastic housing (glass-filled, UL 94V-0 black) -70 - High-performance copper alloy contacts -80 - Plating: Nickel underplating; Tin plating on solder tail area; 30μ” Gold plating on 0 5 10 15 20 25 30 mating area GHz • PCB thickness (min.): 1.57mm • Operating Temperature: -40 to +85oC Upper contact row — Lower contact row — EMI Performance Light Pipe 2x1 2x2 2x4 2x6 2x8 2x12 Suppression Configuration 2198318-(x) 2198325-(x) 2180324-(x) 2198339-(x) 2198346-(x) 2288172-(x) None 2198318-1 2198325-1 2180324-1 2198339-1 2198346-1 2288172-1 All 4 2198318-2 2198325-2 2180324-2 2198339-2 2198346-2 2288172-2 Inner 2198318-3 2198325-3 2180324-3 2198339-3 2198346-3 2288172-3 Standard Outer 2198318-4 2198325-4 2180324-4 2198339-4 2198346-4 2288172-4 3 1-2198318-7 1-2198325-7 1-2180324-7 1-2198339-7 1-2198346-7 1-2288172-7 Outer (reversed) 1-2198318-8 1-2198325-8 1-2180324-8 1-2198339-8 1-2198346-8 1-2288172-8 Thermally Multiple -- -- 3-2180324-0 -- -- 2227838-8 Enhanced None 2198318-5 2198325-5 2180324-5 2198339-5 2198346-5 2288172-5 All 4 2198318-6 2198325-6 2180324-6 2198339-6 2198346-6 2288172-6 Inner 2198318-7 2198325-7 2180324-7 2198339-7 2198346-7 2288172-7 Standard Outer 2198318-8 2198325-8 2180324-8 2198339-8 2198346-8 2288172-8 3 1-2198318-9 1-2198325-9 1-2180324-9 1-2198339-9 1-2198346-9 1-2288172-9 Outer (reversed) 2-2198318-0 2-2198325-0 2-2180324-0 2-2198339-0 2-2198346-0 2-2288172-0 Thermally 2227838-7 Multiple -- -- 3-2180324-1 2291491-1 -- Enhanced 2301210-2 DATA AND DEVICES /// zSFP+ 28 GBPS I/O INTERCONNECT PAGE 4 EMI spring fingers EMI gasket Radiated source RF leakage (dB)

zSFP+ 28 Gbps Pluggable I/O Interconnect SFP28 Passive Copper Cable Assemblies Our SFP28 passive copper cable assembly features two differential copper pairs, providing one data transmission channel at speeds up to 28 Gbps per channel that meets 25G Ethernet performance requirements. Offered in a broad range of wire gages – from 30AWG through 33AWG – this next generation copper cable assembly features low insertion loss and low cross talk. Our SFP28 assemblies share the same mating interface with SFP+ form factors, making them backward compatible with existing SFP+ I/O ports. SFP28 cable assemblies can be used with legacy 10G Ethernet and 16G Fibre Channel applications with substantial signal integrity margin. In addition to SFP28 straight cables, we offer break out assemblies with a 100G QSFP28 module on one end splitting to four SFP28 modules on the opposite end of the assembly. In-line signal integrity (SI) based production testing ensures that each cable assembly meets the electrical performance requirements of the applicable industry standard specification. Features and Benefits • Compatible with IEEE 802.3by and Fibre Channel industry standards • Supports single lane data rate up to 28Gbps • Optimized construction to minimize insertion loss and cross talk • Customized cable braid termination limits EMI radiation • Backward compatible with existing SFP+ form factor connectors and cages • Pull-to-release latch design • 30AWG through 33AWG cable • Straight and breakout cable assembly configurations available SFP28 to SFP28 Straight Cable Assembly • Customizable EEPROM mapping for cable signature • RoHS compliant Industry Standards • 25G Ethernet (IEEE 802.3by) • Fibre Channel • SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28) • SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28) QSFP28 to 4x SFP28 Breakout Cable Assembly Part Number Detail Dash to Length (meters) Base Part Number Description AWG 0.5 1 1.5 2 3 4 5 2821262 SFP28 to SFP28 Straight 33 -1 -2 -3 -4 2821222 Assembly 30 -5 -3 -2 -1 QSFP28 to 4x SFP28 33 -8 2821033 Breakout Assembly 30 -1 -10 -2 Contact your TE Representative for customized lengths and breakouts. DATA AND DEVICES /// zSFP+ 28 GBPS I/O INTERCONNECT PAGE 5

For More Information te.com/products/zsfp+ TE Technical Support Center USA: +1 (800) 522-6752 Canada: +1 (905) 475-6222 Mexico +52 (0) 55-1106-0800 Latin/S. America: +54 (0) 11-4733-2200 Germany: +49 (0) 6251-133-1999 UK: +44 (0) 800-267666 France: +33 (0) 1-3420-8686 Netherlands: +31 (0) 73-6246-999 China: +86 (0) 400-820-6015 Part numbers in this brochure are RoHS Compliant*, unless marked otherwise. *as defined www.te.com/leadfree te.com © 2017 TE Connectivity Ltd. family of companies. All Rights Reserved. 1-1773707-6 DND PDF 10/17 TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. zSFP+ is a part of the ZXP® family of connectors and uses the ZXP technology. ZXP is a registered trademark of Molex LLC. Other logos, product and company names mentioned herein may be trademarks of their respective owners. While TE has made every reasonable effort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. The dimensions in this brochure are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications. DATA AND DEVICES /// zSFP+ 28 GBPS I/O INTERCONNECT